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11. 发明授权

US07256085B2 Semiconductor memory device and manufacturing method thereof 有权
标题翻译：半导体存储器件及其制造方法
公开(公告)号：US07256085B2
公开(公告)日：2007-08-14
申请号：US11077233
申请日：2005-03-11
申请人： Kazuhiro Hata , Shinichi Sato , Yukiharu Akiyama
发明人： Kazuhiro Hata , Shinichi Sato , Yukiharu Akiyama
IPC分类号： H01L21/8238
CPC分类号： H01L29/0847 , H01L21/26586 , H01L27/11568 , H01L29/66825
摘要： A manufacturing method of a semiconductor memory device comprising the steps of: forming plural trenches in stripes in a semiconductor substrate and filling each of the trenches with an element isolation insulating film to form element isolation regions; sequentially forming a tunnel insulating film and a charge-storable film so as to cover active regions between the element isolation regions; forming an interlayer insulating film on the charge-storable film; forming plural control gates on the interlayer insulating film in a direction orthogonal to a longitudinal direction of the trenches; among source formation regions and drain formation regions alternately provided between the plural control gates, etching the element isolation insulating film in the source formation regions, using as a mask a resist film having openings in the source formation regions, to expose surfaces of the trenches; and carrying out isotropic plasma ion implantation on the source formation regions to form source diffusion layers in the surfaces of the trenches and in the active regions.
摘要翻译：一种半导体存储器件的制造方法，包括以下步骤：在半导体衬底中形成条纹中的多个沟槽，并用元件隔离绝缘膜填充每个沟槽以形成元件隔离区域; 依次形成隧道绝缘膜和电荷存储膜，以覆盖元件隔离区之间的有源区; 在电荷存储膜上形成层间绝缘膜; 在与所述沟槽的纵向正交的方向上在所述层间绝缘膜上形成多个控制栅极; 在多个控制栅极之间交替设置的源极形成区域和漏极形成区域之间，在源极形成区域中蚀刻元件隔离绝缘膜，使用在源极形成区域中具有开口的抗蚀剂膜作为掩模来暴露沟槽的表面; 并在源极形成区域上进行各向同性等离子体离子注入，以在沟槽表面和活性区域中形成源极扩散层。

12. 发明申请

US20050230804A1 Manufacturing method for semiconductor device, semiconductor device and semiconductor chip 有权
标题翻译：半导体器件，半导体器件和半导体芯片的制造方法
公开(公告)号：US20050230804A1
公开(公告)日：2005-10-20
申请号：US11085265
申请日：2005-03-22
申请人： Kazumasa Tanida , Mitsuo Umemoto , Yukiharu Akiyama
发明人： Kazumasa Tanida , Mitsuo Umemoto , Yukiharu Akiyama
IPC分类号： H01L25/18 , H01L21/70 , H01L23/48 , H01L25/065 , H01L25/07 , H01L27/00
CPC分类号： H01L25/0657 , H01L23/481 , H01L24/45 , H01L24/48 , H01L2224/0401 , H01L2224/05008 , H01L2224/05009 , H01L2224/05026 , H01L2224/05147 , H01L2224/1134 , H01L2224/13021 , H01L2224/13025 , H01L2224/13144 , H01L2224/16145 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/73207 , H01L2225/0651 , H01L2225/06513 , H01L2225/06541 , H01L2225/06555 , H01L2225/06582 , H01L2924/00014 , H01L2924/01029 , H01L2924/01078 , H01L2924/01079 , H01L2924/01322 , H01L2924/04941 , H01L2924/12041 , H01L2924/15311 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
摘要： A manufacturing method for a semiconductor device includes: the step of preparing a semiconductor chip which is provided with a functional element formed on a front surface side of a semiconductor substrate, a feedthrough electrode which is placed within a through hole that penetrates the semiconductor substrate, a front surface side connection member which protrudes from the front surface, and a rear surface side connection member which has a joining surface within a recess that is formed in a rear surface; the step of preparing a solid state device where a solid state device side connection member for connection to the front surface side connection member is formed on one surface; and the joining step of making the front surface of the semiconductor chip face the first surface of the solid state device by holding the rear surface of the semiconductor chip, and of joining the front surface side connection member to the solid state device side connection member.
摘要翻译：半导体装置的制造方法包括：准备半导体芯片的步骤，该半导体芯片设置有形成在半导体基板的正面侧的功能元件，放置在贯通半导体基板的通孔内的馈通电极，从前表面突出的前表面侧连接构件和在形成在后表面的凹部内具有接合表面的后表面侧连接构件; 制备固态器件的步骤，其中在一个表面上形成用于连接到前表面侧连接部件的固态器件侧连接部件; 并且通过保持半导体芯片的后表面并将前表面侧连接构件接合到固态器件侧连接构件，使半导体芯片的前表面面向固态器件的第一表面的接合步骤。

