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11. 发明申请

US20110097892A1 Sprocket Opening Alignment Process and Apparatus for Multilayer Solder Decal 失效
标题翻译：用于多层焊料贴花的链轮开口对准工艺和装置
公开(公告)号：US20110097892A1
公开(公告)日：2011-04-28
申请号：US12983292
申请日：2011-01-01
申请人： Stephen L. Buchwalter , Peter A. Gruber , Jae-Woong Nah , Da-Yuan Shih
发明人： Stephen L. Buchwalter , Peter A. Gruber , Jae-Woong Nah , Da-Yuan Shih
IPC分类号： H01L21/44
CPC分类号： H01L24/11 , H01L24/13 , H01L24/742 , H01L2224/0401 , H01L2224/05571 , H01L2224/11003 , H01L2224/1111 , H01L2224/1131 , H01L2224/11849 , H01L2224/131 , H01L2924/0002 , H01L2924/14 , Y10T29/49149 , H01L2924/00012 , H01L2924/014 , H01L2224/05552
摘要： A process for aligning at least two layers in an abutting relationship with each other comprises forming a plurality of sprocket openings in each of the layers for receiving a sprocket of diminishing diameters as the sprocket extends outwardly from a base, with the center axes of the sprocket openings in each layer being substantially alignable with one another, the diameter of the sprocket openings in an abutting layer for first receiving the sprocket being greater than the diameter of the sprocket openings in an abutted layer. This is followed by forming a plurality of reservoir openings in each of at least two of the layers and positioning the sprocket openings in the layers to correspond with one another and the reservoir openings in the layers to correspond with one another so that substantial alignment of the center axes of the corresponding sprocket openings in the layers effects substantial alignment of the center axes of the corresponding reservoir openings in the layers. Engaging the sprocket openings with the sprocket by inserting the end of the sprocket having the smallest diameter into the sprocket openings having the largest diameter in the layers and continuing through to the sprocket opening having the smallest diameter in the layers effects substantial alignment of the center axes of the corresponding sprocket openings and substantial alignment of the center axes of the corresponding reservoir openings in the layers. The invention also comprises apparatus for performing this process.
摘要翻译：用于将至少两个彼此邻接的层对准的方法包括在每个层中形成多个链轮开口，用于当链轮从基座向外延伸时接收链轮直径减小的链轮，链轮的中心轴线每个层中的开口基本上彼此对准，用于首先接收链轮的邻接层中的链轮开口的直径大于邻接层中链轮开口的直径。随后在至少两个层中的每一个中形成多个储存器开口，并且将链轮开口定位在层中以彼此对应并且层中的储存器开口彼此对应，使得层中对应的链轮开口的中心轴线对层中对应的储存器开口的中心轴进行实质上的对准。通过将具有最小直径的链轮的端部插入到具有最大直径的链轮的链轮开口中并且连续到具有最小直径的链轮开口，使链轮开口与链轮接合，使得中心轴线的对应的链轮开口和相应的储存器开口的中心轴线在层中的基本对准。本发明还包括用于执行该过程的装置。

