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11. 发明授权

US11800632B2 Electronic device having heat-radiating structure 有权
公开(公告)号：US11800632B2
公开(公告)日：2023-10-24
申请号：US17262973
申请日：2019-07-24
申请人： SAMSUNG ELECTRONICS CO., LTD.
发明人： Yonghwa Kim , Min Park , Dongil Son , Hyunwoo Sim , Jaedeok Lim , Chunghyo Jung , Seungbum Choi
IPC分类号： H05K1/02
CPC分类号： H05K1/0207 , H05K1/0209 , H05K1/0219
摘要： According to various embodiments, an electronic device may include a first plate, a second plate facing away from the first plate, and a side member surrounding a space between the first plate and the second plate, a middle plate disposed in the space between the first plate and the second plate in parallel with the second plate, a first Printed Circuit Board (PCB) disposed in a space between the second plate and the middle plate, a first electronic component mounted on the first PCB between the first PCB and the middle plate, a first heat transfer structure disposed between the first electronic component and the middle plate, a second electronic component including a first surface disposed in the space and spaced apart from the first PCB, a second surface facing away from the first surface, and a side face substantially perpendicular to the first surface or the second surface, and a second heat transfer structure. The second heat transfer structure may include a first thermal conductive layer including a first portion attached to the first surface or the second surface, and a second portion extending from the first portion toward the middle plate and at least partially having a thermal conductive path between the second electronic component and the middle plate, and a second electrical conductive layer including a third portion attached to the first portion so that the third portion constructs an electromagnetic shielding structure for the second electric component. Other various embodiments may also be possible.

12. 发明授权

US11503749B2 Display including shielding member arranged to cover at least part of display driving circuit, and electronic device including same 有权
公开(公告)号：US11503749B2
公开(公告)日：2022-11-15
申请号：US17048552
申请日：2019-04-18
申请人： Samsung Electronics Co., Ltd.
发明人： Hyunwoo Sim , Yonghwa Kim , Dongil Son , Seungbum Choi
IPC分类号： H05K9/00 , H05K1/18 , H05K5/00
摘要： According to various embodiments, an electronic device may include a housing, and a display disposed to at least part of the housing. The display may include a display panel including at least one pixel, and a substrate layer disposed below the display panel. The substrate layer may include a bendable connecting area extending to the outside of the display panel. The display may further include a display driving circuit disposed to one face of the connecting area, a Flexible Printed Circuit Board (FPCB) electrically coupled with at least part of the connecting area and including a contact area to which a conductor electrically coupled with a ground portion of the electronic device is exposed, and a shielding member electrically coupled with the contact area. The shielding member may be disposed on the FPCB and one face of the connecting area to cover at least part of the display driving circuit. Various other embodiments may also be possible.

13. 发明授权

US11470409B2 Electronic device with sealing structure 有权
公开(公告)号：US11470409B2
公开(公告)日：2022-10-11
申请号：US16510733
申请日：2019-07-12
申请人： Samsung Electronics Co., Ltd
发明人： Wontae Jeong , Eungkyu Park , Dongyeop Lee , Yonghwa Kim , Gihoon Lee , Jaehwan Lee , Seungbum Choi , Hyounggil Choi , Changryong Heo
IPC分类号： H05K5/00 , H05K5/02 , H05K5/03 , H05K5/06 , H04R1/02 , H01F38/14 , H01M50/24 , H01M50/209
摘要： An electronic device may include: a housing including a front plate oriented in a first direction, a rear plate oriented in a second direction opposite the first direction, and a side member enclosing at least a part of a space between the front plate and the rear plate. The electronic device further including a display disposed to be visible through the front plate; a printed circuit board disposed between the display and the rear plate; a support structure having a first face oriented in the first direction and supporting the display and a second face oriented in the second direction and supporting the printed circuit board; a conductive member disposed between the support structure and the rear plate; and a sealing structure disposed between the conductive member and the rear plate, the sealing structure extending along a periphery of the conductive member and formed in a closed curve shape.

