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11. 发明授权

US08800138B2 Method for conditioning a substrate surface for forming an electronic device thereon and resultant device 有权
标题翻译：用于调节用于在其上形成电子器件的衬底表面和所得器件的方法
公开(公告)号：US08800138B2
公开(公告)日：2014-08-12
申请号：US12394575
申请日：2009-02-27
申请人： Timothy J. Tredwell , Roger S. Kerr
发明人： Timothy J. Tredwell , Roger S. Kerr
IPC分类号： H05K3/30
CPC分类号： H01L27/1266 , H01L27/1218 , H01L29/78603 , Y10T29/49117 , Y10T29/49124 , Y10T29/49126 , Y10T29/4913 , Y10T29/49826 , Y10T156/1039 , Y10T428/24802
摘要： A method for forming an electronic device on a flexible substrate conditions a surface of the flexible substrate to increase its malleability and to provide a conditioned substrate surface. A master surface is impressed against the conditioned substrate surface. The master surface is then released from the conditioned substrate surface, thereby forming a circuit-side surface on the substrate. The electronic device is then formed on the circuit-side surface. The substrate may be supported on a carrier during the method.
摘要翻译：用于在柔性基板上形成电子器件的方法调节柔性基板的表面以增加其柔韧性并提供经调理的基底表面。主表面被压在经调理的基底表面上。然后，主表面从经调理的基板表面释放，从而在基板上形成电路侧表面。然后在电路侧表面上形成电子器件。在该方法中，衬底可以被支撑在载体上。

12. 发明授权

US08035609B2 Imaging element 有权
标题翻译：成像元素
公开(公告)号：US08035609B2
公开(公告)日：2011-10-11
申请号：US12165679
申请日：2008-07-01
申请人： Roger S. Kerr , Timothy J. Tredwell
发明人： Roger S. Kerr , Timothy J. Tredwell
IPC分类号： G09G3/36
CPC分类号： H04N5/32 , G02B26/026 , H04N5/2354
摘要： Imaging elements are provided. An imaging element has a wireless communication circuit adapted to detect a wireless communication signal and to generate a control signal; an illumination circuit having an illumination element, the illumination circuit being adapted so that the illumination element generates light at an intensity that is based upon the control signal and a body containing the wireless communication circuit and the light source, wherein the body occupies a space that is less than about five cubic millimeters. The imaging element can also incorporate radiation sensors and can provide wireless signals indicative of sampled radiation.
摘要翻译：提供成像元素。成像元件具有适于检测无线通信信号并产生控制信号的无线通信电路; 具有照明元件的照明电路，所述照明电路适于使得所述照明元件以基于所述控制信号的强度产生光，以及包含所述无线通信电路和所述光源的主体，其中，所述主体占据空间，小于约5立方毫米。成像元件还可以包括辐射传感器并且可以提供指示采样辐射的无线信号。

13. 发明授权

US08034663B2 Low cost die release wafer 有权
标题翻译：低成本脱模晶片
公开(公告)号：US08034663B2
公开(公告)日：2011-10-11
申请号：US12237127
申请日：2008-09-24
申请人： Roger S. Kerr , Timothy J. Tredwell , Seung-Ho Baek
发明人： Roger S. Kerr , Timothy J. Tredwell , Seung-Ho Baek
IPC分类号： H01L21/78
CPC分类号： H01L24/81 , H01L21/32055 , H01L21/56 , H01L24/75 , H01L2221/68322 , H01L2221/6835 , H01L2221/68354 , H01L2221/68368 , H01L2221/68372 , H01L2224/16225 , H01L2224/7565 , H01L2224/812 , H01L2224/81201 , H01L2224/81801 , H01L2224/83192 , H01L2924/00011 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01032 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01052 , H01L2924/01057 , H01L2924/01077 , H01L2924/01079 , H01L2924/14 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , Y10T29/49124 , H01L2224/0401
摘要： Exemplary embodiments provide methods and systems for assembling electronic devices, such as integrated circuit (IC) chips, using a release member having a phase change material. Specifically, IC elements/components can be selectively received, stored, inspected, repaired, and/or released in a scalable manner during the assembly of IC chips by inducing phase change of the phase change material. The release member can be glass with the IC elements grown on the glass. In some embodiments, the release member can be used for a low cost placement of the IC elements in combination with an intermediate transfer layer.
摘要翻译：示例性实施例提供了使用具有相变材料的释放构件来组装诸如集成电路（IC）芯片的电子设备的方法和系统。具体地说，可以通过引入相变材料的相变来在IC芯片的组装过程中以可缩放的方式选择性地接收，存储，检查，检查和/或释放IC元件/部件。释放构件可以是具有在玻璃上生长的IC元件的玻璃。在一些实施例中，释放构件可用于与中间转印层组合的IC元件的低成本放置。

