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11. 发明申请

US20120035043A1 COVER GLASS FOR SOLID-STATE IMAGING ELEMENT PACKAGE 有权
标题翻译：固态玻璃用于固态成像元件包装
公开(公告)号：US20120035043A1
公开(公告)日：2012-02-09
申请号：US13276780
申请日：2011-10-19
申请人： Hidetoshi SUZUKI
发明人： Hidetoshi SUZUKI
IPC分类号： C03C3/19 , C03C3/064 , C03C3/066 , C03C3/17 , C03C3/062
CPC分类号： H01L31/0203 , C03C3/062 , C03C3/064 , C03C3/066 , C03C3/17 , C03C3/19
摘要： To provide a cover glass for a solid-state imaging element package, which is useful for air-tight sealing of a resin package and which has a strength not to undergo breakage even when subjected to external force.A cover glass for a solid-state imaging element package, which comprises, by mole percentage, P2O5: 15 to 40%, Al2O3: 15 to 30%, SiO2: 0 to 15%, B2O3: 0 to 20%, Li2O: 0 to 15%, Na2O: 0 to 25%, K2O: 0 to 25%, provided that Li2O+Na2O+K2O: 15 to 40%, and MgO+CaO+SrO+ZnO: 1 to 35%.
摘要翻译：提供一种用于固态成像元件封装的护罩玻璃，其可用于树脂封装的气密密封，并且即使在受到外力的情况下也具有不会发生破损的强度。一种用于固态成像元件封装的玻璃罩，其包含以摩尔比计的P 2 O 5：15至40％，Al 2 O 3：15至30％，SiO 2：0至15％，B 2 O 3：0至20％，Li 2 O：0 〜15％，Na 2 O：0〜25％，K 2 O：0〜25％，条件是Li 2 O + Na 2 O + K 2 O：15〜40％，MgO + CaO + SrO + ZnO：1〜35％。

12. 发明申请

US20120015150A1 COVER GLASS FOR SOLID-STATE IMAGING DEVICE 审中-公开
标题翻译：用于固态成像装置的盖玻璃
公开(公告)号：US20120015150A1
公开(公告)日：2012-01-19
申请号：US13178795
申请日：2011-07-08
申请人： Hidetoshi SUZUKI
发明人： Hidetoshi SUZUKI
IPC分类号： B32B3/00 , C03C3/093
CPC分类号： C03C3/093 , Y10T428/24479
摘要： To provide a cover glass for a solid-state imaging device, which has a high Young's modulus and a thermal expansion coefficient close to silicon within a wide temperature range and which is useful particularly for a solid-state imaging device produced by CSP.A cover glass for a solid-state imaging device, which comprises, by mass %, from 56 to 66% of SiO2, from 9 to 26% of Al2O3, from 1 to 11% of B2O3, from 0 to 6% of MgO, from 0 to 6% of CaO, from 4 to 13% of ZnO, from 0 to 4% of Li2O, from 0 to 5% of Na2O, and from 0 to 6% of K2O, provided that Li2O+Na2O+K2O is at least 1%, and which has an average thermal expansion coefficient of from 30 to 38×10−7K−1 within a range of from 30 to 300° C. and a Young's modulus of at least 78 GPa.
摘要翻译：为了提供一种用于固态成像装置的覆盖玻璃，其在较宽的温度范围内具有高的杨氏模量和接近硅的热膨胀系数，并且特别适用于由CSP制造的固态成像装置。一种固态成像装置用玻璃罩，其特征在于，以质量％计含有56〜66％的SiO 2，9〜26％的Al 2 O 3，1〜11％的B 2 O 3，0〜6％的MgO， 0〜6％的CaO，4〜13％的ZnO，0〜4％的Li2O，0〜5％的Na2O，0〜6％的K2O，条件是Li2O + Na2O + K2O为至少1％，平均热膨胀系数为30〜38×10-7K-1，范围为30〜300℃，杨氏模量为78GPa以上。

13. 发明申请

US20110315984A1 SEMICONDUCTOR MEMORY CARD AND METHOD OF MANUFACTURING THE SAME 审中-公开
标题翻译：半导体存储卡及其制造方法
公开(公告)号：US20110315984A1
公开(公告)日：2011-12-29
申请号：US13052164
申请日：2011-03-21
申请人： Hidetoshi SUZUKI , Toshiyuki Hayakawa , Yuka Nagashima
发明人： Hidetoshi SUZUKI , Toshiyuki Hayakawa , Yuka Nagashima
IPC分类号： H01L23/488 , H01L21/56 , H01L21/58
CPC分类号： H01L23/3135 , G06K19/07732 , H01L23/3121 , H01L23/49855 , H01L23/544 , H01L24/48 , H01L25/0655 , H01L25/18 , H01L2223/54406 , H01L2223/5442 , H01L2223/54433 , H01L2223/54486 , H01L2224/48091 , H01L2224/48225 , H01L2224/48227 , H01L2224/48228 , H01L2924/00014 , H01L2924/1434 , H01L2924/181 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： According to one embodiment, a semiconductor memory card that includes a printed substrate in which an electronic component is mounted on one surface, and an external terminal is installed on the other surface, and that is molded in a card form. The printed substrate is a laminated body in which a metallic interconnection for connecting the electronic component to the terminal and a solder resist are sequentially laminated on both surfaces of a core material. The semiconductor memory card includes an ink layer on the solder resist of the other surface, and a mark is engraved by a laser on the ink layer.
摘要翻译：根据一个实施例，一种半导体存储卡，其包括其中电子部件安装在一个表面上的印刷基板和外部端子安装在另一个表面上，并且以卡片形式被模制。印刷基板是层叠体，其中用于将电子部件连接到端子的金属互连件和阻焊剂顺序层压在芯材的两个表面上。半导体存储卡包括在另一表面的阻焊剂上的油墨层，并且在油墨层上用激光雕刻标记。

14. 发明申请

US20090245014A1 CLAY KNEADER 有权
标题翻译：粘土。
公开(公告)号：US20090245014A1
公开(公告)日：2009-10-01
申请号：US12483021
申请日：2009-06-11
申请人： Hidetoshi SUZUKI
发明人： Hidetoshi SUZUKI
IPC分类号： B29C47/10
CPC分类号： B28C1/16 , B01F7/086 , B28B3/222 , B28B3/269 , B30B11/221 , B30B11/246
摘要： A clay kneader has a drum having a pressure raising section on a supply opening side, an extrusion section having an inner diameter smaller than that of the pressure raising section on side of an extrusion opening for extruding clay as a columnar article, and a flow controlling section located between the pressure raising section and the extrusion section and being equipped with a supply opening for clay, a screw having a rotary shaft having a diameter which gradually decreases toward the extrusion opening in the flow controlling section and being ended around a boundary between the flow controlling section and the extrusion section, and a helical rotating blade provided along the rotary shaft for kneading the clay a rotary shaft.
摘要翻译：粘土捏合机具有在供给开口侧具有加压部的滚筒，具有比用于挤出粘土作为柱状物品的挤出口侧的加压部的内径小的挤出部，以及流量控制该部分位于压力提升部分和挤出部分之间并且具有用于粘土的供应开口，螺杆具有旋转轴，该旋转轴的直径朝向流动控制部分中的挤出开口逐渐减小，流动控制部和挤出部，以及沿着旋转轴设置的用于将粘土揉合在旋转轴上的螺旋形旋转叶片。

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