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11. 发明授权

US06938331B2 Method for fabricating a filament affixed trace within an electronic device 失效
标题翻译：一种用于在电子设备内制造灯丝固定迹线的方法
公开(公告)号：US06938331B2
公开(公告)日：2005-09-06
申请号：US10703122
申请日：2003-11-06
申请人： James J. deBlanc , David Dickey , Andrew Michael Cherniski
发明人： James J. deBlanc , David Dickey , Andrew Michael Cherniski
IPC分类号： H01P3/08 , H05K1/02 , H01R43/00
CPC分类号： H01P3/085 , H05K1/024 , H05K2201/0248 , H05K2201/0278 , Y10T29/49117 , Y10T29/49124 , Y10T29/49126 , Y10T29/49128 , Y10T29/49135 , Y10T29/49155 , Y10T29/49156
摘要： A method for fabricating a filament-affixed trace within an electronic device, such as a circuit board or microelectronic device. Conductive traces are affixed to the surface of a composite substrate containing filaments in a matrix bonded to an underlying solid material. The matrix is then removed, leaving the conductive traces suspended or supported by filaments. The signal intensity attenuation for filament-suspended or filament-supported signal lines is much lower than signal lines embedded in solid dielectric materials, allowing for transmission of significantly higher frequency signals within filament-suspended and filament-supported signal lines.
摘要翻译：一种用于在诸如电路板或微电子器件的电子器件内制造丝状贴痕迹的方法。导电迹线固定在复合衬底的表面上，该复合衬底在与基底固体材料结合的基质中含有长丝。然后去除基质，使导电迹线悬挂或被长丝支撑。长丝悬挂或灯丝支撑的信号线的信号强度衰减比嵌入固体电介质材料的信号线要低得多，允许在灯丝悬挂和灯丝支持的信号线中传输明显更高的频率信号。

12. 发明授权

US06751857B2 Conductive contamination reliability solution for assembling substrates 失效
标题翻译：用于组装衬底的导电污染可靠性解决方案
公开(公告)号：US06751857B2
公开(公告)日：2004-06-22
申请号：US09824506
申请日：2001-04-02
申请人： Andrew Michael Cherniski , James Kristian Koch
发明人： Andrew Michael Cherniski , James Kristian Koch
IPC分类号： H05K332
CPC分类号： H01L23/48 , H01L23/49562 , H01L23/49586 , H01L2924/0002 , H01L2924/3011 , H05K1/0256 , H05K3/301 , H05K3/306 , H05K3/3447 , H05K2201/0133 , H05K2201/0761 , H05K2201/10166 , H05K2201/10424 , Y10T29/4913 , Y10T29/49139 , Y10T29/49142 , Y10T29/49144 , Y10T29/53174 , Y10T29/53183 , H01L2924/00
摘要： A method and apparatus to eliminate conductive contamination reliability problems for assembled substrates, such as electrical arcing in power semiconductor leads. One embodiment of the invention involves a method for assembling an electrical component having leads on a substrate having conductive contacts, wherein an elastomer part encapsulates the leads of the electrical component. A second embodiment of the invention involves assembling an electrical component having leads to a substrate having conductive contacts, wherein an elastomer shape cut by a punch die encapsulates the leads of the electrical component. A third embodiment of the invention involves an assembled substrate including an electrical component having leads, and an elastomer surrounding the leads to encapsulate the leads.
摘要翻译：一种用于消除组装的衬底的导电污染可靠性问题的方法和装置，例如功率半导体引线中的电弧。本发明的一个实施例涉及一种用于组装具有导体的电气部件的方法，所述导线在具有导电触点的基板上，其中弹性体部件封装电气部件的引线。本发明的第二实施例涉及将具有导线的电气部件组装到具有导电触点的基板上，其中由冲压模切割的弹性体形状封装电气部件的引线。本发明的第三实施例涉及包括具有引线的电气部件的组装的基板和围绕引线的弹性体以封装引线。