14. 发明申请

US20100072594A1 LOW COST DIE PLACEMENT 有权
标题翻译：低成本放置
公开(公告)号：US20100072594A1
公开(公告)日：2010-03-25
申请号：US12236972
申请日：2008-09-24
申请人： Roger S. Kerr , Timothy J. Tredwell , Seung-Ho Baek
发明人： Roger S. Kerr , Timothy J. Tredwell , Seung-Ho Baek
IPC分类号： H01L23/58 , H01L21/56 , H01L21/66 , H01L21/304
CPC分类号： H01L24/81 , H01L21/32055 , H01L21/56 , H01L2221/68322 , H01L2221/6835 , H01L2221/68354 , H01L2221/68368 , H01L2221/68372 , H01L2224/16 , H01L2224/7565 , H01L2224/81001 , H01L2224/812 , H01L2224/81201 , H01L2224/81801 , H01L2924/00011 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01032 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01052 , H01L2924/01057 , H01L2924/01075 , H01L2924/01077 , H01L2924/01079 , H01L2924/014 , H01L2924/09701 , H01L2924/14 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2224/0401
摘要： Exemplary embodiments provide methods and systems for assembling electronic devices, such as integrated circuit (IC) chips, using a release member having a phase change material. Specifically, IC elements/components can be selectively received, stored, inspected, repaired, and/or released in a scalable manner during the assembly of IC chips by inducing phase change of the phase change material. The release member can be flexible or rigid. In some embodiments, the release member can be used for a low cost placement of the IC elements in combination with an SOI (silicon on insulator) wafer and/or an intermediate transfer member. In other embodiments, the release member can be used for a low cost placement of the IC elements in combination with a release wafer.
摘要翻译：示例性实施例提供了使用具有相变材料的释放构件来组装诸如集成电路（IC）芯片的电子设备的方法和系统。具体地说，可以通过引入相变材料的相变来在IC芯片的组装过程中以可缩放的方式选择性地接收，存储，检查，检查和/或释放IC元件/部件。释放构件可以是柔性的或刚性的。在一些实施例中，释放构件可用于与SOI（绝缘体上硅）晶片和/或中间转印构件组合的IC元件的低成本放置。在其他实施例中，释放构件可用于与释放晶片组合的IC元件的低成本放置。