12. 发明授权

US08268719B2 Sprocket opening alignment process and apparatus for multilayer solder decal 失效
标题翻译：用于多层焊料贴花的链轮开口对准工艺和装置
公开(公告)号：US08268719B2
公开(公告)日：2012-09-18
申请号：US12983292
申请日：2011-01-01
申请人： Stephen L. Buchwalter , Peter A. Gruber , Jae-Woong Nah , Da-Yuan Shih
发明人： Stephen L. Buchwalter , Peter A. Gruber , Jae-Woong Nah , Da-Yuan Shih
IPC分类号： H01L21/44
CPC分类号： H01L24/11 , H01L24/13 , H01L24/742 , H01L2224/0401 , H01L2224/05571 , H01L2224/11003 , H01L2224/1111 , H01L2224/1131 , H01L2224/11849 , H01L2224/131 , H01L2924/0002 , H01L2924/14 , Y10T29/49149 , H01L2924/00012 , H01L2924/014 , H01L2224/05552
摘要： A process for aligning at least two layers in an abutting relationship with each other comprises forming a plurality of sprocket openings in each of the layers for receiving a sprocket of diminishing diameters as the sprocket extends outwardly from a base, with the center axes of the sprocket openings in each layer being substantially alignable with one another, the diameter of the sprocket openings in an abutting layer for first receiving the sprocket being greater than the diameter of the sprocket openings in an abutted layer. This is followed by forming a plurality of reservoir openings in each of at least two of the layers and positioning the sprocket openings in the layers to correspond with one another and the reservoir openings in the layers to correspond with one another so that substantial alignment of the center axes of the corresponding sprocket openings in the layers effects substantial alignment of the center axes of the corresponding reservoir openings in the layers. Engaging the sprocket openings with the sprocket by inserting the end of the sprocket having the smallest diameter into the sprocket openings having the largest diameter in the layers and continuing through to the sprocket opening having the smallest diameter in the layers effects substantial alignment of the center axes of the corresponding sprocket openings and substantial alignment of the center axes of the corresponding reservoir openings in the layers. The invention also comprises apparatus for performing this process.
摘要翻译：用于将至少两个彼此邻接的层对准的方法包括在每个层中形成多个链轮开口，用于当链轮从基座向外延伸时接收链轮直径减小的链轮，链轮的中心轴线每个层中的开口基本上彼此对准，用于首先接收链轮的邻接层中的链轮开口的直径大于邻接层中链轮开口的直径。随后在至少两个层中的每一个中形成多个储存器开口，并且将链轮开口定位在层中以彼此对应并且层中的储存器开口彼此对应，使得层中对应的链轮开口的中心轴线对层中对应的储存器开口的中心轴进行实质上的对准。通过将具有最小直径的链轮的端部插入到具有最大直径的链轮的链轮开口中并且连续到具有最小直径的链轮开口，使链轮开口与链轮接合，使得中心轴线的对应的链轮开口和相应的储存器开口的中心轴线在层中的基本对准。本发明还包括用于执行该过程的装置。

13. 发明申请

US20090181223A1 METHOD OF FABRICATING SOLDER BUMPS 有权
标题翻译：制造焊膏的方法
公开(公告)号：US20090181223A1
公开(公告)日：2009-07-16
申请号：US12015447
申请日：2008-01-16
申请人： Stephen L. Buchwalter , Peter A. Gruber , Jae-Woong Nah , Da-Yuan Shih
发明人： Stephen L. Buchwalter , Peter A. Gruber , Jae-Woong Nah , Da-Yuan Shih
IPC分类号： B23K31/02 , B32B3/10
CPC分类号： B23K1/0016 , B23K1/19 , B23K35/262 , B23K35/3013 , B23K2101/36 , H01L24/11 , H01L2224/05001 , H01L2224/05027 , H01L2224/0508 , H01L2224/05124 , H01L2224/05147 , H01L2224/05572 , H01L2224/056 , H01L2224/11003 , H01L2224/1111 , H01L2924/01322 , Y10T428/24826 , Y10T428/24942 , H01L2924/00 , H01L2924/00014
摘要： A semiconductor solder bump structure having a solder bump with at least a first solder and a second solder attached to the first solder, producing one solder bump having at least two different solders with different melting temperatures. A method of fabricating the solder is included.
摘要翻译：一种半导体焊料凸块结构，具有至少具有第一焊料的焊料凸块和附着到第一焊料的第二焊料，产生具有不同熔融温度的至少两种不同焊料的一个焊料凸块。包括制造焊料的方法。

