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    • 13. 发明申请
    • Formation method of an array source line in NAND flash memory
    • US20060240617A1
    • 2006-10-26
    • US11113508
    • 2005-04-25
    • Satoshi Torii
    • Satoshi Torii
    • H01L21/336
    • H01L27/11568H01L21/28282H01L27/115
    • Methods 500 and 550 are disclosed for fabricating an array source line structure in a wafer of a NAND flash memory device. One method aspect 500 comprises forming 510 a first oxide 610 and a nitride layer 611 of an ONO stack 620 over a substrate 604 and an STI 409 or 136 of the wafer 602 and 102, respectively, for example, then implanting 512 an N+ ion species through the stack 620 into a source line region 606 of the wafer 602. The method 500 further comprises forming 514 a second oxide layer 612 of the ONO stack 620 over the nitride layer 611 and forming an alumina layer 622 over the completed ONO stack 620 of the wafer 602, removing the ONOA stack (620 and 622) and forming 514 a gate oxide layer in the periphery region (not shown), then etching 516 an opening 626 in the ONOA stack 620 in an array source line region 606 of the wafer 602, for example, using a local interconnect mask. The method 500, also includes cleaning 518 the wafer and forming a polysilicon layer 628 over the wafer 602, and selectively etching 520 the polysilicon layer 628 and etching 522 the alumina layer 622 to concurrently form wordline 130 and select drain gate structures 124 in bitline contact regions (605, 608), and select source gate 116 structures and array source line structures 634 in source line regions 606. Method 500 further includes implanting 522 an N− dopant ion species, for example, an MDD material in openings of source/drain regions 106 formed in the wafer 602. The method 500 also comprises forming 524 sidewall spacers in bitline contact regions 605 and source line contact regions 606, implanting 526 an array ion species in the bitline contact regions 605, and finally, forming a silicide layer 654 in the polysilicon layer 604 in a core region to form a conductive layer for gate (116, 124), bitline 110, wordline 130, the select gate 116, and the source line structure contacts 132. Thus, the method 500 permits concurrent formation of the word lines 130, select gates 116, 124 and the array source lines 112 simultaneously to simplify and reduce the cost of the process, and to improve the yield without etching into the STI 409 or the use of a local interconnect structure.
    • 14. 发明授权
    • Quad bit using hot-hole erase for CBD control
    • 四位使用热孔擦除用于CBD控制
    • US07113431B1
    • 2006-09-26
    • US11091982
    • 2005-03-29
    • Darlene HamiltonAlykhan MadhaniFatima BathulSatoshi Torii
    • Darlene HamiltonAlykhan MadhaniFatima BathulSatoshi Torii
    • G11C16/14
    • G11C16/3422G11C11/5671G11C16/0475G11C16/14G11C16/3418
    • The present invention pertains to a technique for erasing bits in a dual bit memory in a manner that maintains complementary bit disturb control of bit-pairs of memory cells wherein each bit of the dual bit memory cell can be programmed to multiple levels. One exemplary method comprises providing a word of memory cells after an initial erasure and programming of the bits of the word to one or more of the higher program levels. A disturb level is determined for each of the bit-pairs of the word. A combined disturb level is then computed that is representative of the individual disturb levels. A pattern of drain voltages is then applied to the word for a number of program passes until a target pattern is stored in the word of memory cells based on the combined disturb level and the unprogrammed bit of the bit-pairs is erased to a single program level. In this manner the present invention compensates for the disturbance level that exists between the complementary bit-pairs of the word, improves the Vt distribution at the program level of the erased state and thereby improves the accuracy of subsequent higher level programming operations and mitigates false or erroneous reads of the states of such program levels.
    • 本发明涉及一种在双位存储器中擦除比特的技术,该技术维持存储器单元的比特对的互补位干扰控制,其中双比特存储单元的每个比特可被编程为多个级别。 一个示例性方法包括在初始擦除之后提供一个单词的存储单元,并将该单词的位编程到一个或多个较高程序级。 为单词的每个位对确定干扰级别。 然后计算代表各个干扰级别的组合干扰级别。 然后将漏极电压的模式施加到多个程序遍的字,直到目标模式基于组合的干扰电平存储在存储器单元的字中,并且位对的未编程位被擦除到单个程序 水平。 以这种方式,本发明补偿存在于字的互补位对之间的干扰电平,改善了擦除状态的程序级的Vt分布,从而提高了后续更高级编程操作的准确性,并减轻了错误或 错误地读取这些程序级别的状态。
    • 16. 发明授权
    • Apparatus and method for a memory array with shallow trench isolation regions between bit lines for increased process margins
    • 用于存储器阵列的装置和方法,其在位线之间具有浅沟槽隔离区域,用于增加工艺余量
    • US08507971B2
    • 2013-08-13
    • US12187276
    • 2008-08-06
    • Satoshi Torii
    • Satoshi Torii
    • H01L29/76H01L31/119
    • H01L29/7883H01L27/115H01L27/11521H01L29/42324H01L29/513
    • The present invention provides an apparatus and method for a non-volatile memory comprising at least one array of memory cells with shallow trench isolation (STI) regions between bit lines for increased process margins. Specifically, in one embodiment, each of the memory cells in the array of memory cells includes a source, a control gate, and a drain, and is capable of storing at least one bit. The array of memory cells further includes word lines that are coupled to control gates of memory cells. The word lines are arranged in rows in the array. In addition, the array comprises bit lines coupled to source and drains of memory cells. The bit lines are arranged in columns in the array. Also, the array comprises at least one row of bit line contacts for providing electrical conductivity to the bit lines. Further, the array comprises shallow trench isolation (STI) regions separating each of the bit lines along the row of bit line contacts.