13. 发明申请

US20050200019A1 Semiconductor device and manufacturing method thereof 有权
标题翻译：半导体装置及其制造方法
公开(公告)号：US20050200019A1
公开(公告)日：2005-09-15
申请号：US11116209
申请日：2005-04-28
申请人： Chuichi Miyazaki , Yukiharu Akiyama , Masnori Shibamoto , Tomoaki Kudaishi , Ichiro Anjoh , Kunihiko Nishi , Asao Nishimura , Hideki Tanaka , Ryosuke Kimoto , Kunihiro Tsubosaki , Akio Hasebe , Takehiro Ohnishi , Noriou Shimada , Shuji Eguchi , Hiroshi Koyama , Akira Nagai , Masahiko Ogino
发明人： Chuichi Miyazaki , Yukiharu Akiyama , Masnori Shibamoto , Tomoaki Kudaishi , Ichiro Anjoh , Kunihiko Nishi , Asao Nishimura , Hideki Tanaka , Ryosuke Kimoto , Kunihiro Tsubosaki , Akio Hasebe , Takehiro Ohnishi , Noriou Shimada , Shuji Eguchi , Hiroshi Koyama , Akira Nagai , Masahiko Ogino
IPC分类号： H01L23/31 , H01L23/495 , H01L23/498 , H01L23/48 , H01L21/44
CPC分类号： H01L24/50 , H01L23/3114 , H01L23/3128 , H01L23/49572 , H01L23/49816 , H01L23/49827 , H01L23/4985 , H01L24/06 , H01L24/45 , H01L24/48 , H01L2224/0401 , H01L2224/04042 , H01L2224/05554 , H01L2224/06136 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/4824 , H01L2224/48465 , H01L2224/50 , H01L2224/85951 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01019 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01057 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/14 , H01L2924/1433 , H01L2924/15311 , H01L2924/181 , H01L2924/3025 , H01L2924/00 , H01L2924/00015 , H01L2224/05599
摘要： A semiconductor device includes a semiconductor chip formed with connection terminals, an elastic structure interposed between a main surface of the chip and a wiring substrate formed with wirings connected at first ends thereof to the connection terminals, and bump electrodes connected to the other ends of the wirings. The connection terminals may be at a center part or in peripheral part(s) of the chip main surface and both the elastic structure and wiring substrate are not provided at locations of connection terminals. A resin body seals at least the connection terminals and the exposed first ends of wirings (leads). In a scheme in which the connection terminals are located in a peripheral part of the chip main surface, the wiring substrate protrudes beyond the chip boundary where the connection terminals are arranged, and the resin body shape is restricted by the protruding part of the wiring substrate.
摘要翻译：半导体器件包括形成有连接端子的半导体芯片，插入在芯片的主表面之间的弹性结构和形成有连接到连接端子的布线的布线基板，以及连接到连接端子的另一端的凸起电极布线。连接端子可以在芯片主表面的中心部分或周边部分，并且弹性结构和布线基板都不设置在连接端子的位置处。树脂体至少密封连接端子和暴露的布线的第一端（引线）。在连接端子位于芯片主表面的周边部分的方案中，布线基板突出超过布置有连接端子的芯片边界，并且树脂体形状被布线基板的突出部分限制。

14. 发明授权

US06521981B2 Semiconductor device and manufacturing method thereof 有权
公开(公告)号：US06521981B2
公开(公告)日：2003-02-18
申请号：US09765376
申请日：2001-01-22
申请人： Chuichi Miyazaki , Yukiharu Akiyama , Masanori Shibamoto , Tomoaki Kudaishi , Ichiro Anjoh , Kunihiko Nishi , Asao Nishimura , Hideki Tanaka , Ryosuke Kimoto , Kunihiro Tsubosaki , Akio Hasebe
发明人： Chuichi Miyazaki , Yukiharu Akiyama , Masanori Shibamoto , Tomoaki Kudaishi , Ichiro Anjoh , Kunihiko Nishi , Asao Nishimura , Hideki Tanaka , Ryosuke Kimoto , Kunihiro Tsubosaki , Akio Hasebe
IPC分类号： H01L23498
CPC分类号： H01L23/49816 , H01L23/49827 , H01L23/4985 , H01L24/06 , H01L24/45 , H01L24/48 , H01L24/50 , H01L2224/0401 , H01L2224/04042 , H01L2224/05554 , H01L2224/06136 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/48465 , H01L2224/48472 , H01L2224/50 , H01L2224/73215 , H01L2224/85951 , H01L2924/00011 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01057 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/15311 , Y10T29/4913 , Y10T29/49169 , H01L2924/20753 , H01L2224/05599
摘要： A ball grid array type semiconductor package includes a semiconductor chip formed with bonding pads, an elastomer bonded to the semiconductor chip, a flexible wiring substrate bonded to the elastomer and formed with wirings connected at one end of the bonding pads of the semiconductor chip, a solder resist formed on the main surface of the flexible wiring substrate and solder bump electrodes connected to the other ends of the wirings. The elastomer is bonded to the flexible wiring substrate on the side of the tape, the solder resist is formed on the side of the wirings, and the solder bump electrodes are connected with the wirings by way of through holes formed in the solder resist.