14. 发明申请

US20090093111A1 SPROCKET OPENING ALIGNMENT PROCESS AND APPARATUS FOR MULTILAYER SOLDER DECAL 失效
标题翻译： SPROCKET打开对齐过程以及多层焊锡膏的设备
公开(公告)号：US20090093111A1
公开(公告)日：2009-04-09
申请号：US11869573
申请日：2007-10-09
申请人： Stephen L. Buchwalter , Peter A. Gruber , Jae-Woong Nah , Da-Yuan Shih
发明人： Stephen L. Buchwalter , Peter A. Gruber , Jae-Woong Nah , Da-Yuan Shih
IPC分类号： H01L21/44 , B23K1/00
CPC分类号： H01L24/11 , H01L24/13 , H01L24/742 , H01L2224/0401 , H01L2224/05571 , H01L2224/11003 , H01L2224/1111 , H01L2224/1131 , H01L2224/11849 , H01L2224/131 , H01L2924/0002 , H01L2924/14 , Y10T29/49149 , H01L2924/00012 , H01L2924/014 , H01L2224/05552
摘要： A process for aligning at least two layers in an abutting relationship with each other comprises forming a plurality of sprocket openings in each of the layers for receiving a sprocket of diminishing diameters as the sprocket extends outwardly from a base, with the center axes of the sprocket openings in each layer being substantially alignable with one another, the diameter of the sprocket openings in an abutting layer for first receiving the sprocket being greater than the diameter of the sprocket openings in an abutted layer. This is followed by forming a plurality of reservoir openings in each of at least two of the layers and positioning the sprocket openings in the layers to correspond with one another and the reservoir openings in the layers to correspond with one another so that substantial alignment of the center axes of the corresponding sprocket openings in the layers effects substantial alignment of the center axes of the corresponding reservoir openings in the layers. Engaging the sprocket openings with the sprocket by inserting the end of the sprocket having the smallest diameter into the sprocket openings having the largest diameter in the layers and continuing through to the sprocket opening having the smallest diameter in the layers effects substantial alignment of the center axes of the corresponding sprocket openings and substantial alignment of the center axes of the corresponding reservoir openings in the layers. The invention also comprises apparatus-for performing this process.
摘要翻译：用于将至少两个彼此邻接的层对准的方法包括在每个层中形成多个链轮开口，用于当链轮从基座向外延伸时接收链轮直径减小的链轮，链轮的中心轴线每个层中的开口基本上彼此对准，用于首先接收链轮的邻接层中的链轮开口的直径大于邻接层中链轮开口的直径。随后在至少两个层中的每一个中形成多个储存器开口，并且将链轮开口定位在层中以彼此对应并且层中的储存器开口彼此对应，使得层中对应的链轮开口的中心轴线对层中对应的储存器开口的中心轴进行实质上的对准。通过将具有最小直径的链轮的端部插入到具有最大直径的链轮的链轮开口中并且连续到具有最小直径的链轮开口，使链轮开口与链轮接合，使得中心轴线的对应的链轮开口和相应的储存器开口的中心轴线在层中的基本对准。本发明还包括用于执行该过程的装置。

15. 发明申请

US20110127312A1 Injection Molded Solder Method for Forming Solder Bumps on Substrates 失效
标题翻译：用于在基片上形成焊料的注射成型焊接方法
公开(公告)号：US20110127312A1
公开(公告)日：2011-06-02
申请号：US13025419
申请日：2011-02-11
申请人： Peter A. Gruber , Paul A. Lauro , Jae-Woong Nah , Kazushige Toriyama
发明人： Peter A. Gruber , Paul A. Lauro , Jae-Woong Nah , Kazushige Toriyama
IPC分类号： B23K3/06
CPC分类号： B23K3/0638 , B23K1/0016
摘要： A flexible unitary mask has a plurality of through holes. A substrate has a plurality of wettable pads in recessed regions defining volumes. The through holes are aligned with the wettable pads. Molten solder is directly injected through the through holes of the flexible unitary mask into the volumes with the wettable pads, such that the through holes and the volumes with the wettable pads are filled with solder. The solder is allowed to solidify, forming a plurality of solder structures adhered to the wettable pads. The flexible unitary mask is peeled from the substrate after the solder has solidified.
摘要翻译：柔性酉面具有多个通孔。衬底在限定体积的凹陷区域中具有多个可湿性垫。通孔与可湿性垫对齐。熔融的焊料通过柔性整体式掩模的通孔被直接注入到具有可湿性垫的体积中，使得通孔和具有可湿性垫的体积被焊料填充。允许焊料固化，形成粘附到可湿性垫的多个焊料结构。焊料固化后，将柔性单位掩模从基板上剥离。

16. 发明申请

US20100116871A1 INJECTION MOLDED SOLDER METHOD FOR FORMING SOLDER BUMPS ON SUBSTRATES 有权
标题翻译：注射成型焊接方法用于在基材上形成焊锡
公开(公告)号：US20100116871A1
公开(公告)日：2010-05-13
申请号：US12269240
申请日：2008-11-12
申请人： Peter A. Gruber , Paul A. Lauro , Jae-Woong Nah , Kazushige Toriyama
发明人： Peter A. Gruber , Paul A. Lauro , Jae-Woong Nah , Kazushige Toriyama
IPC分类号： B23K1/20 , B23K3/06
CPC分类号： B23K3/0638 , B23K1/0016
摘要： A flexible unitary mask has a plurality of through holes. A substrate has a plurality of wettable pads in recessed regions defining volumes. The through holes are aligned with the wettable pads. Molten solder is directly injected through the through holes of the flexible unitary mask into the volumes with the wettable pads, such that the through holes and the volumes with the wettable pads are filled with solder. The solder is allowed to solidify, forming a plurality of solder structures adhered to the wettable pads. The flexible unitary mask is peeled from the substrate after the solder has solidified.
摘要翻译：柔性酉面具有多个通孔。衬底在限定体积的凹陷区域中具有多个可湿性垫。通孔与可湿性垫对齐。熔融的焊料通过柔性整体式掩模的通孔直接注入到具有可湿性垫片的体积中，使得通孔和具有可湿性垫片的体积用焊料填充。允许焊料固化，形成粘附到可湿性垫的多个焊料结构。焊料固化后，将柔性单位掩模从基板上剥离。

