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11. 发明申请

US20090229744A1 METHOD OF ATTACHING PRINTHEAD INTEGRATED CIRCUITS TO AN INK MANIFOLD USING ADHESIVE FILM 有权
标题翻译：使用粘合膜将打印机集成电路连接到墨水盒的方法
公开(公告)号：US20090229744A1
公开(公告)日：2009-09-17
申请号：US12049374
申请日：2008-03-17
申请人： Sarkis Minas Keshishian , Susan Williams , Paul Andrew Papworth , Kia Silverbrook
发明人： Sarkis Minas Keshishian , Susan Williams , Paul Andrew Papworth , Kia Silverbrook
IPC分类号： B32B38/10 , C09J163/00
CPC分类号： B41J2/16 , B41J2/155 , B41J2/1623 , B41J2/1634 , B41J2002/14362 , B41J2002/14419 , B41J2002/14491 , B41J2202/20 , C09J163/00 , Y10T156/10
摘要： A method of attaching one or more printhead integrated circuits to an ink supply manifold. The method comprises the steps of: (a) providing a laminated film having a plurality of ink supply holes defined therein, the laminated film comprising a central polymeric film sandwiched between first and second adhesive layers, wherein a first melt temperature of the first adhesive layer is at least 20° C. less than a second melt temperature of the second adhesive layer; (b) aligning the film with the ink supply manifold such that each ink supply hole is aligned with a respective ink outlet defined in a manifold bonding surface of the ink supply manifold; (b) bonding the first adhesive layer to the manifold bonding surface by applying heat and pressure to an opposite side of the film; (c) aligning the printhead integrated circuits with the film such that each ink supply hole is aligned with an ink inlet defined in a printhead bonding surface of each printhead integrated circuit; and (d) bonding the printhead integrated circuits to the second adhesive layer.
摘要翻译：将一个或多个打印头集成电路附接到墨水供应歧管的方法。该方法包括以下步骤：（a）提供层压膜，其中限定有多个供墨孔，所述层压膜包括夹在第一和第二粘合层之间的中心聚合物膜，其中第一粘合层的第一熔融温度低于第二粘合剂层的第二熔融温度至少20℃; （b）使膜与供墨歧管对准，使得每个供墨孔与限定在供墨歧管的歧管接合表面中的相应墨出口对齐; （b）通过向膜的相反侧施加热和压力将第一粘合剂层粘合到歧管接合表面; （c）将打印头集成电路与胶片对准，使得每个供墨孔与限定在每个打印头集成电路的打印头接合表面中的墨水入口对齐; 和（d）将打印头集成电路连接到第二粘合剂层。

12. 发明授权

US07183975B2 Attaching antenna structures to electrical feed structures 失效
标题翻译：将天线结构连接到电动馈电结构
公开(公告)号：US07183975B2
公开(公告)日：2007-02-27
申请号：US10514108
申请日：2003-05-15
申请人： Rebecca Thomas , Susan Williams , James William Kingsley
发明人： Rebecca Thomas , Susan Williams , James William Kingsley
IPC分类号： H01Q1/38
CPC分类号： H01Q21/08 , H01Q1/12 , H01Q1/241 , H01Q1/38 , H01Q9/0485
摘要： There is disclosed a dielectric antenna comprising a dielectric resonator mounted in direct contact with a microstrip transmission line formed on one side of a printed circuit board. The dielectric antenna may be a dielectric resonator antenna (DRA), a high dielectric antenna (HDA) or a dielectrically-loaded antenna. The simple construction of the antenna leads to improved manufacturing reliability and efficiency, and allows all functional features of the antenna to be located on one side of a printed circuit board (PCB) substrate.
摘要翻译：公开了一种电介质天线，包括与形成在印刷电路板的一侧上的微带传输线直接接触的介质谐振器。电介质天线可以是介质谐振器天线（DRA），高介电天线（HDA）或介电加载天线。天线的简单结构导致改进的制造可靠性和效率，并且允许天线的所有功能特征位于印刷电路板（PCB）基板的一侧。

