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11. 发明申请

US20050082670A1 Method for preapplying a viscous material to strengthen solder connections in microelectronic packaging and microelectronic packages formed thereby 审中-公开
标题翻译：用于预先施加粘性材料以加强由此形成的微电子封装和微电子封装中的焊料连接的方法
公开(公告)号：US20050082670A1
公开(公告)日：2005-04-21
申请号：US10937053
申请日：2004-09-09
申请人： Horatio Quinones , Liang Fang , Dave Ellis , Erik Fiske , Thomas Ratledge , Alec Babiarz , Robert Ciardella
发明人： Horatio Quinones , Liang Fang , Dave Ellis , Erik Fiske , Thomas Ratledge , Alec Babiarz , Robert Ciardella
IPC分类号： H01L21/56 , H01L23/31 , H01L23/48 , H01L21/44 , H01L23/52 , H01L29/40
CPC分类号： H01L21/563 , H01L23/3114 , H01L23/3171 , H01L24/10 , H01L2224/05572 , H01L2224/05573 , H01L2224/13022 , H01L2224/73203 , H01L2924/0102 , H01L2924/01322
摘要： Apparatus and methods for preapplying discrete amounts of underfill material of a component on a component substrate before the solder bumps of the component are joined by reflow with a packaging substrate to create a microelectronics package. The underfill material is preferably applied by a noncontact dispensing technique as discrete amounts at interstitial areas on an active surface of the component substrate defined between nearest-neighbor solder bumps. The underfill material forms a continuous meniscus of underfill material across the interstitial areas not occupied by the solder bumps and forms a collar encircling each of the solder bumps. The cured underfill material strengthens and improves the reliability of the solder joints formed by the bump reflow.
摘要翻译：在组件的焊料凸起之前，通过用封装衬底回流来连接组件衬底上的分量的底部填充材料的装置和方法，以形成微电子封装。底部填充材料优选通过非接触分配技术作为在最近邻焊料凸块之间限定的部件衬底的有源表面上的间隙区域处的离散量施加。底部填充材料在未被焊料凸块占据的间隙区域上形成底部填充材料的连续弯液面，并形成环绕每个焊料凸块的凸缘。固化的底部填充材料增强并提高由凸点回流形成的焊点的可靠性。

12. 发明申请

US20130048759A1 MODULAR JETTING DEVICES 有权
标题翻译：模块化喷射装置
公开(公告)号：US20130048759A1
公开(公告)日：2013-02-28
申请号：US13219064
申请日：2011-08-26
申请人： Stanley Cruz Aguilar , Mani Ahmadi , Stephen Russell des Jardins , Erik Fiske , Mark Meier , Horatio Quinones , Thomas Ratledge , Robert James Wright
发明人： Stanley Cruz Aguilar , Mani Ahmadi , Stephen Russell des Jardins , Erik Fiske , Mark Meier , Horatio Quinones , Thomas Ratledge , Robert James Wright
IPC分类号： A62C37/20
CPC分类号： B05C5/0225 , B05B1/304 , B05B1/3046 , B05B15/65 , B05C5/02 , B05C5/0237 , B05C5/027 , B05C5/0291 , B05C11/1002 , B05C11/1013 , B05C11/1034 , F16K31/1221
摘要： Modular devices for jetting a fluid material and components for modular jetting devices. The devices may include a pressurized air or positive displacement pump fluid supply module to supply a fluid module inlet. A syringe may feed material through a check valve to a positive displacement pump, which feeds material through another check valve to the fluid module. Inside the fluid module is a valve element moved to contact a valve seat and jet a droplet of material by contact between an external drive pin and a movable element of the fluid module. Either a piezoelectric actuator, a pneumatic actuator, or another actuator may move the drive pin. A controller may coordinate the supply of fluid from the positive displacement pump with the rate at which material is jetted. The fluid module and positive displacement pump are easily removable from the jetting device.
摘要翻译：用于喷射流体材料的模块化装置和用于模块化喷射装置的部件。装置可以包括加压空气或容积式泵流体供应模块，以供应流体模块入口。注射器可以通过止回阀将材料供给到容积式泵，该排量泵将材料通过另一止回阀送入流体模块。在流体模块内部是阀元件，其被移动以接触阀座并通过外部驱动销和流体模块的可移动元件之间的接触喷射物料滴。压电致动器，气动致动器或另一个致动器可以移动驱动销。控制器可以协调来自容积式泵的流体与喷射材料的速率。流体模块和容积式泵容易从喷射装置中移除。

