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    • 11. 发明申请
    • EEPROM device and method of fabricating the same
    • EEPROM装置及其制造方法
    • US20050001260A1
    • 2005-01-06
    • US10872858
    • 2004-06-21
    • Weon-Ho ParkHyun-Khe Yoo
    • Weon-Ho ParkHyun-Khe Yoo
    • H01L21/8247H01L27/115H01L29/423H01L29/788H01L29/792
    • H01L27/11521H01L27/115H01L27/11524H01L29/42324
    • A memory device comprises a semiconductor substrate of a first conductive type, a memory transistor, a select transistor, a floating junction region, a common source region, and a bit line junction region. The memory transistor positions on the semiconductor substrate and comprises a gate insulating film formed on the semiconductor substrate and a memory transistor gate formed on the gate insulating film. The gate insulating film includes a tunnel insulating film. The select transistor positions on the semiconductor substrate and is separated from the memory transistor gate. The select transistor comprises a gate insulating film formed on the semiconductor substrate and a select transistor gate formed on the gate insulating film. A floating junction region is formed of a second conductive type on the semiconductor substrate below the tunnel insulating film. The common source region of a second conductive type is formed on the semiconductor substrate adjacent to the memory transistor gate and separated from the floating junction region. A bit line junction region of a second conductive type is formed on the semiconductor substrate adjacent to the select transistor gate and is separated from the floating junction region, wherein the common source region includes a single junction region with a first doping concentration, and a depth of the common source region is shallower than a depth of the floating junction region and the bit line junction region.
    • 存储器件包括第一导电类型的半导体衬底,存储晶体管,选择晶体管,浮动结区域,公共源极区域和位线结区域。 存储晶体管位于半导体衬底上并且包括形成在半导体衬底上的栅极绝缘膜和形成在栅极绝缘膜上的存储晶体管栅极。 栅极绝缘膜包括隧道绝缘膜。 选择晶体管位于半导体衬底上并与存储晶体管栅极分离。 选择晶体管包括形成在半导体衬底上的栅极绝缘膜和形成在栅极绝缘膜上的选择晶体管栅极。 在隧道绝缘膜下方的半导体衬底上,由第二导电类型形成浮接区。 第二导电类型的公共源极区域形成在与存储晶体管栅极相邻并且与浮置结区域分离的半导体衬底上。 第二导电类型的位线结区域形成在与选择晶体管栅极相邻的半导体衬底上,并与浮置结区域分离,其中公共源极区域包括具有第一掺杂浓度的单结区域和深度 公共源极区域比浮置结区域和位线结区域的深度浅。
    • 16. 发明申请
    • EEPROM device and method of fabricating the same
    • EEPROM装置及其制造方法
    • US20060199334A1
    • 2006-09-07
    • US11418425
    • 2006-05-04
    • Weon-Ho ParkHyun-Khe Yoo
    • Weon-Ho ParkHyun-Khe Yoo
    • H01L21/336
    • H01L27/11521H01L27/115H01L27/11524H01L29/42324
    • A memory device comprises a semiconductor substrate of a first conductive type, a memory transistor, a select transistor, a floating junction region, a common source region, and a bit line junction region. The memory transistor positions on the semiconductor substrate and comprises a gate insulating film formed on the semiconductor substrate and a memory transistor gate formed on the gate insulating film. The gate insulating film includes a tunnel insulating film. The select transistor positions on the semiconductor substrate and is separated from the memory transistor gate. The select transistor comprises a gate insulating film formed on the semiconductor substrate and a select transistor gate formed on the gate insulating film. A floating junction region is formed of a second conductive type on the semiconductor substrate below the tunnel insulating film. The common source region of a second conductive type is formed on the semiconductor substrate adjacent to the memory transistor gate and separated from the floating junction region. A bit line junction region of a second conductive type is formed on the semiconductor substrate adjacent to the select transistor gate and is separated from the floating junction region, wherein the common source region includes a single junction region with a first doping concentration, and a depth of the common source region is shallower than a depth of the floating junction region and the bit line junction region.
    • 存储器件包括第一导电类型的半导体衬底,存储晶体管,选择晶体管,浮动结区域,公共源极区域和位线结区域。 存储晶体管位于半导体衬底上并且包括形成在半导体衬底上的栅极绝缘膜和形成在栅极绝缘膜上的存储晶体管栅极。 栅极绝缘膜包括隧道绝缘膜。 选择晶体管位于半导体衬底上并与存储晶体管栅极分离。 选择晶体管包括形成在半导体衬底上的栅极绝缘膜和形成在栅极绝缘膜上的选择晶体管栅极。 在隧道绝缘膜下方的半导体衬底上,由第二导电类型形成浮接区。 第二导电类型的公共源极区域形成在与存储晶体管栅极相邻并且与浮置结区域分离的半导体衬底上。 第二导电类型的位线结区域形成在与选择晶体管栅极相邻的半导体衬底上,并与浮置结区域分离,其中公共源极区域包括具有第一掺杂浓度的单结区域和深度 公共源极区域比浮置结区域和位线结区域的深度浅。
    • 20. 发明授权
    • EEPROM memory cell and method of forming the same
    • EEPROM存储单元及其形成方法
    • US06916711B2
    • 2005-07-12
    • US10819515
    • 2004-04-07
    • Hyun-Khe Yoo
    • Hyun-Khe Yoo
    • H01L27/115H01L21/28H01L21/8247H01L29/423H01L29/788H01L21/336
    • H01L29/7883H01L21/28273H01L29/42324
    • An EEPROM memory cell and a method of forming the same are provided. A portion of a floating gate is formed on walls of a trench formed on the substrate. An inside of the trench is filled with a gate electrode layer constituting a sensing line. This leads to increases in opposite areas of a floating gate and a control gate of a sensing transistor, and a decrease in an area of the floating gate in the substrate. The method of forming an EEPROM memory cell comprises forming a trench in an active area in which a sensing transistor of the substrate will be formed; forming a gate insulation layer including a tunneling insulation layer on an entire surface of the substrate including an inside of the trench; conformally forming a first conductive layer covering the inside of the trench after forming the gate insulation layer; conformally forming a dielectric layer on the first conductive layer; forming a floating gate by patterning the first conductive layer; and stacking and patterning a second conductive layer on the dielectric layer to form a word line and a sensing line.
    • 提供了EEPROM存储单元及其形成方法。 浮动栅极的一部分形成在形成在衬底上的沟槽的壁上。 沟槽的内部填充有构成感测线的栅极电极层。 这导致感测晶体管的浮置栅极和控制栅极的相对区域的增加以及衬底中浮置栅极的面积的减小。 形成EEPROM存储单元的方法包括:在有源区中形成沟槽,在有源区中将形成衬底的感测晶体管; 在包括所述沟槽的内部的所述衬底的整个表面上形成包括隧道绝缘层的栅极绝缘层; 在形成栅极绝缘层之后,保形地形成覆盖沟槽内部的第一导电层; 在第一导电层上共形成介电层; 通过图案化第一导电层形成浮栅; 并且在介电层上堆叠和图案化第二导电层以形成字线和感测线。