13. 发明授权

US5505205A Interface element for medical ultrasound transducer 失效
标题翻译：医用超声波传感器接口元件
公开(公告)号：US5505205A
公开(公告)日：1996-04-09
申请号：US275562
申请日：1994-07-15
申请人： Rodney J. Solomon , Gregory G. Vogel , Robert W. King , Susan Williams
发明人： Rodney J. Solomon , Gregory G. Vogel , Robert W. King , Susan Williams
IPC分类号： A61B8/14 , A61B8/00 , G01N29/24 , G10K11/02 , G10K11/30 , H04R17/00
CPC分类号： G10K11/30 , G10K11/02
摘要： An ultrasound transducer assembly includes an ultrasound transducer for transmitting and receiving ultrasound energy and one or more interface elements for conducting transmitted ultrasound energy from the transducer to a patient's body and for conducting received ultrasound energy from the patient's body to the transducer. At least one ultrasound-transmissive interface element is fabricated of a polymeric material. The material preferably has a sound speed that approximately matches the speed of sound in human tissue. The material comprises at least one primary rigid component material and at least one secondary component material, and has a Shore D durometer hardness value of greater than about 60D, and a sound speed of between about 1,450 meters/second and about 1,700 meters/second. The ultrasound-transmissive element fabricated of a polymeric material can be a protective lens cover, an ultrasound lens or lens element, an ultrasound-transmissive window or a sound pipe.
摘要翻译：超声换能器组件包括用于传送和接收超声能量的超声换能器以及一个或多个界面元件，用于将传递的超声能量从换能器传导到患者体内，并将接收到的超声能量从患者身体传导到换能器。至少一个超声透射界面元件由聚合物材料制成。该材料优选地具有与人体组织中的声音速度近似匹配的声速。该材料包括至少一种主刚性组分材料和至少一种次要组分材料，并且具有大于约60D的肖氏D硬度计硬度值，以及约1450米/秒至约1,700米/秒之间的声速。由聚合材料制成的超声波透射元件可以是保护性透镜盖，超声波透镜或透镜元件，超声波透射窗或声管。

14. 发明授权

US08444252B2 Printhead assembly with minimal leakage 有权
标题翻译：打印头组件泄漏最小
公开(公告)号：US08444252B2
公开(公告)日：2013-05-21
申请号：US12973307
申请日：2010-12-20
申请人： Sarkis Minas Keshishian , Susan Williams , Paul Andrew Papworth , Kia Silverbrook
发明人： Sarkis Minas Keshishian , Susan Williams , Paul Andrew Papworth , Kia Silverbrook
IPC分类号： B41J2/145 , B41J2/15
CPC分类号： B41J2/16 , B41J2/155 , B41J2/1623 , B41J2/1634 , B41J2002/14362 , B41J2002/14419 , B41J2002/14491 , B41J2202/20 , C09J163/00 , Y10T156/10
摘要： A printhead assembly includes an ink manifold having a plurality of ink outlets defined in a manifold bonding surface; one or more printhead integrated circuits, each printhead integrated circuit having a plurality of ink inlets defined in a printhead bonding surface; and an adhesive film sandwiched between said manifold bonding surface and said one or more printhead bonding surfaces, said film having a plurality of ink supply holes defined therein, each ink supply hole being aligned with an ink outlet and an ink inlet. The adhesive film is a laminated film comprising a central polymeric film sandwiched between a first adhesive layer and a second adhesive layer, the first adhesive layer has a melt temperature lower than that of the second adhesive layer.
摘要翻译：打印头组件包括具有限定在歧管接合表面中的多个墨水出口的墨水歧管; 一个或多个打印头集成电路，每个打印头集成电路具有限定在打印头接合表面中的多个墨水入口; 以及夹在所述歧管接合表面和所述一个或多个打印头接合表面之间的粘合剂膜，所述膜具有限定在其中的多个供墨孔，每个供墨孔与墨水出口和墨水入口对准。粘合剂膜是包含夹在第一粘合剂层和第二粘合剂层之间的中心聚合物膜的层压膜，第一粘合剂层的熔融温度低于第二粘合剂层的熔融温度。