17. 发明授权

US08492262B2 Direct IMS (injection molded solder) without a mask for forming solder bumps on substrates 有权
标题翻译：直接IMS（注射成型焊料），不需要掩模，用于在基板上形成焊料凸块
公开(公告)号：US08492262B2
公开(公告)日：2013-07-23
申请号：US12706212
申请日：2010-02-16
申请人： Peter A. Gruber , Paul A. Lauro , Jae-Woong Nah
发明人： Peter A. Gruber , Paul A. Lauro , Jae-Woong Nah
IPC分类号： H01L21/44
CPC分类号： H05K3/3452 , H01L21/4853 , H01L23/3157 , H01L23/49811 , H01L23/49816 , H01L24/05 , H01L24/11 , H01L24/13 , H01L24/742 , H01L2224/0401 , H01L2224/05647 , H01L2224/10145 , H01L2224/1131 , H01L2224/11472 , H01L2224/1148 , H01L2224/11849 , H01L2224/13021 , H01L2224/13022 , H01L2224/131 , H01L2224/1403 , H01L2224/742 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01038 , H01L2924/01042 , H01L2924/01074 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/01322 , H01L2924/014 , H01L2924/14 , H05K3/3468 , H05K2201/09036 , H05K2201/09827 , H05K2201/09845 , H05K2203/0126 , H05K2203/043 , H05K2203/0557 , H05K2203/0594 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： An assembly is obtained; it includes a substrate; a plurality of wet-able pads formed on a surface of the substrate; and a solder resist layer deposited on the surface of the substrate and having an outer surface. At least the solder resist layer is formed with recessed regions defining volumes adjacent the wet-able pads. Molten solder is directly injected into the volumes adjacent the wet-able pads, such that the volumes adjacent the wet-able pads are filled with solder. The solder is allowed to solidify. It forms a plurality of solder structures adhered to the wet-able pads. The substrate and the solder are re-heated after the solidification, to re-flow the solder into generally spherical balls extending above the outer surface of the solder resist layer. The volumes adjacent the wet-able pads are configured and dimensioned to receive sufficient solder in the injecting step such that the generally spherical balls extend above the outer surface of the solder resist layer as a result of the re-heating step. In an alternative approach, solder injection and solidification are carried out in a nitrogen environment or a forming gas environment, and the reflow step may be omitted.
摘要翻译：获得组装; 它包括一个基片; 形成在所述基板的表面上的多个可湿式焊盘; 以及沉积在基板的表面上并具有外表面的阻焊层。至少阻焊层形成有限定与湿润垫相邻的体积的凹陷区域。将熔融的焊料直接注入到与湿式焊盘相邻的体积中，使得与可湿性焊盘相邻的体积填充有焊料。使焊料固化。它形成粘附到湿润垫的多个焊料结构。在固化之后，将基板和焊料重新加热，以将焊料重新流入延伸到阻焊层的外表面之上的大致球形的球体。配置和设置相邻于湿式焊盘的体积，以便在注入步骤中接收足够的焊料，使得大致球形球由于再加热步骤而在阻焊层的外表面上方延伸。在替代方法中，焊料注入和凝固在氮气环境或形成气体环境中进行，并且可以省略回流步骤。