13. 发明授权

US06700799B2 Electromagnetic interference containment apparatus 失效
标题翻译：电磁干扰容纳装置
公开(公告)号：US06700799B2
公开(公告)日：2004-03-02
申请号：US10215616
申请日：2002-08-08
申请人： Alisa C. Sandoval , Andrew Michael Cherniski
发明人： Alisa C. Sandoval , Andrew Michael Cherniski
IPC分类号： H05K900
CPC分类号： H05K9/0015 , Y10S439/927
摘要： The present invention is electromagnetic interference containment apparatus. In one embodiment, a layer of compressible material is disposed between an electromagnetic interference source and a bulkhead coupled to the electromagnetic interference source. The layer of compressible material has a first thickness and a second thickness. A first layer of conductive material is disposed on the back side of the layer of compressible material and is electrically coupled to the electromagnetic interference source. The first layer of conductive material is for absorbing electromagnetic emissions from the electromagnetic interference source. A second layer of conductive material is disposed on the front side of the layer of compressible material and is electrically coupled to the first layer of conductive material. The second layer of conductive material is for electrically contacting the bulkhead and for conducting the electromagnetic emissions to the bulkhead.
摘要翻译：本发明是电磁干扰收容装置。在一个实施例中，可压缩材料层设置在电磁干扰源和耦合到电磁干扰源的隔板之间。可压缩材料层具有第一厚度和第二厚度。第一层导电材料设置在可压缩材料层的背面，并且电耦合到电磁干扰源。第一层导电材料用于吸收电磁干扰源的电磁辐射。第二层导电材料设置在可压缩材料层的正面上，并电耦合到第一层导电材料。第二层导电材料用于电接触隔板并用于将电磁辐射传导到舱壁。

14. 发明授权

US07356215B2 Methods and apparatus for selectively coupling optical paths 有权
标题翻译：用于选择性耦合光路的方法和装置
公开(公告)号：US07356215B2
公开(公告)日：2008-04-08
申请号：US10646512
申请日：2003-08-23
申请人： James J. deBlanc , Andrew Michael Cherniski , Herbert J. Tanzer
发明人： James J. deBlanc , Andrew Michael Cherniski , Herbert J. Tanzer
IPC分类号： G02B6/26
CPC分类号： G02B6/12002 , G02B6/3556 , G02B6/43
摘要： An optical cross connect includes first and second planar layers having m and n optical path(s), respectively. An optical switch array comprising a plurality of optical switches is disposed to enable optically coupling any optical path of the first planar layer with any optical path of the second planar layer. Techniques for creating a variety of optical path types are provided.
摘要翻译：光交叉连接包括分别具有m和n个光路的第一和第二平面层。设置包括多个光开关的光开关阵列，以使第一平面层的任何光路与第二平面层的任何光路光学耦合。提供了用于创建各种光路类型的技术。

15. 发明授权

US07312404B2 Conductive contamination reliability solution for assembling substrates 有权
标题翻译：用于组装衬底的导电污染可靠性解决方案
公开(公告)号：US07312404B2
公开(公告)日：2007-12-25
申请号：US11411748
申请日：2006-04-25
申请人： Andrew Michael Cherniski , James Kristian Koch
发明人： Andrew Michael Cherniski , James Kristian Koch
IPC分类号： H05K1/16 , H05K3/30
CPC分类号： H01L23/48 , H01L23/49562 , H01L23/49586 , H01L2924/0002 , H01L2924/3011 , H05K1/0256 , H05K3/301 , H05K3/306 , H05K3/3447 , H05K2201/0133 , H05K2201/0761 , H05K2201/10166 , H05K2201/10424 , Y10T29/4913 , Y10T29/49139 , Y10T29/49142 , Y10T29/49144 , Y10T29/53174 , Y10T29/53183 , H01L2924/00
摘要： A method and apparatus to eliminate conductive contamination reliability problems for assembled substrates, such as electrical arcing in power semiconductor leads. One embodiment of the invention involves a method for assembling an electrical component having leads on a substrate having conductive contacts, wherein an elastomer part encapsulates the leads of the electrical component. A second embodiment of the invention involves assembling an electrical component having leads to a substrate having conductive contacts, wherein an elastomer shape cut by a punch die encapsulates the leads of the electrical component. A third embodiment of the invention involves an assembled substrate including an electrical component having leads, and an elastomer surrounding the leads to encapsulate the leads.
摘要翻译：一种用于消除组装的衬底的导电污染可靠性问题的方法和装置，例如功率半导体引线中的电弧。本发明的一个实施例涉及一种用于组装具有导体的电气部件的方法，所述导线在具有导电触点的基板上，其中弹性体部件封装电气部件的引线。本发明的第二实施例涉及将具有导线的电气部件组装到具有导电触点的基板上，其中由冲压模切割的弹性体形状封装电气部件的引线。本发明的第三实施例涉及包括具有引线的电气部件的组装的基板和围绕引线的弹性体以封装引线。