15. 发明授权

US08132893B2 Printhead assembly with molded ink manifold having polymer coating 有权
标题翻译：具有聚合物涂层的模制油墨歧管的打印头组件
公开(公告)号：US08132893B2
公开(公告)日：2012-03-13
申请号：US13214219
申请日：2011-08-21
申请人： Seung Jin Lee , Susan Williams , Jan Waszczuk , Kia Silverbrook
发明人： Seung Jin Lee , Susan Williams , Jan Waszczuk , Kia Silverbrook
IPC分类号： B41J2/155 , B41J2/015
CPC分类号： B41J2/14 , B41J2/16 , B41J2/1634 , B41J2/1637 , B41J2002/14419
摘要： A printhead assembly includes: a molded ink manifold having a plurality of ink outlets defined in a manifold bonding surface; and printhead integrated circuits bonded to the manifold bonding surface. The manifold bonding surface includes a polymer coating, which plugs fissures in the molded ink manifold.
摘要翻译：打印头组件包括：模制油墨歧管，其具有限定在歧管接合表面中的多个油墨出口; 以及结合到歧管接合表面的打印头集成电路。歧管接合表面包括聚合物涂层，其堵塞模制油墨歧管中的裂缝。

16. 发明申请

US20120048185A1 APPARATUS FOR FORMING ASYMMETRICAL ENCAPSULANT BEADS ON WIRE BONDS 审中-公开
标题翻译：在线上形成非对称密封珠的装置
公开(公告)号：US20120048185A1
公开(公告)日：2012-03-01
申请号：US13290114
申请日：2011-11-06
申请人： Susan Williams , Laval Chung-Long-Shan , Kiangkai Tankongchumruskul
发明人： Susan Williams , Laval Chung-Long-Shan , Kiangkai Tankongchumruskul
IPC分类号： B05C5/02 , H01L21/70 , B05C11/00
CPC分类号： H01L21/56 , H01L23/3157 , H01L24/48 , H01L24/78 , H01L24/83 , H01L24/85 , H01L2224/45015 , H01L2224/4809 , H01L2224/48091 , H01L2224/48227 , H01L2224/48472 , H01L2224/78313 , H01L2224/83 , H01L2224/85181 , H01L2224/85205 , H01L2224/859 , H01L2224/8592 , H01L2224/8593 , H01L2224/85947 , H01L2924/00014 , H01L2924/01014 , H01L2924/01033 , H01L2924/01082 , H01L2924/078 , H01L2924/09701 , H01L2924/10253 , H01L2924/14 , H01L2924/1461 , H01L2924/15153 , H01L2924/15165 , H01L2924/20753 , H01L2924/00 , H01L2924/3512 , H01L2224/45099 , H01L2924/20752 , H01L2924/20754 , H01L2224/05599
摘要： An apparatus for forming an asymmetrical encapsulant bead on a series of wire bonds electrically connecting a micro-electronic device to a series of conductors. The micro-electronic device has a planar active surface with functional elements. The apparatus includes: a tiltable table for supporting the micro-electronic device, the table being configured for tilting the planar active surface at a predetermined angle relative to the horizontal; and a jetter positioned above the tiltable structure for jetting drops of encapsulant material onto the series of wire bonds.
摘要翻译：一种用于在将微电子器件电连接到一系列导体上的一系列引线键合上形成不对称密封剂珠的装置。微电子器件具有带功能元件的平面有源表面。该装置包括：用于支撑微电子装置的可倾斜工作台，所述工作台被配置为相对于水平面以预定角度倾斜平面有源表面; 以及位于可倾斜结构上方的喷射器，用于将密封材料液滴喷射到一系列引线键合上。