15. 发明授权

US06342728B2 Semiconductor device and manufacturing method thereof 有权
标题翻译：半导体装置及其制造方法
公开(公告)号：US06342728B2
公开(公告)日：2002-01-29
申请号：US09760733
申请日：2001-01-17
申请人： Chuichi Miyazaki , Yukiharu Akiyama , Masanori Shibamoto , Tomoaki Kudaishi , Ichiro Anjoh , Kunihiko Nishi , Asao Nishimura , Hideki Tanaka , Ryosuke Kimoto , Kunihiro Tsubosaki , Akio Hasebe
发明人： Chuichi Miyazaki , Yukiharu Akiyama , Masanori Shibamoto , Tomoaki Kudaishi , Ichiro Anjoh , Kunihiko Nishi , Asao Nishimura , Hideki Tanaka , Ryosuke Kimoto , Kunihiro Tsubosaki , Akio Hasebe
IPC分类号： H01L23495
CPC分类号： H01L23/49816 , H01L23/49827 , H01L23/4985 , H01L24/06 , H01L24/45 , H01L24/48 , H01L24/50 , H01L2224/0401 , H01L2224/04042 , H01L2224/05554 , H01L2224/06136 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/48465 , H01L2224/48472 , H01L2224/50 , H01L2224/73215 , H01L2224/85951 , H01L2924/00011 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01057 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/15311 , Y10T29/4913 , Y10T29/49169 , H01L2924/20753 , H01L2224/05599
摘要： A ball grid array type semiconductor package includes a semiconductor chip formed with bonding pads, an elastomer bonded to the semiconductor chip, a flexible wiring substrate bonded to the elastomer and formed with wirings connected at one end of the bonding pads of the semiconductor chip, a solder resist formed on the main surface of the flexible wiring substrate and solder bump electrodes connected to the other ends of the wirings. The elastomer is bonded to the flexible wiring substrate on the side of the tape, the solder resist is formed on the side of the wirings, and the solder bump electrodes are connected with the wirings by way of through holes formed in the solder resist.
摘要翻译：球栅阵列型半导体封装包括形成有接合焊盘的半导体芯片，接合到半导体芯片的弹性体，与弹性体接合并形成有连接在半导体芯片的接合焊盘的一端的布线的柔性布线基板，在柔性布线基板的主表面上形成的阻焊剂和连接到布线的另一端的焊料凸块电极。弹性体在带的一侧粘接到柔性布线基板上，在布线侧形成阻焊剂，并且焊料凸块电极通过形成在阻焊剂中的通孔与布线连接。

16. 发明授权

US5110032A Method and apparatus for wire bonding 失效
标题翻译：用于电线连接的方法和装置
公开(公告)号：US5110032A
公开(公告)日：1992-05-05
申请号：US692913
申请日：1991-04-29
申请人： Yukiharu Akiyama , Yoshio Oshima
发明人： Yukiharu Akiyama , Yoshio Oshima
IPC分类号： B23K20/00 , H01L21/60 , H01L21/607 , H01L23/49
CPC分类号： H01L24/85 , B23K20/007 , H01L24/48 , H01L24/78 , H01L2224/05624 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/4556 , H01L2224/45565 , H01L2224/4569 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/48624 , H01L2224/48724 , H01L2224/48824 , H01L2224/78268 , H01L2224/78301 , H01L2224/786 , H01L2224/85045 , H01L2224/85075 , H01L2224/851 , H01L2224/85181 , H01L2224/85205 , H01L24/45 , H01L2924/00011 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01007 , H01L2924/01013 , H01L2924/01018 , H01L2924/01019 , H01L2924/0102 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01047 , H01L2924/01057 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/04953 , H01L2924/14 , H01L2924/19043 , H01L2924/20303 , H01L2924/20753 , H01L2924/20754
摘要： The present invention relates to a ball bonding technique using an insulated wire in assembling a semiconductor chip in which the ball is formed at the end of an insulated wire by an electrical discharge and the insulation at a portion of the wire to be bonded a predetermined distance from one end of the wire is removed by an electrical discharge.

