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11. 发明专利

JPH07130422A CONNECTOR 失效
公开(公告)号：JPH07130422A
公开(公告)日：1995-05-19
申请号：JP27527393
申请日：1993-11-04
申请人： JAPAN AVIATION ELECTRON , NEC CORP
发明人： TAKAGI TOSHIFUMI , KURISAKA MASARU
IPC分类号： H01R43/20 , H01R13/42
摘要： PURPOSE:To provide a connector which permits removal of contact from either side of a housing. CONSTITUTION:A reslient ring 3 is provided with an in-ring small hole part 3a of which diameter is smaller than an outer diameter of a stop clip 4 and through which a middle part 22 of a contact 2 can be inserted, an in-ring large hole part 3b of a larger diameter than that of a large diameter end part 25 of the contact 2 on the entrance side of the contact 2, a small outer diameter part of a smaller diameter than that of a large diameter hole part 10c of a housing 1, and a protruding part to be engaged into a stop recessed part 10b formed in the large diameter hole part 10c of the housing 1. By contracting the stop clip 4, the outer diameter of the stop clip 4 becomes smaller than that of the in-ring small hole part 3a of the resilient ring 3, or by expanding the resilient ring 3, the in-ring small hole part 3a becomes larger than the outer diameter of the stop clip 4, so the contact 2 can be removed from the housing 1.

12. 发明专利

JPH0212226A MATRIX OPTICAL SWITCH 失效
公开(公告)号：JPH0212226A
公开(公告)日：1990-01-17
申请号：JP16320188
申请日：1988-06-30
申请人： NEC CORP
发明人： KURISAKA MASARU
IPC分类号： G02B6/12 , G02B6/30 , G02F1/313
摘要： PURPOSE:To easily couple a matrix optical switch with a fiber array by arranging linear Ti-diffused waveguides on both sides except a matrix optical switch constitution area formed on an LiNbO3 substrate in the perpendicular direction to a light incidence/projection end surface. CONSTITUTION:The Ti-diffused waveguides 3 are formed on the LiNbO3 substrate 1 to constitute a matrix 4 and two linear Ti-diffused waveguides 7 are formed on both sides except the constitution area of the matrix 4 in the perpendicular direction to the light incidence/projection end surface 6. Then, On one light incidence/projection end surface 6, plural optical fibers 5 are connected to the Ti-diffused waveguides 3 and linear Ti-diffused waveguides 7 through a fiber array 2. Consequently, the facilities for the coupling are simplified and the coupling operation is made easy.

13. 发明专利

JPS62222644A TAPE CARRIER 失效
公开(公告)号：JPS62222644A
公开(公告)日：1987-09-30
申请号：JP6651186
申请日：1986-03-24
申请人： NEC CORP
发明人： KURISAKA MASARU
IPC分类号： H01L21/60 , H05K1/18 , H05K3/00
摘要： PURPOSE:To mass-produce the same hybrid integrated circuits by providing tape carrier itself with a hybrid integrated circuit function. CONSTITUTION:A tape carrier has mounting regions for LSI chips 3, loading regions for electronic parts, such as resistors, capacitors, etc. and external input/output terminals 10, and the tape carrier 1 is provided with a hybrid integrated circuit function. The tape carrier 1 is manufactured in such a manner that sprocket wheels 2 and device holes 7 are stamped, a copper foil is laminated and pads for loading lead frames 6 and the electronic parts 4 and patterns 5 for wirings for mutual wirings are arranged through etching. The LSI chips 3 and the electronic parts 4 required as a hybrid integrated circuit are loaded, and the tape carrier 1 is cut at position shown in broken lines A, thus allowing the mass production of the same hybrid integrated circuits.