14. 发明授权

US11019190B2 Electronic device including connecting member sharing structure 有权
公开(公告)号：US11019190B2
公开(公告)日：2021-05-25
申请号：US16515712
申请日：2019-07-18
申请人： Samsung Electronics Co., Ltd.
发明人： Yonghwa Kim , Bumhee Bae , Dongil Son , Hyunwoo Sim , Jaedeok Lim , Seungbum Choi
IPC分类号： H04M1/02 , H04B1/38 , H01Q5/30 , H01Q1/24
摘要： An electronic device includes a housing including a first plate, a second plate facing away from the first plate, and a lateral member surrounding a space between the first and second plates; a display disposed in the housing and exposed through at least a part of the first plate; an antenna module disposed at a first area adjacent to the lateral member; an electronic component disposed at a second area adjacent to the first area in the housing; at least one wireless communication circuit disposed in the housing and configured to transmit or receive a signal having a frequency between 3 gigahertz (GHz) and 100 GHz through the antenna module; a processor disposed in the housing; and a flexible printed circuit board (FPCB) including a first conductive line electrically connected between the at least one wireless communication circuit and the antenna module, and a second conductive line electrically connected between the processor and the electronic component.

15. 发明授权

US12126749B2 Electronic device with keyless sensor 有权
公开(公告)号：US12126749B2
公开(公告)日：2024-10-22
申请号：US17751009
申请日：2022-05-23
申请人： SAMSUNG ELECTRONICS CO., LTD.
发明人： Jeonggyu Jo , Yonghwa Kim , Dongil Son , Dongyoung Lee
IPC分类号： H04M1/23 , G02F1/1333
CPC分类号： H04M1/236 , G02F1/13338 , H04M2250/22
摘要： An electronic device including a keyless sensor according to various embodiments includes: a case including an opening; a sensor frame provided inside the case and at least partially exposed to an outside of the case through the opening, the sensor frame including a conductive part and a non-conductive part; and a hybrid sensor provided inside the case and accommodated in the sensor frame, wherein the hybrid sensor includes: a base disposed in the sensor frame; a pressure sensor disposed on the base and in contact with the conductive part; and a touch sensor disposed on the base and in contact with the non-conductive part.

16. 发明授权

US11924595B2 Electronic device with sealing structure 有权
公开(公告)号：US11924595B2
公开(公告)日：2024-03-05
申请号：US17933787
申请日：2022-09-20
申请人： SAMSUNG ELECTRONICS CO., LTD.
发明人： Wontae Jeong , Eungkyu Park , Dongyeop Lee , Yonghwa Kim , Gihoon Lee , Jaehwan Lee , Seungbum Choi , Hyounggil Choi , Changryong Heo
IPC分类号： H05K5/00 , H01F38/14 , H01M50/209 , H01M50/24 , H04R1/02 , H05K5/02 , H05K5/03 , H05K5/06
CPC分类号： H04R1/025 , H01F38/14 , H01M50/209 , H01M50/24 , H05K5/0004 , H05K5/0017 , H05K5/0086 , H05K5/0247 , H05K5/03 , H05K5/069 , H01M2220/30 , H04R2499/01
摘要： An electronic device may include: a housing including a front plate oriented in a first direction, a rear plate oriented in a second direction opposite the first direction, and a side member enclosing at least a part of a space between the front plate and the rear plate. The electronic device further including a display disposed to be visible through the front plate; a printed circuit board disposed between the display and the rear plate; a support structure having a first face oriented in the first direction and supporting the display and a second face oriented in the second direction and supporting the printed circuit board; a conductive member disposed between the support structure and the rear plate; and a sealing structure disposed between the conductive member and the rear plate, the sealing structure extending along a periphery of the conductive member and formed in a closed curve shape.

