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    • 12. 发明申请
    • LASER PROCESSING METHODS FOR PHOTOVOLTAIC SOLAR CELLS
    • 光伏太阳能电池的激光加工方法
    • WO2012092537A3
    • 2012-11-22
    • PCT/US2011068037
    • 2011-12-30
    • SOLEXEL INCMOSLEHI MEHRDAD MRANA VIRENDRA VANBALAGAN PRANAVSARASWAT VIVEK
    • MOSLEHI MEHRDAD MRANA VIRENDRA VANBALAGAN PRANAVSARASWAT VIVEK
    • H01L31/042B23K26/36H01L31/18
    • H01L31/02363B23K26/0624B23K26/40B23K2203/50H01L21/268H01L31/0682H01L31/1804Y02E10/547Y02P70/521
    • Various laser processing schemes are disclosed for producing various types of hetero- junction and homo-junction solar cells. The methods include base and emitter contact opening, selective doping, metal ablation, annealing to improve passivation, and selective emitter doping via laser heating of aluminum. Also, laser processing schemes are disclosed that are suitable for selective amorphous silicon ablation and selective doping for hetero- junction solar cells. Laser ablation techniques are disclosed that leave the underlying silicon substantially undamaged. These laser processing techniques may be applied to semiconductor substrates, including crystalline silicon substrates, and further including crystalline silicon substrates which are manufactured either through wire saw wafering methods or via epitaxial deposition processes, or other cleavage techniques such as ion implantation and heating, that are either planar or textured/three-dimensional. These techniques are highly suited to thin crystalline semiconductor, including thin crystalline silicon films.
    • 公开了用于生产各种类型的异质结和同质结太阳能电池的各种激光处理方案。 这些方法包括基极和发射极接触开口,选择性掺杂,金属烧蚀,退火以改善钝化,以及通过激光加热铝的选择性发射极掺杂。 此外,公开了适用于异质结太阳能电池的选择性非晶硅消融和选择性掺杂的激光加工方案。 公开了激光烧蚀技术,使基底硅基本上没有损坏。 这些激光处理技术可以应用于包括晶体硅衬底的半导体衬底,并且还包括通过线锯晶片化方法或经由外延沉积工艺或诸如离子注入和加热的其它切割技术制造的晶体硅衬底,其是 平面或纹理/三维。 这些技术非常适用于薄晶体半导体,包括薄晶体硅薄膜。
    • 14. 发明申请
    • DIRECTIONAL CRYSTALLIZATION OF SILICON SHEETS USING RAPID THERMAL PROCESSING
    • 硅片快速热处理定向结晶
    • WO2008076730B1
    • 2008-08-14
    • PCT/US2007087150
    • 2007-12-12
    • APPLIED MATERIALS INCRANA VIRENDRA VBACHRACH ROBERT Z
    • RANA VIRENDRA VBACHRACH ROBERT Z
    • C30B1/00C30B15/04
    • H01L31/1804Y02E10/547Y02P70/521
    • The present invention provides a method of recrystallizing a silicon sheet, and in particular recrystallizing a small grained silicon sheet to improve material properties such as grain size and orientation. According to one aspect, the method includes using rapid thermal processing (RTP) to melt and recrystallize one or more entire silicon sheet(s) in one heating sequence. According to another aspect, the method includes directionally controlling a temperature drop across the thickness of the sheet so as to facilitate the production of a small number of nuclei in the melted material and their growth into large grains. According to a further aspect, the invention includes a re-crystallization chamber in an overall process flow that enables high-throughput processing of silicon sheets having desired properties for applications such as photovoltaic modules.
    • 本发明提供了一种使硅片再结晶的方法,特别是使小颗粒硅片再结晶以改善诸如晶粒尺寸和取向的材料特性。 根据一个方面,该方法包括使用快速热处理(RTP)以一个加热顺序熔化并重结晶一个或多个整个硅片。 根据另一方面,该方法包括定向控制片材厚度上的温度下降,以促进在熔化材料中产生少量核并且它们生长成大颗粒。 根据另一方面,本发明在整个工艺流程中包括重新结晶室,该重新结晶室能够对具有用于诸如光伏模块的应用的期望性质的硅片进行高通量处理。