18. 发明授权

US08828860B2 Double solder bumps on substrates for low temperature flip chip bonding 有权
标题翻译：用于低温倒装芯片接合的基板上的双焊点
公开(公告)号：US08828860B2
公开(公告)日：2014-09-09
申请号：US13600204
申请日：2012-08-30
申请人： Peter A. Gruber , Paul A. Lauro , Jae-Woong Nah
发明人： Peter A. Gruber , Paul A. Lauro , Jae-Woong Nah
IPC分类号： H01L21/00
CPC分类号： H05K3/3436 , B23K1/0016 , B23K3/0638 , H01L21/4853 , H01L21/563 , H01L23/49816 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/17 , H01L24/81 , H01L2224/11011 , H01L2224/13076 , H01L2224/131 , H01L2224/13147 , H01L2224/16113 , H01L2224/16238 , H01L2224/73204 , H01L2224/81065 , H01L2224/81193 , H01L2224/814 , H01L2224/81815 , H01L2924/01029 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01079 , H01L2924/01083 , H01L2924/14 , H01L2924/20104 , H01L2924/20106 , H01L2924/20107 , H01L2924/35 , H05K3/3494 , H05K13/0465 , H05K2203/043 , H01L2924/00014 , H01L2924/014
摘要： Multiple injections of molten solder are employed to form double solder bumps having outer layers that melt at lower temperatures than the inner portions thereof. During a flip chip assembly process, the reflow temperature is above the melting temperature of the outer layers and below the melting temperature of the inner portions of the solder bumps. As the inner portions of the solder bumps do not collapse during reflow, a flip chip assembly can be made at relatively low temperatures and have a high stand-off height. A structure having double solder bumps facilitates flip chip assembly.
摘要翻译：采用多次注入熔融焊料来形成双层焊料凸点，其外层在比其内部部分更低的温度下熔化。在倒装芯片组装过程中，回流温度高于外层的熔化温度并低于焊料凸块的内部部分的熔化温度。由于焊料凸块的内部在回流期间不会塌陷，所以可以在相对低的温度下制造倒装芯片组件并具有高的间隔高度。具有双重焊料凸块的结构有助于倒装芯片组装。

19. 发明申请

US20140065771A1 DOUBLE SOLDER BUMPS ON SUBSTRATES FOR LOW TEMPERATURE FLIP CHIP BONDING 有权
公开(公告)号：US20140065771A1
公开(公告)日：2014-03-06
申请号：US13600204
申请日：2012-08-30
申请人： Peter A. Gruber , Paul A. Lauro , Jae-Woong Nah
发明人： Peter A. Gruber , Paul A. Lauro , Jae-Woong Nah
IPC分类号： H01L21/60
CPC分类号： H05K3/3436 , B23K1/0016 , B23K3/0638 , H01L21/4853 , H01L21/563 , H01L23/49816 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/17 , H01L24/81 , H01L2224/11011 , H01L2224/13076 , H01L2224/131 , H01L2224/13147 , H01L2224/16113 , H01L2224/16238 , H01L2224/73204 , H01L2224/81065 , H01L2224/81193 , H01L2224/814 , H01L2224/81815 , H01L2924/01029 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01079 , H01L2924/01083 , H01L2924/14 , H01L2924/20104 , H01L2924/20106 , H01L2924/20107 , H01L2924/35 , H05K3/3494 , H05K13/0465 , H05K2203/043 , H01L2924/00014 , H01L2924/014
摘要： Multiple injections of molten solder are employed to form double solder bumps having outer layers that melt at lower temperatures than the inner portions thereof. During a flip chip assembly process, the reflow temperature is above the melting temperature of the outer layers and below the melting temperature of the inner portions of the solder bumps. As the inner portions of the solder bumps do not collapse during reflow, a flip chip assembly can be made at relatively low temperatures and have a high stand-off height. A structure having double solder bumps facilitates flip chip assembly.

20. 发明授权

US08381962B2 Injection molded solder method for forming solder bumps on substrates 失效
标题翻译：用于在基板上形成焊料凸块的注塑焊接方法
公开(公告)号：US08381962B2
公开(公告)日：2013-02-26
申请号：US13025419
申请日：2011-02-11
申请人： Peter A. Gruber , Paul A. Lauro , Jae-Woong Nah , Kazushige Toriyama
发明人： Peter A. Gruber , Paul A. Lauro , Jae-Woong Nah , Kazushige Toriyama
IPC分类号： B23K1/00 , B23K37/00
CPC分类号： B23K3/0638 , B23K1/0016
摘要： A flexible unitary mask has a plurality of through holes. A substrate has a plurality of wettable pads in recessed regions defining volumes. The through holes are aligned with the wettable pads. Molten solder is directly injected through the through holes of the flexible unitary mask into the volumes with the wettable pads, such that the through holes and the volumes with the wettable pads are filled with solder. The solder is allowed to solidify, forming a plurality of solder structures adhered to the wettable pads. The flexible unitary mask is peeled from the substrate after the solder has solidified.
摘要翻译：柔性酉面具有多个通孔。衬底在限定体积的凹陷区域中具有多个可湿性垫。通孔与可湿性垫对齐。熔融的焊料通过柔性整体式掩模的通孔被直接注入到具有可湿性垫的体积中，使得通孔和具有可湿性垫的体积被焊料填充。允许焊料固化，形成粘附到可湿性垫的多个焊料结构。焊料固化后，将柔性单位掩模从基板上剥离。

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