14. 发明专利

JPS62137860A CERAMIC CASE FOR SEMICONDUCTOR INTEGRATED CIRCUIT 失效
公开(公告)号：JPS62137860A
公开(公告)日：1987-06-20
申请号：JP27963985
申请日：1985-12-11
申请人： NEC CORP
发明人： KURISAKA MASARU
IPC分类号： H01L23/12 , H01L23/08 , H01L23/64 , H01L25/00 , H05K1/18
摘要： PURPOSE:To make it possible to implement high density mounting of an IC without mounting a capacitor on a printed wiring board, by providing pads for attaching the capacitor to a ceramic case of the IC. CONSTITUTION:On a case 1, a grounding pad 6 is arranged at the extended part of an evaporated lead 4, which is extended from a pad 3 for attaching a grounding lead terminal. A power source pad 8 is arranged at the extended part of an evaporated lead 9, which is extended from a pad for attaching a power source lead terminal. The pads 6 and 8 are made to face each other. Figure 2 is a bird-eye view showing an example of mounting a capacitor by using an IC ceramic case 10. In the case 10, a grounding pad 14 and a power source pad 15 for mounting the capacitor 12 are arranged beforehand. The capacitor 12 is mounted by soldering as shown by a numeral 13 by using the grounding pad 14 and the power source pad 15.

15. 发明专利

JPH04276707A ADAPTOR FOR LIGHT CONNECTION AND OPTICAL CONNECTOR 失效
公开(公告)号：JPH04276707A
公开(公告)日：1992-10-01
申请号：JP6245891
申请日：1991-03-05
申请人： JAPAN AVIATION ELECTRON , NEC CORP
发明人： SHIBUYA MICHITOMO , SAWANO ISATAKE , SATOU YOSHITAROU , KURISAKA MASARU
IPC分类号： G02B6/26 , G02B6/36
摘要： PURPOSE:To provide adaptor for light connection and an optical connector with comparatively narrow space required for connection per one adaptor or connector and with satisfactory packaging workability. CONSTITUTION:A through hole 11 Is provided at a circuit board 1. A pipe 12 is arranged by piercing through the through hole. An optical fiber 24 is inserted to the pipe. Optical contacts 23 are provided at both terminals of the optical fiber, respectively. The optical contacts are held with contact holding members 21, respectively. The contact holding members are arranged movably on the pipe 12 in a cylindrical shaft direction, and the contact holding members are driven in the cylindrical shaft direction by a slider 18 moving in a direction perpendicular to the cylindrical shaft direction.

16. 发明专利

JPH04182607A ADAPTOR FOR OPTICAL CONNECTION AND OPTICAL CONNECTOR 失效
公开(公告)号：JPH04182607A
公开(公告)日：1992-06-30
申请号：JP31132490
申请日：1990-11-19
申请人： JAPAN AVIATION ELECTRON , NEC CORP
发明人： SHIBUYA MICHITOMO , SAWANO ISATAKE , SATOU YOSHITAROU , KURISAKA MASARU
IPC分类号： G02B6/38
摘要： PURPOSE:To enable a space required for connecting per one optical contact holding member to made narrow and to improve the workability of packaging by moving the optical contact auxiliary members in the cylindrical shaft direction of a sleeve and connecting them. CONSTITUTION:An adaptor for optical connection is constituted by inserting an aligning sleeve 12 in the through-hole 11 of a printed wiring plate 1, and fixing a main housing 13 on the plate 1. On the other hand, the optical contact holding member 23 holds optical contacts 25 connected by an optical fiber 26 to align the optical axes thereof with the cylindrical shaft of the sleeve 12. Besides, the member 23 is driven in a second direction 24 by a cam groove 19 according to the movement of a slider 18 in a first direction 16. By inserting the tip part 27 of the contact 25 in the sleeve 12 and making the tip part 27 from the surface and the back surface of the wiring plate 1 abut on, the optical connectors are connected.

17. 发明专利

JPS6482656A SEALING STRUCTURE FOR HYBRID INTEGRATED CIRCUIT 失效
公开(公告)号：JPS6482656A
公开(公告)日：1989-03-28
申请号：JP24217987
申请日：1987-09-25
申请人： NEC CORP
发明人： KURISAKA MASARU
IPC分类号： H01L23/29 , H01L21/316 , H01L23/31
摘要： PURPOSE:To prevent pads from corroding due to the absorption of moisture of a sheath resin by providing insulating films on the surfaces of an IC chip, wirings and a mounting substrate. CONSTITUTION:A die pad 8 for placing an IC chip 2 formed with a hybrid integrated circuit and a plurality of wire bonding pads 9 are provided on a mounting substrate 1. A passivation film 3 and a plurality of aluminum pads 4 are provided on the surface of the chip 2. After the pads 4 are connected to the pads 9 by wirings 5, SiO2 oxide films 6 are formed on the surfaces of the chip 2 including the pads 4, the wirings 5 and the substrate 1. Thereafter, the substrate 1 is covered with the wirings 5 and the chip 2, and a sheath resin 7 is formed. Even if moisture is invaded from externally to the resin 7, the films 6 can prevent the pads 4 of the chip 2 from corroding.