17. 发明授权

US5037023A Method and apparatus for wire bonding 失效
标题翻译：引线接合方法和装置
公开(公告)号：US5037023A
公开(公告)日：1991-08-06
申请号：US442149
申请日：1989-11-28
申请人： Yukiharu Akiyama , Yoshio Oshima
发明人： Yukiharu Akiyama , Yoshio Oshima
IPC分类号： B23K20/00 , H01L21/60 , H01L21/607 , H01L23/49
CPC分类号： H01L24/85 , B23K20/007 , H01L24/48 , H01L24/78 , H01L2224/05624 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/4556 , H01L2224/45565 , H01L2224/4569 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/48624 , H01L2224/48724 , H01L2224/48824 , H01L2224/78268 , H01L2224/78301 , H01L2224/786 , H01L2224/85045 , H01L2224/85075 , H01L2224/851 , H01L2224/85181 , H01L2224/85205 , H01L24/45 , H01L2924/00011 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01007 , H01L2924/01013 , H01L2924/01018 , H01L2924/01019 , H01L2924/0102 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01047 , H01L2924/01057 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/04953 , H01L2924/14 , H01L2924/19043 , H01L2924/20303 , H01L2924/20753 , H01L2924/20754
摘要： The present invention relates to a ball bonding technique using an insulated wire in assembling a semiconductor chip in which the ball is formed at the end of an insulated wire by an electrical discharge and the insulation at a portion of the wire to be bonded a predetermined distance from one end of the wire is removed by an electrical discharge.
摘要翻译：本发明涉及一种使用绝缘电线组装半导体芯片的球焊接技术，其中通过放电在绝缘电线的端部形成球，并且在要接合预定距离的线的一部分处的绝缘从导线的一端通过放电去除。

18. 发明授权

US08552545B2 Manufacturing method for semiconductor device, semiconductor device and semiconductor chip 有权
标题翻译：半导体器件，半导体器件和半导体芯片的制造方法
公开(公告)号：US08552545B2
公开(公告)日：2013-10-08
申请号：US11085265
申请日：2005-03-22
申请人： Kazumasa Tanida , Mitsuo Umemoto , Yukiharu Akiyama
发明人： Kazumasa Tanida , Mitsuo Umemoto , Yukiharu Akiyama
IPC分类号： H01L23/02 , H01L23/48 , H01L23/52
CPC分类号： H01L25/0657 , H01L23/481 , H01L24/45 , H01L24/48 , H01L2224/0401 , H01L2224/05008 , H01L2224/05009 , H01L2224/05026 , H01L2224/05147 , H01L2224/1134 , H01L2224/13021 , H01L2224/13025 , H01L2224/13144 , H01L2224/16145 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/73207 , H01L2225/0651 , H01L2225/06513 , H01L2225/06541 , H01L2225/06555 , H01L2225/06582 , H01L2924/00014 , H01L2924/01029 , H01L2924/01078 , H01L2924/01079 , H01L2924/01322 , H01L2924/04941 , H01L2924/12041 , H01L2924/15311 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
摘要： A manufacturing method for a semiconductor device includes: the step of preparing a semiconductor chip which is provided with a functional element formed on a front surface side of a semiconductor substrate, a feedthrough electrode which is placed within a through hole that penetrates the semiconductor substrate, a front surface side connection member which protrudes from the front surface, and a rear surface side connection member which has a joining surface within a recess that is formed in a rear surface; the step of preparing a solid-state device where a solid-state device side connection member for connection to the front surface side connection member is formed on one surface; and the joining step of making the front surface of the semiconductor chip face the first surface of the solid-state device by holding the rear surface of the semiconductor chip, and of joining the front surface side connection member to the solid-state device side connection member.
摘要翻译：半导体装置的制造方法包括：准备半导体芯片的步骤，该半导体芯片设置有形成在半导体基板的正面侧的功能元件，放置在贯通半导体基板的通孔内的馈通电极，从前表面突出的前表面侧连接构件和在形成在后表面的凹部内具有接合表面的后表面侧连接构件; 制备固体装置的步骤，其中在一个表面上形成用于连接到前表面侧连接构件的固态装置侧连接构件; 并且通过保持半导体芯片的后表面并使前表面侧连接构件连接到固态器件侧连接而使半导体芯片的前表面面向固态器件的第一表面的接合步骤会员。