15. 发明申请

US20100072490A1 LOW COST FLEXIBLE DISPLAY SHEET 审中-公开
标题翻译：低成本灵活的显示表
公开(公告)号：US20100072490A1
公开(公告)日：2010-03-25
申请号：US12237073
申请日：2008-09-24
申请人： Roger S. Kerr , Timothy J. Tredwell , Seung-Ho Baek
发明人： Roger S. Kerr , Timothy J. Tredwell , Seung-Ho Baek
IPC分类号： H01L21/50 , H01L33/00
CPC分类号： H01L24/81 , H01L21/32055 , H01L21/56 , H01L2221/68322 , H01L2221/6835 , H01L2221/68354 , H01L2221/68368 , H01L2221/68372 , H01L2224/16 , H01L2224/7565 , H01L2224/81001 , H01L2224/812 , H01L2224/81201 , H01L2224/81801 , H01L2924/00011 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01032 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01052 , H01L2924/01057 , H01L2924/01077 , H01L2924/01079 , H01L2924/09701 , H01L2924/14 , H01L2924/15788 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/00 , H01L2224/0401
摘要： Exemplary embodiments provide methods and systems for assembling electronic devices, such as integrated circuit (IC) chips, onto a subsequent flexible surface using a release member having a phase change material. Specifically, IC elements/components can be selectively received, stored, inspected, repaired, and/or released in a scalable manner during the assembly of IC chips by inducing phase change of the phase change material. The release member can be flexible or rigid. In some embodiments, the release member can be used with an intermediate transfer member. In some embodiments the IC element can be incorporated into a subsequent flexible surface including components for a TV, radiographic detector, sensor array, or any similar product having a requirement to emit, detect, or collect energy. In addition, the IC elements can be RF emitting, or visually emitting.
摘要翻译：示例性实施例提供了使用具有相变材料的释放构件来将诸如集成电路（IC）芯片的电子装置组装到随后的柔性表面上的方法和系统。具体地说，可以通过引入相变材料的相变来在IC芯片的组装过程中以可缩放的方式选择性地接收，存储，检查，检查和/或释放IC元件/部件。释放构件可以是柔性的或刚性的。在一些实施例中，释放构件可与中间转印构件一起使用。在一些实施例中，IC元件可以并入到随后的柔性表面中，包括用于TV，射线照相检测器，传感器阵列或具有发射，检测或收集能量的要求的任何类似产品的组件。此外，IC元件可以是RF发射或视觉发射。

16. 发明申请

US20090211791A1 SUBSTRATE FORMED ON CARRIER HAVING RETAINING FEATURES AND RESULTANT ELECTRONIC DEVICE 有权
标题翻译：具有保留功能和结果电子设备的载体上的基板
公开(公告)号：US20090211791A1
公开(公告)日：2009-08-27
申请号：US12394518
申请日：2009-02-27
申请人： Timothy J. Tredwell , Roger S. Kerr
发明人： Timothy J. Tredwell , Roger S. Kerr
IPC分类号： H05K1/00 , H05K3/30
CPC分类号： H05K3/007 , H05K1/0393 , H05K1/05 , H05K3/0052 , H05K3/303 , H05K2201/10166 , H05K2201/10598 , H05K2203/016 , H05K2203/0228 , Y10T29/4913
摘要： A method for forming an electronic device on a flexible substrate conditions at least one surface of a carrier to form at least one retaining feature on the surface for retaining a flexible substrate. The flexible substrate is provided by deposition or lamination f one or more layers of substrate material onto the carrier. A portion of the substrate is processed to form the electronic device on the processed portion of the substrate. At least the processed portion of the substrate is released from the carrier to provide the flexible substrate having electronic device formed thereon. An electronic device is formed on a flexible substrate in accordance with the method.
摘要翻译：在柔性基板上形成电子器件的方法条件是载体的至少一个表面在表面上形成用于保持柔性基底的至少一个保持特征。通过将一层或多层衬底材料沉积或层压到载体上来提供柔性基底。处理衬底的一部分以在衬底的经处理部分上形成电子器件。至少将基板的处理部分从载体上释放，以提供其上形成有电子器件的柔性基板。根据该方法在柔性基板上形成电子器件。

17. 发明申请

US20080026581A1 FLEXIBLE SUBSTRATE WITH ELECTRONIC DEVICES FORMED THEREON 失效
标题翻译：柔性基板与其形成的电子器件
公开(公告)号：US20080026581A1
公开(公告)日：2008-01-31
申请号：US11461080
申请日：2006-07-31
申请人： Timothy J. Tredwell , Roger S. Kerr
发明人： Timothy J. Tredwell , Roger S. Kerr
IPC分类号： H01L21/302
CPC分类号： H01L29/78603 , H01L27/1218 , H01L27/1262 , H01L51/0097 , Y02E10/549 , Y02P70/521
摘要： A method of manufacturing an electronic device (10) provides a substrate (20) that has a plastic material. A particulate material (16) is embedded in at least one surface of the substrate. A layer of thin-film semiconductor material is deposited onto the substrate (20).
摘要翻译：制造电子器件（10）的方法提供了具有塑料材料的基底（20）。颗粒材料（16）嵌入在基底的至少一个表面中。将一层薄膜半导体材料沉积在衬底（20）上。

