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    • 12. 发明授权
    • Fabricating method of a multiple micro-tip field emission device using
selective etching of an adhesion layer
    • 使用选择性蚀刻粘附层的多微尖端场致发射器件的制造方法
    • US5662815A
    • 1997-09-02
    • US509459
    • 1995-07-31
    • Jong-min Kim
    • Jong-min Kim
    • H01J9/02H01J1/30H01J1/304
    • H01J1/3042H01J2329/00
    • A multiple micro-tip field emission device is fabricated by forming a titanium adhesion layer under a striped tungsten cathode, etching the tungsten cathode radially using an aluminum mask and selectively etching the titanium adhesion layer, so that multiple micro-tips are formed due to the intrinsic internal stress of the tungsten itself. Thereby, the adjustment of the tip size is optionally available during the process and has excellent reproducibility since the process uses the intrinsic internal stress of the tungsten and the characteristic of a buffered oxide etching (BOE) method. Also, the output current can be controlled in a wide range from nA to mA because of the multiple micro-tips. By forming the tips with tungsten, the device has good strength, oxidation characteristics and work function and has good electrical, chemical and mechanical endurance.
    • 通过在条状钨阴极下形成钛粘合层,使用铝掩模径向蚀刻钨阴极并选择性地蚀刻钛粘合层来制造多微尖端场致发射器件,从而由于形成多个微尖端 钨本身的内在内应力。 因此,由于该工艺使用钨的本征内应力和缓冲氧化物蚀刻(BOE)方法的特性,因此在工艺期间可选地调整尖端尺寸并且具有优异的再现性。 此外,由于多个微尖端,输出电流可以在从nA到mA的宽范围内控制。 通过钨形成尖端,该装置具有良好的强度,氧化特性和作用功能,具有良好的电气,化学和机械耐久性。
    • 13. 发明授权
    • Field emission micro-tip
    • 场发射微尖
    • US5631519A
    • 1997-05-20
    • US509057
    • 1995-07-31
    • Jong-min Kim
    • Jong-min Kim
    • H01J1/30H01J1/304H01J3/02H01J9/02H01J1/02
    • H01J9/025H01J3/022
    • A field emission device has a rear substrate (11), a titanium or aluminum adhesive layer (12) and disposed on the substrate (11), a tungsten cathode (13) disposed on the adhesive layer (12), a micro-tip (13') protruding from the cathode (13), a titanium or aluminum mask layer (14) disposed on the cathode (13), and a metal pattern (15) formed on the mask layer (14) for supporting the cathode (13). The micro-tip (13') is formed by the simultaneous etching of the tungsten cathode (13), the adhesive layer (12), and the mask layer (14') resulting in a large internal stress in the micro-tip (13'). The residual internal stress in the micro-tip (13') results in the micro-tip (13') curving away from the substrate (11) which, consequently, facilitates electron emission.
    • 场发射器件具有后衬底(11),钛或铝粘合剂层(12)并设置在衬底(11)上,设置在粘合剂层(12)上的钨阴极(13),微尖端 13),设置在阴极(13)上的钛或铝掩模层(14)和形成在用于支撑阴极(13)的掩模层(14)上的金属图案(15) 。 微尖端(13')通过钨阴极(13),粘合剂层(12)和掩模层(14')的同时蚀刻而形成,从而在微尖端(13)中产生大的内应力 ')。 微尖端(13')中的残余内部应力导致微尖端(13')远离衬底(11)弯曲,因此有助于电子发射。
    • 14. 发明授权
    • Field emission device
    • 场发射装置
    • US5614795A
    • 1997-03-25
    • US509059
    • 1995-07-31
    • Jong-min Kim
    • Jong-min Kim
    • H01J9/02H01J1/30H01J1/304H01J1/02H01J63/02
    • H01J1/3042
    • A field emission device has a rear substrate (11), a titanium adhesive layer (12) having a striped pattern and disposed on the inner surface of the substrate (11), a tungsten cathode (13) disposed on the adhesive layer (12), a micro-tip (13') protruding from the cathode (13), an aluminum mask layer (14') having a striped pattern and disposed on the cathode (13), an insulating layer (15) having a striped pattern and disposed on the mask layer (14'), a gate (18) having a striped pattern and disposed on the insulating layer (15), and an anode (16) having a striped pattern perpendicular to the striped of the cathode (13) and disposed on a front substrate (19). The micro-tip (13') is formed by simultaneous etching of the tungsten cathode (13), the titanium adhesive layer (12), and the upper aluminum mask (14') resulting in a large internal stress in the micro-tip (13'). The residual internal stress in the micro-tip (13') results in the micro-tip (13') curving toward the anode (16) which, consequently, facilitates electron emission.
    • 场发射装置具有后基板(11),具有条纹图案并设置在基板(11)的内表面上的钛粘合剂层(12),设置在粘合层(12)上的钨阴极(13) ,从阴极(13)突出的微尖端(13'),具有条纹图案并设置在阴极(13)上的铝掩模层(14'),具有条纹图案的绝缘层(15) 在所述掩模层(14')上,具有条纹图案并设置在所述绝缘层(15)上的栅极(18)和具有垂直于所述阴极(13)条纹的条纹图案的阳极(16) 在前基板(19)上。 微尖端(13')通过钨阴极(13),钛粘合剂层(12)和上铝掩模(14')的同时蚀刻而形成,导致微尖端内部应力较大 13')。 微尖端(13')中的残余内部应力导致朝向阳极(16)弯曲的微尖端(13'),从而有助于电子发射。
    • 16. 发明授权
    • Electromagnetic wave transmission filters and electromagnetic cameras including the same
    • 电磁波传输滤波器和电磁相机包括相同
    • US08421013B2
    • 2013-04-16
    • US12659176
    • 2010-02-26
    • Chan-wook BaikSeung-ho BakJong-min KimGun-sik Park
    • Chan-wook BaikSeung-ho BakJong-min KimGun-sik Park
    • G01J1/00
    • H01Q15/006
    • An electromagnetic wave transmission filter may include a substrate and one or more coils. The one or more coils may be at least partly disposed in an opening through the substrate. An electromagnetic camera may include an electromagnetic wave detector array, including a plurality of detector cells for detecting electromagnetic waves, and an electromagnetic wave transmission filter disposed in front of the electromagnetic wave detector array to provide each of the detector cells with an electromagnetic wave of a certain wavelength. The electromagnetic wave transmission filter may includes a substrate and a plurality of coils. At least one of the plurality of coils may be at least partly disposed in each of a plurality of openings through the substrate.
    • 电磁波传输滤波器可以包括基板和一个或多个线圈。 一个或多个线圈可以至少部分地设置在通过基板的开口中。 电磁摄像机可以包括电磁波检测器阵列,其包括用于检测电磁波的多个检测器单元,以及设置在电磁波检测器阵列之前的电磁波传输滤波器,以向每个检测器单元提供电磁波 一定的波长。 电磁波传输滤波器可以包括基板和多个线圈。 多个线圈中的至少一个可以至少部分地设置在穿过基底的多个开口中的每一个中。