16. 发明授权

US06990280B2 Optical path with electrically conductive cladding 失效
标题翻译：带导电包层的光路
公开(公告)号：US06990280B2
公开(公告)日：2006-01-24
申请号：US10646604
申请日：2003-08-23
申请人： James J. deBlanc , Andrew Michael Cherniski , Herbert J. Tanzer
发明人： James J. deBlanc , Andrew Michael Cherniski , Herbert J. Tanzer
IPC分类号： G02B6/44
CPC分类号： G02B6/13 , G02B6/122 , G02B2006/12173 , G02B2006/12176
摘要： A method of forming an optical communication path includes forming an optical path for carrying optical communications. An electrically conductive cladding is formed along the optical path for carrying at least one of electrical power, control, and data along the optical path.
摘要翻译：形成光通信路径的方法包括形成用于承载光通信的光路。沿着光路形成导电包层，用于沿光路承载电力，控制和数据中的至少一个。

17. 发明授权

US06970054B2 Apparatus for terminating transmission lines to reduce electromagnetic interference in an electronic system 失效
标题翻译：用于终止传输线以减少电子系统中的电磁干扰的装置
公开(公告)号：US06970054B2
公开(公告)日：2005-11-29
申请号：US10263985
申请日：2002-10-02
申请人： Andrew Michael Cherniski , Ricardo Espinoza-Ibarra , Andrew Harvey Barr
发明人： Andrew Michael Cherniski , Ricardo Espinoza-Ibarra , Andrew Harvey Barr
IPC分类号： H01P1/24 , H01P1/26 , H05K1/02 , H05K1/14 , H04B3/30
CPC分类号： H05K1/0246 , H01P1/24 , H01P1/268 , H05K1/141 , H05K2201/044 , H05K2201/10022 , H05K2201/10189
摘要： An apparatus for terminating a transmission line includes a terminating circuit coupled to a first connector portion. A second connector portion mates with the first connector portion. The second connector portion is coupled in electrical contact with the transmission line and includes one or more components, such as pins, that can radiate unwanted electromagnetic interference (EMI) when the transmission line is not terminated. The terminating circuit includes components, such as one or more resistors, that substantially match the impedance of the transmission line. The terminating circuit can also be configured to terminate other conductive lines that can pick up signal noise in a system. The terminating apparatus can be utilized on operational boards that plug into devices such as backplanes or mid-planes. Alternatively, the terminating circuit can be included on a null device or built into the first connector portion.
摘要翻译：用于端接传输线的装置包括耦合到第一连接器部分的端接电路。第二连接器部分与第一连接器部分配合。第二连接器部分与传输线电接触耦合，并且包括当传输线未终止时可辐射不需要的电磁干扰（EMI）的一个或多个部件，例如引脚。终端电路包括基本上匹配传输线的阻抗的组件，例如一个或多个电阻器。终端电路还可以被配置为终止可以拾取系统中的信号噪声的其它导线。终端设备可以用于插入诸如背板或中间平面的设备的操作板上。或者，终端电路可以包括在零设备中或内置在第一连接器部分中。

18. 发明授权

US06696906B1 Low dielectric loss signal line having a conductive trace supported by filaments 失效
标题翻译：具有由细丝支撑的导电迹线的低介电损耗信号线
公开(公告)号：US06696906B1
公开(公告)日：2004-02-24
申请号：US09870839
申请日：2001-05-30
申请人： James J. deBlanc , David Dickey , Andrew Michael Cherniski
发明人： James J. deBlanc , David Dickey , Andrew Michael Cherniski
IPC分类号： H01P308
CPC分类号： H01P3/085 , H05K1/024 , H05K2201/0248 , H05K2201/0278 , Y10T29/49117 , Y10T29/49124 , Y10T29/49126 , Y10T29/49128 , Y10T29/49135 , Y10T29/49155 , Y10T29/49156
摘要： A circuit board or microelectronic device in which conductive signal lines are suspended or supported by filaments in air, rather than surrounded by a solid dielectric material. Dry air has a low relative permittivity and extremely low loss tangent compared with common dielectric substrates in which signal lines are currently embedded within circuit boards and microelectronic devices. The signal intensity attenuation for filament-suspended or filament-supported signal lines is much lower than signal lines embedded in solid dielectric materials, allowing for transmission of significantly higher frequency signals within filament-suspended and filament-supported signal lines.
摘要翻译：电路板或微电子器件，其中导电信号线由细丝悬挂或支撑在空气中，而不是被固体电介质材料包围。与其中信号线当前嵌入电路板和微电子器件的普通介质基板相比，干燥空气具有低的相对介电常数和极低的损耗角正切。长丝悬挂或灯丝支撑的信号线的信号强度衰减比嵌入固体电介质材料的信号线要低得多，允许在灯丝悬挂和灯丝支持的信号线中传输明显更高的频率信号。

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