18. 发明授权

US07051429B2 Method for forming a medium having data storage and communication capabilities 有权
标题翻译：用于形成具有数据存储和通信能力的介质的方法
公开(公告)号：US07051429B2
公开(公告)日：2006-05-30
申请号：US10411624
申请日：2003-04-11
申请人： Roger S. Kerr , Timothy J. Tredwell , Cheryl J. Kaminsky , Robert P. Bourdelais
发明人： Roger S. Kerr , Timothy J. Tredwell , Cheryl J. Kaminsky , Robert P. Bourdelais
IPC分类号： H01R43/00
CPC分类号： G06K19/07718 , G06K19/07745 , G06K19/07749 , H01G11/48 , H01G11/56 , H01L2224/16 , H01L2924/00014 , H01L2924/01012 , H01L2924/01019 , H01L2924/0102 , H01L2924/01078 , H01L2924/09701 , H01L2924/12044 , H01L2924/1627 , Y02E60/13 , Y10T29/49016 , Y10T29/49018 , Y10T29/4902 , Y10T29/49064 , Y10T29/49069 , Y10T29/49117 , Y10T29/4913 , Y10T29/49158 , H01L2924/00 , H01L2224/0401
摘要： A method for forming a medium having a substrate is formed have a patterned surface with a channel pattern and a transponder having a memory is provided in the channel pattern. A conductive material is deposited in the channel pattern with the conductive material operatively associated with the transponder.
摘要翻译：形成具有基板的介质的方法形成具有通道图案的图案化表面，并且具有存储器的转发器设置在通道图案中。导电材料沉积在通道图案中，导电材料与应答器可操作地相关联。

19. 发明授权

US08015702B2 Metal substrate having electronic devices formed thereon 失效
标题翻译：金属基板，其上形成有电子器件
公开(公告)号：US08015702B2
公开(公告)日：2011-09-13
申请号：US12694490
申请日：2010-01-27
申请人： Roger S. Kerr , Timothy J. Tredwell , Mark A. Harland
发明人： Roger S. Kerr , Timothy J. Tredwell , Mark A. Harland
IPC分类号： H05K3/30 , H05K3/36 , H05K3/02 , H05K3/10 , H01L21/30 , H01L21/46
CPC分类号： H01L27/1266 , H01L27/1214 , H01L29/78603 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49155
摘要： A method of forming an electronic device on a metal substrate deposits a first seed layer of a first metal on at least one master surface with a roughness less than 400 nm. A supporting metal layer is bonded to the first seed layer to form the metal substrate 10. The metal substrate is removed from the master surface, and at least one electronic device is formed on the seed layer of the metal substrate.
摘要翻译：在金属基底上形成电子器件的方法在第一金属的第一晶种层上沉积至少一个粗糙度小于400nm的母体表面。将支撑金属层接合到第一种子层以形成金属基板10.金属基板从主表面移除，并且在金属基板的籽晶层上形成至少一个电子器件。

20. 发明授权

US07977170B2 Flexible substrate with electronic devices and traces 有权
标题翻译：具有电子元件和痕迹的柔性基板
公开(公告)号：US07977170B2
公开(公告)日：2011-07-12
申请号：US11538173
申请日：2006-10-03
申请人： Timothy J. Tredwell , Roger S. Kerr
发明人： Timothy J. Tredwell , Roger S. Kerr
IPC分类号： H01L21/00 , H01L21/84 , H01L21/44 , H01L21/31 , H01L21/469
CPC分类号： H01L29/78603 , H01L27/124 , Y10T156/10
摘要： A method of manufacturing an electronic device (10) provides a substrate (20) that has a plastic material and has a metallic coating on one surface. A portion of the metallic coating is etched to form a patterned metallic coating. A particulate material (16) is embedded in at least one surface of the substrate. A layer of thin-film semiconductor material is deposited onto the substrate (20).
摘要翻译：制造电子器件（10）的方法提供了具有塑料材料并且在一个表面上具有金属涂层的基底（20）。金属涂层的一部分被蚀刻以形成图案化的金属涂层。颗粒材料（16）嵌入在基底的至少一个表面中。将一层薄膜半导体材料沉积在衬底（20）上。

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