    • 本发明提供了一种用于非易失性存储器的装置和方法,该装置和方法包括在位线之间的浅沟槽隔离(STI)区域的至少一个存储单元阵列,用于增加工艺裕度。 具体地,在一个实施例中,存储单元阵列中的每个存储单元包括源极,控制栅极和漏极,并且能够存储至少一个位。 存储单元阵列还包括耦合到存储器单元的控制栅极的字线。 字线在数组中排成行。 此外,阵列包括耦合到存储器单元的源极和漏极的位线。 位线排列在数组中的列中。 而且,该阵列包括用于向位线提供导电性的至少一行位线触点。 此外,阵列包括沿着位线触点行分隔每个位线的浅沟槽隔离(STI)区域。
    • 17. 发明授权
    • Semiconductor memory device and method for driving semiconductor memory device
    • 用于驱动半导体存储器件的半导体存储器件和方法
    • US08259495B2
    • 2012-09-04
    • US13197280
    • 2011-08-03
    • Satoshi Torii
    • Satoshi Torii
    • G11C11/34G11C16/04G11C16/06G11C5/06
    • H01L27/11519G11C16/0416G11C16/10H01L27/11526H01L27/11529H01L27/11573
    • A semiconductor memory device includes a plurality of memory cell transistors arranged in a matrix; a plurality of word lines commonly coupling the control gates of the plural memory cell transistors present in a identical first direction; a plurality of source lines commonly coupling the sources of the plural memory cell transistors present in the identical first direction; a plurality of bit lines commonly coupling the drains of the plural memory cell transistors present in a identical second direction intersecting the first direction; a first transistor having a drain coupled to the source line; a second transistor having a drain coupled to a source of the first transistor, a gate coupled to the word line and a source grounded; and a control line commonly coupling the gates of the plural first transistors.
    • 半导体存储器件包括以矩阵形式布置的多个存储单元晶体管; 多个字线通常耦合存在于相同第一方向上的多个存储单元晶体管的控制栅极; 多个源极线通常耦合存在于相同第一方向上的多个存储单元晶体管的源极; 多个位线通常耦合存在于与第一方向相交的相同第二方向的多个存储单元晶体管的漏极; 第一晶体管,具有耦合到源极线的漏极; 第二晶体管,其具有耦合到所述第一晶体管的源极的漏极,耦合到所述字线的栅极和接地的源极; 以及通常耦合多个第一晶体管的栅极的控制线。
    • 18. 发明授权
    • Semiconductor memory device and method for driving semiconductor memory device
    • 用于驱动半导体存储器件的半导体存储器件和方法
    • US08072806B2
    • 2011-12-06
    • US12434789
    • 2009-05-04
    • Satoshi Torii
    • Satoshi Torii
    • G11C11/34G11C16/04G11C5/06
    • H01L27/11519G11C16/0416G11C16/10H01L27/11526H01L27/11529H01L27/11573
    • A semiconductor memory device includes a plurality of memory cell transistors arranged in a matrix; a plurality of word lines commonly coupling the control gates of the plural memory cell transistors present in a identical first direction; a plurality of source lines commonly coupling the sources of the plural memory cell transistors present in the identical first direction; a plurality of bit lines commonly coupling the drains of the plural memory cell transistors present in a identical second direction intersecting the first direction; a first transistor having a drain coupled to the source line; a second transistor having a drain coupled to a source of the first transistor, a gate coupled to the word line and a source grounded; and a control line commonly coupling the gates of the plural first transistors.
    • 半导体存储器件包括以矩阵形式布置的多个存储单元晶体管; 多个字线通常耦合存在于相同第一方向上的多个存储单元晶体管的控制栅极; 多个源极线通常耦合存在于相同第一方向上的多个存储单元晶体管的源极; 多个位线通常耦合存在于与第一方向相交的相同第二方向的多个存储单元晶体管的漏极; 第一晶体管,具有耦合到源极线的漏极; 第二晶体管,其具有耦合到所述第一晶体管的源极的漏极,耦合到所述字线的栅极和接地的源极; 以及通常耦合多个第一晶体管的栅极的控制线。
    • 19. 发明申请
    • SEMICONDUCTOR MEMORY DEVICE AND METHOD FOR DRIVING SEMICONDUCTOR MEMORY DEVICE
    • 用于驱动半导体存储器件的半导体存储器件和方法
    • US20110286257A1
    • 2011-11-24
    • US13197264
    • 2011-08-03
    • Satoshi Torii
    • Satoshi Torii
    • G11C5/06
    • H01L27/11519G11C16/0416G11C16/10H01L27/11526H01L27/11529H01L27/11573
    • A semiconductor memory device includes a plurality of memory cell transistors arranged in a matrix; a plurality of word lines commonly coupling the control gates of the plural memory cell transistors present in a identical first direction; a plurality of source lines commonly coupling the sources of the plural memory cell transistors present in the identical first direction; a plurality of bit lines commonly coupling the drains of the plural memory cell transistors present in a identical second direction intersecting the first direction; a first transistor having a drain coupled to the source line; a second transistor having a drain coupled to a source of the first transistor, a gate coupled to the word line and a source grounded; and a control line commonly coupling the gates of the plural first transistors.
    • 半导体存储器件包括以矩阵形式布置的多个存储单元晶体管; 多个字线通常耦合存在于相同第一方向上的多个存储单元晶体管的控制栅极; 多个源极线通常耦合存在于相同第一方向上的多个存储单元晶体管的源极; 多个位线通常耦合存在于与第一方向相交的相同第二方向的多个存储单元晶体管的漏极; 第一晶体管,具有耦合到源极线的漏极; 第二晶体管,其具有耦合到所述第一晶体管的源极的漏极,耦合到所述字线的栅极和接地的源极; 以及通常耦合多个第一晶体管的栅极的控制线。