18. 发明专利

JPS61120449A Mini-flat ic 失效
标题翻译： MINI-FLAT IC
公开(公告)号：JPS61120449A
公开(公告)日：1986-06-07
申请号：JP24211384
申请日：1984-11-16
申请人： Nec Corp
发明人： KURISAKA MASARU
IPC分类号： H01L23/00 , H01L23/31 , H01L23/50 , H05K3/30 , H05K3/34
CPC分类号： H01L23/3107 , H01L2924/0002 , H05K3/303 , H05K3/3421 , H01L2924/00
摘要： PURPOSE:To regulate the relative position with respect to an automatic mounting machine, by providing a positioning projection on the surface of the case of a mini-flat IC. CONSTITUTION:When a mini-flat IC 1 is sealed by resin 5, a projection 3 is provided on a case surface 2. When a projection 28 is provided on a case surface 24 of a mini-flat IC 21, a position, where the projection 28 can be sucked into a recess part 25a of a vacuum chuck 25, is limited to one place. Therefore, correction is not required after the mounting performed by an automatic mounting machine. In this constitution, the lead pad of a mounting substrate and the lead terminal of the mini-flat IC can be correctly positioned.
摘要翻译：目的：通过在小型平板IC的外壳表面上设置定位突起来调节相对于自动安装机的相对位置。构成：当微型扁平IC1被树脂5密封时，突起3设置在壳体表面2上。当突起28设置在小型平板IC21的壳体表面24上时，突起28可以被吸入到真空卡盘25的凹部25a中，被限制在一个位置。因此，在通过自动安装机进行安装之后，不需要校正。在这种构造中，可以正确地定位安装基板的引线焊盘和微型扁平IC的引线端子。

19. 发明专利

JPH04271194A OPTICAL CIRCUIT DEVICE 失效
公开(公告)号：JPH04271194A
公开(公告)日：1992-09-28
申请号：JP3126291
申请日：1991-02-27
申请人： NEC CORP
发明人： SAWANO ISATAKE , SATO YOSHITARO , KURISAKA MASARU
IPC分类号： G02B6/00 , G02B6/36 , H01R13/46 , H04B10/25 , H04B10/27 , H05K7/14
摘要： PURPOSE:To provide an optical circuit device which constitutes optical fiber cable wirings which intersect each other in the shape of a network with high efficiency. CONSTITUTION:A zero force insertion input connector housing 5 is provided with an electric connection terminal from an optical/electronic bipolar circuit. An electric insertion input connector adaptor 8 serves as a package guide to array a plurality of optical/electronic circuit bipolar package at a constant span and fitted into the zero force insertion input connector housing 5 by actuating a lever after the insertion of the optical/electronic circuit bipolar package. Mother boards 9A and 9B are laid out in such a fashion that it may cross the package insertion direction, and serves as a top board and a bottom board which house the optical/electronic circuit bipolar package. A frame 10 laminates a plurality of mother boards at a span.

20. 发明专利

JPS63108757A SEMICONDOCTOR DEVICE 失效
公开(公告)号：JPS63108757A
公开(公告)日：1988-05-13
申请号：JP25498586
申请日：1986-10-27
申请人： NEC CORP
发明人： KURISAKA MASARU
IPC分类号： H01L23/28
摘要： PURPOSE:To prevent a malfunction from occurring at a semiconductor device by providing a heater which can heat a chip sealing resin to heat it. CONSTITUTION:A die pad 3 and a wire bonding pad 5 for placing a chip 6 are provided on a mounting substrate 1, and an electric heater 2 is wired through an insulating layer 9 under the pad 3. After a wire bonding is executed by wirings 7, they are sealed with resin. Since a voltage is applied to the heater 2 for use to heat a resin 8, absorbed moisture is dispersed to outer atmosphere. Accordingly, it can prevent a malfunction from occurring at a semiconductor device due to corrosion.

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