13. 发明授权

US09346075B2 Modular jetting devices 有权
标题翻译：模块化喷射装置
公开(公告)号：US09346075B2
公开(公告)日：2016-05-24
申请号：US13219064
申请日：2011-08-26
申请人： Stanley Cruz Aguilar , Mani Ahmadi , Stephen Russell des Jardins , Erik Fiske , Mark Meier , Horatio Quinones , Thomas Ratledge , Robert James Wright
发明人： Stanley Cruz Aguilar , Mani Ahmadi , Stephen Russell des Jardins , Erik Fiske , Mark Meier , Horatio Quinones , Thomas Ratledge , Robert James Wright
IPC分类号： B05B1/30 , B05C5/02 , B05C11/10
CPC分类号： B05C5/0225 , B05B1/304 , B05B1/3046 , B05B15/65 , B05C5/02 , B05C5/0237 , B05C5/027 , B05C5/0291 , B05C11/1002 , B05C11/1013 , B05C11/1034 , F16K31/1221
摘要： Modular devices for jetting a fluid material and components for modular jetting devices. The devices may include a pressurized air or positive displacement pump fluid supply module to supply a fluid module inlet. A syringe may feed material through a check valve to a positive displacement pump, which feeds material through another check valve to the fluid module. Inside the fluid module is a valve element moved to contact a valve seat and jet a droplet of material by contact between an external drive pin and a movable element of the fluid module. Either a piezoelectric actuator, a pneumatic actuator, or another actuator may move the drive pin. A controller may coordinate the supply of fluid from the positive displacement pump with the rate at which material is jetted. The fluid module and positive displacement pump are easily removable from the jetting device.
摘要翻译：用于喷射流体材料的模块化装置和用于模块化喷射装置的部件。装置可以包括加压空气或容积式泵流体供应模块，以供应流体模块入口。注射器可以通过止回阀将材料供给到容积式泵，该排量泵将材料通过另一止回阀送入流体模块。在流体模块内部是阀元件，其被移动以接触阀座并通过外部驱动销和流体模块的可移动元件之间的接触喷射物料滴。压电致动器，气动致动器或另一个致动器可以移动驱动销。控制器可以协调来自容积式泵的流体与喷射材料的速率。流体模块和容积式泵容易从喷射装置中移除。

14. 发明申请

US20050161846A1 Method and apparatus for underfilling semiconductor devices 审中-公开
公开(公告)号：US20050161846A1
公开(公告)日：2005-07-28
申请号：US11067879
申请日：2005-02-28
申请人： Horatio Quinones , Liang Fang , Thomas Ratledge
发明人： Horatio Quinones , Liang Fang , Thomas Ratledge
IPC分类号： H01L21/56 , B29B9/00 , H01L21/44 , H01L21/50
CPC分类号： H01L24/28 , H01L21/563 , H01L2224/16 , H01L2224/73203 , H01L2224/83102 , H01L2224/92125 , H01L2924/01006 , H01L2924/0102 , H01L2924/01025 , H01L2924/01033 , H01L2924/01042 , H01L2924/01043 , H01L2924/01052 , H01L2924/01065 , H01L2924/01073 , H01L2924/01082 , H01L2924/12042 , H01L2924/14 , H01L2924/15787 , H01L2924/3011 , H01L2924/351 , H01L2924/00
摘要： A method and apparatus for underfilling a gap between a multi-sided die and a substrate with an encapsulant material. The die and/or the substrate is heated non-uniformly by a heat source to generate a temperature gradient therein. The heated one of the die and the substrate transfers heat energy in proportion to the temperature gradient to the encapsulant material moving in the gap. The differential heat transfer steers, guides or otherwise directs the movement of the encapsulant material in the gap. The temperature gradient may be established with heat transferred from the heat source to the die and/or the substrate by conduction, convection, or radiation. The temperature gradient may be dynamically varied as the encapsulant material moves into the gap.

15. 发明申请

US20090078720A1 METHODS FOR CONTINUOUSLY MOVING A FLUID DISPENSER WHILE DISPENSING AMOUNTS OF A FLUID MATERIAL 有权
标题翻译：流体分配器中流体分配器连续移动的方法
公开(公告)号：US20090078720A1
公开(公告)日：2009-03-26
申请号：US11859176
申请日：2007-09-21
申请人： Ronald N. Abernathy , Phillip P. Maiorca , Horatio Quinones , Thomas Ratledge
发明人： Ronald N. Abernathy , Phillip P. Maiorca , Horatio Quinones , Thomas Ratledge
IPC分类号： G01F11/10
CPC分类号： B05B12/084 , H05K1/0269 , H05K3/0005 , H05K3/0008 , H05K3/125 , H05K13/0465 , H05K2203/0126 , H05K2203/013 , H05K2203/163
摘要： Methods for applying fluid materials to a substrate, such as circuit board, while continuously moving the fluid dispenser. Some methods generally involve correcting the dispense location for each of the dispensed amounts of fluid material by executing a statistical comparison of either the predicted and actual landing locations on the substrate, or the predicted and actual positions of the dispenser at each of the dispense locations. Other methods generally involve initiating the dispensing of amounts of the fluid material at dispense locations corrected by a correction factor specified in terms of the servo cycle for the movement of the dispenser or by a correction factor specified in terms of partial servo cycles courtesy of a timer.
摘要翻译：在流体分配器连续移动的同时将流体材料施加到诸如电路板的基底上的方法。一些方法通常包括通过执行基板上的预测和实际着陆位置的统计比较，或在每个分配位置处的分配器的预测位置和实际位置来校正每个分配量的流体材料的分配位置。其他方法通常包括在通过针对分配器的运动的伺服循环所指定的校正因子校正的分配位置处引发流体材料的量的分配，或通过由计时器提供的部分伺服循环所指定的校正因子。