19. 发明申请

US20060261494A1 Semiconductor device and manufacturing method thereof 有权
标题翻译：半导体装置及其制造方法
公开(公告)号：US20060261494A1
公开(公告)日：2006-11-23
申请号：US11492165
申请日：2006-07-25
申请人： Chuichi Miyazaki , Yukiharu Akiyama , Masanori Shibamoto , Tomoaki Kudaishi , Ichiro Anjoh , Kunihiko Nishi , Asao Nishimura , Hideki Tanaka , Ryosuke Kimoto , Kunihiro Tsubosaki , Akio Hasebe
发明人： Chuichi Miyazaki , Yukiharu Akiyama , Masanori Shibamoto , Tomoaki Kudaishi , Ichiro Anjoh , Kunihiko Nishi , Asao Nishimura , Hideki Tanaka , Ryosuke Kimoto , Kunihiro Tsubosaki , Akio Hasebe
IPC分类号： H01L23/48
CPC分类号： H01L24/50 , H01L23/3114 , H01L23/3128 , H01L23/49572 , H01L23/49816 , H01L23/49827 , H01L23/4985 , H01L24/06 , H01L24/45 , H01L24/48 , H01L2224/0401 , H01L2224/04042 , H01L2224/05554 , H01L2224/06136 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/4824 , H01L2224/48465 , H01L2224/50 , H01L2224/85951 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01019 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01057 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/14 , H01L2924/1433 , H01L2924/15311 , H01L2924/181 , H01L2924/3025 , H01L2924/00 , H01L2924/00015 , H01L2224/05599
摘要： A semiconductor device includes a semiconductor chip formed with connection terminals, an elastic structure interposed between a main surface of the chip and a wiring substrate formed with wirings connected at first ends thereof to the connection terminals, and bump electrodes connected to the other ends of the wirings. The connection terminals may be at a center part or in peripheral part(s) of the chip main surface and both the elastic structure and wiring substrate are not provided at locations of connection terminals. A resin body seals at least the connection terminals and the exposed first ends of wirings (leads). In a scheme in which the connection terminals are located in a peripheral part of the chip main surface, the wiring substrate protrudes beyond the chip boundary where the connection terminals are arranged, and the resin body shape is restricted by the protruding part of the wiring substrate.
摘要翻译：半导体器件包括形成有连接端子的半导体芯片，插入在芯片的主表面之间的弹性结构和形成有连接到连接端子的布线的布线基板，以及连接到连接端子的另一端的凸起电极布线。连接端子可以在芯片主表面的中心部分或周边部分，并且弹性结构和布线基板都不设置在连接端子的位置处。树脂体至少密封连接端子和暴露的布线的第一端（引线）。在连接端子位于芯片主表面的周边部分的方案中，布线基板突出超过布置有连接端子的芯片边界，并且树脂体形状被布线基板的突出部分限制。

20. 发明申请

US20050268723A1 Pressure sensor apparatus 有权
标题翻译：压力传感器装置
公开(公告)号：US20050268723A1
公开(公告)日：2005-12-08
申请号：US10918404
申请日：2004-08-16
申请人： Yukiharu Akiyama , Hisato Umemaru
发明人： Yukiharu Akiyama , Hisato Umemaru
IPC分类号： G01L19/06 , F02P5/00 , G01L9/00 , G01L19/00
CPC分类号： G01L19/0627 , F02D2200/0406 , G01L19/0038 , G01L19/0636
摘要： A pressure sensor apparatus having capability of preventing invasion of foreign materials into a pressure sensor with a simplified structure includes the pressure sensor (1) for detecting pressure of a fluid for measurement, and a sensor container (2) for housing therein the pressure sensor (1). The sensor container (2) is connected to a pressure intake port (13) formed in a pipe (12) through which the fluid for measurement flows. The sensor container (2) includes a wall (17) for defining a second compartment (16) located in opposition to the pressure intake port (13) and a first compartment (15) having a pressure introducing port (14) for introducing the fluid for measurement extracted through the pressure intake port (13) to the pressure sensor (1).
摘要翻译：具有能够以简化的结构防止异物侵入压力传感器的能力的压力传感器装置包括用于检测用于测量的流体的压力的压力传感器（1）和用于容纳压力传感器的传感器容器（2） 1）。传感器容器（2）连接到形成在管（12）中的压力进入口（13），流体用于测量流体。传感器容器（2）包括用于限定与压力进气口（13）相对的第二隔室（16）的壁（17）和具有用于引入流体的压力引入口（14）的第一隔室（15）用于通过压力进入口（13）提取到压力传感器（1）的测量。

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