17. 发明授权

US11877383B2 Electronic device including shield member for shielding at least part of magnetic force generated by magnetic substance and connection portion including property of nonmagnetic substance connected to shield member 有权
公开(公告)号：US11877383B2
公开(公告)日：2024-01-16
申请号：US18187276
申请日：2023-03-21
申请人： Samsung Electronics Co., Ltd.
发明人： Gihoon Lee , Seunggoo Kang , Yonghwa Kim , Hongjun Kim , Wangik Son , Jaehwan Lee , Seungbum Choi , Jaedeok Lim
IPC分类号： H05K9/00 , H05K1/02 , H05K5/02 , H04M1/02
CPC分类号： H05K9/0075 , H04M1/0277 , H05K1/0216 , H05K5/0247 , H05K9/002 , H05K9/0022 , H05K9/0024
摘要： An electronic device including a shield structure is provided. The electronic device includes a first device including a first magnetic substance, a second device including a second magnetic substance, and a shield structure configured to shield at least part of a magnetic force generated between the first magnetic substance and the second magnetic substance, wherein the shield structure includes a shield member disposed between the first device and the second device and including a property of a magnetic substance, and a connecting member physically connected to at least part of the shield member and including a property of a nonmagnetic substance, wherein at least part of the connecting member is physically connected to a circuit board.

18. 发明授权

US11825007B2 Component stack mounting structure and electronic device including same 有权
公开(公告)号：US11825007B2
公开(公告)日：2023-11-21
申请号：US17248617
申请日：2021-01-29
申请人： Samsung Electronics Co., Ltd.
发明人： Jinho Lim , Gyeongtae Kim , Yonghwa Kim
IPC分类号： H04M1/02
CPC分类号： H04M1/0274 , H04M1/0264 , H04M1/0277 , H04M2250/12
摘要： An electronic device according to various embodiments may include a display, a main board, a component connector, a supporting member, and a sensor module. The main board is disposed under the display. The component connector is disposed on a surface of the main board. The supporting member is configured to surround at least two side surfaces of the component connector and is disposed on the surface of the main board. The sensor module includes a sensor that faces at least a portion of the component connector. The sensor module also includes a sensor substrate that is stacked with the sensor and attached to the supporting member. The sensor substrate may be separably connected to the supporting member.

19. 发明授权

US11622481B2 Electronic device including shield member for shielding at least part of magnetic force generated by magnetic substance and connection portion including property of nonmagnetic substance connected to shield member 有权
公开(公告)号：US11622481B2
公开(公告)日：2023-04-04
申请号：US17144643
申请日：2021-01-08
申请人： Samsung Electronics Co., Ltd.
发明人： Gihoon Lee , Seunggoo Kang , Yonghwa Kim , Hongjun Kim , Wangik Son , Jaehwan Lee , Seungbum Choi , Jaedeok Lim
IPC分类号： H05K9/00 , H05K1/02 , H05K5/02
摘要： An electronic device including a shield structure is provided. The electronic device includes a first device including a first magnetic substance, a second device including a second magnetic substance, and a shield structure configured to shield at least part of a magnetic force generated between the first magnetic substance and the second magnetic substance, wherein the shield structure includes a shield member disposed between the first device and the second device and including a property of a magnetic substance, and a connecting member physically connected to at least part of the shield member and including a property of a nonmagnetic substance, wherein at least part of the connecting member is physically connected to a circuit board.

20. 发明授权

US11209326B2 Pressure sensor device formed in board and electronic device including the same 有权
公开(公告)号：US11209326B2
公开(公告)日：2021-12-28
申请号：US16506251
申请日：2019-07-09
申请人： Samsung Electronics Co., Ltd.
发明人： Hyunwoo Sim , Seongjun Kim , Yonghwa Kim , Dongil Son , Jaedeok Lim , Seungbum Choi
IPC分类号： G01L1/22 , H05K1/02 , G06F3/045
摘要： An electronic device for detecting pressure is provided. The electronic device includes a printed circuit board (PCB) including at least one element or circuit pattern for driving the electronic device, at least one electrode pattern formed to detect a pressure in the wiring layer included in the PCB, an elastic member arranged to be at least partially overlapped with the electrode pattern, and a pressure sensor circuit electrically connected to the electrode pattern included in the PCB. The pressure sensor circuit is configured to apply a voltage to the electrode pattern and measure intensity of the pressure based on a change in the voltage applied to the electrode pattern.

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