16. 发明授权

US08765212B2 Methods for continuously moving a fluid dispenser while dispensing amounts of a fluid material 有权
标题翻译：用于在分配流体材料的量的同时连续移动流体分配器的方法
公开(公告)号：US08765212B2
公开(公告)日：2014-07-01
申请号：US11859176
申请日：2007-09-21
申请人： Ronald N. Abernathy , Phillip P. Maiorca , Horatio Quinones , Thomas Ratledge , Clifford A. Fowler
发明人： Ronald N. Abernathy , Phillip P. Maiorca , Horatio Quinones , Thomas Ratledge , Clifford A. Fowler
IPC分类号： C23C16/52 , H05K13/04 , H05K3/00 , H05K1/02
CPC分类号： B05B12/084 , H05K1/0269 , H05K3/0005 , H05K3/0008 , H05K3/125 , H05K13/0465 , H05K2203/0126 , H05K2203/013 , H05K2203/163
摘要： Methods for applying fluid materials to a substrate, such as circuit board, while continuously moving the fluid dispenser. Some methods generally involve correcting the dispense location for each of the dispensed amounts of fluid material by executing a statistical comparison of either the predicted and actual landing locations on the substrate, or the predicted and actual positions of the dispenser at each of the dispense locations. Other methods generally involve initiating the dispensing of amounts of the fluid material at dispense locations corrected by a correction factor specified in terms of the servo cycle for the movement of the dispenser or by a correction factor specified in terms of partial servo cycles courtesy of a timer.
摘要翻译：在流体分配器连续移动的同时将流体材料施加到诸如电路板的基底上的方法。一些方法通常包括通过执行基板上的预测和实际着陆位置的统计比较，或在每个分配位置处的分配器的预测位置和实际位置来校正每个分配量的流体材料的分配位置。其他方法通常包括在通过针对分配器的运动的伺服循环所指定的校正因子校正的分配位置处引发流体材料的量的分配，或通过由计时器提供的部分伺服循环所指定的校正因子。

17. 发明申请

US20050203668A1 PDA control of a dispensing device 审中-公开
标题翻译： PDA分配装置的控制
公开(公告)号：US20050203668A1
公开(公告)日：2005-09-15
申请号：US10797768
申请日：2004-03-10
申请人： Robert Ciardella , Alec Babiarz , Chris Giusti , Thomas Ratledge
发明人： Robert Ciardella , Alec Babiarz , Chris Giusti , Thomas Ratledge
IPC分类号： G05B15/00
CPC分类号： B25J9/1679 , G05B2219/36159 , G05B2219/39448 , G05B2219/45065 , H04M1/72533
摘要： A fluid dispensing system and method therefore having a PDA controller is provided. The system includes a dispensing apparatus, a positioning system and a general purpose PDA for controlling the system. The PDA optionally includes dispensing system logic for communicating with the dispensing apparatus. The dispensing system logic optionally includes one or more of positioner control logic, create program logic, store program logic, teach logic and recall program logic. The PDA communicates with the positioning system and/or the dispensing apparatus by a wired and/or wireless connection. Optionally a plurality of dispensing systems are networked together and the PDA communicates with one or more dispensing systems via a connection to the network. The network may be wired or wireless, and the PDA may have a wired or a wireless connection to the network.
摘要翻译：因此，提供了具有PDA控制器的流体分配系统和方法。该系统包括分配装置，定位系统和用于控制系统的通用PDA。 PDA可选地包括用于与分配装置通信的分配系统逻辑。分配系统逻辑可选地包括一个或多个定位器控制逻辑，创建程序逻辑，存储程序逻辑，示教逻辑和调用程序逻辑。 PDA通过有线和/或无线连接与定位系统和/或分配装置通信。可选地，多个分配系统联网在一起，并且PDA经由与网络的连接与一个或多个分配系统通信。网络可以是有线或无线的，并且PDA可以具有到网络的有线或无线连接。

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