17. 发明申请

US20110304672A1 PRINTHEAD ASSEMBLY WITH MOLDED INK MANIFOLD HAVING POLYMER COATING 有权
标题翻译：具有聚合物涂层的模制墨盒喷头的组件
公开(公告)号：US20110304672A1
公开(公告)日：2011-12-15
申请号：US13214219
申请日：2011-08-21
申请人： Seung Jin Lee , Susan Williams , Jan Waszczuk , Kia Silverbrook
发明人： Seung Jin Lee , Susan Williams , Jan Waszczuk , Kia Silverbrook
IPC分类号： B41J2/14
CPC分类号： B41J2/14 , B41J2/16 , B41J2/1634 , B41J2/1637 , B41J2002/14419
摘要： A printhead assembly includes: a molded ink manifold having a plurality of ink outlets defined in a manifold bonding surface; and printhead integrated circuits bonded to the manifold bonding surface. The manifold bonding surface includes a polymer coating, which plugs fissures in the molded ink manifold.
摘要翻译：打印头组件包括：模制油墨歧管，其具有限定在歧管接合表面中的多个油墨出口; 以及结合到歧管接合表面的打印头集成电路。歧管接合表面包括聚合物涂层，其堵塞模制油墨歧管中的裂缝。

18. 发明授权

US07875139B2 Method of assembling pagewidth printhead 失效
标题翻译：组合页宽打印头的方法
公开(公告)号：US07875139B2
公开(公告)日：2011-01-25
申请号：US12783506
申请日：2010-05-19
申请人： Sarkis Minas Keshishian , Susan Williams , Paul Andrew Papworth , Kia Silverbrook
发明人： Sarkis Minas Keshishian , Susan Williams , Paul Andrew Papworth , Kia Silverbrook
IPC分类号： B29C65/00 , B29C65/02 , B32B37/00 , B32B38/00 , B31B1/60
CPC分类号： B41J2/16 , B41J2/155 , B41J2/1623 , B41J2/1634 , B41J2002/14362 , B41J2002/14419 , B41J2002/14491 , B41J2202/20 , C09J163/00 , Y10T156/10
摘要： A method of assembling a pagewidth printhead. The method includes: aligning a multilayered adhesive film an said ink supply manifold such that ink supply holes in the film are aligned with respective ink outlets in the ink supply manifold; bonding a first adhesive layer of the film to a manifold bonding surface; heating a printhead integrated circuit and positioning the heated printhead integrated circuit on an opposite side of the film such that each ink supply hole is aligned with an ink inlet defined in a printhead bonding surface of the printhead integrated circuit; and repeatedly bonding printhead integrated circuits to the film to provide the pagewidth printhead.
摘要翻译：一种组合页宽打印头的方法。该方法包括：将多层粘合剂膜与所述供墨歧管对准，使得膜中的墨供应孔与供墨歧管中的相应墨出口对准; 将膜的第一粘合剂层粘合到歧管接合表面; 加热打印头集成电路并将加热的打印头集成电路定位在膜的相对侧上，使得每个供墨孔与限定在打印头集成电路的打印头接合表面中的墨水入口对齐; 并将打印头集成电路重复地粘合到胶片上以提供页宽打印头。

19. 发明授权

US07727348B2 Method of attaching printhead integrated circuits to an ink manifold using adhesive film 有权
标题翻译：使用粘合膜将打印头集成电路连接到墨水歧管的方法
公开(公告)号：US07727348B2
公开(公告)日：2010-06-01
申请号：US12049374
申请日：2008-03-17
申请人： Sarkis Minas Keshishian , Susan Williams , Paul Andrew Papworth , Kia Silverbrook
发明人： Sarkis Minas Keshishian , Susan Williams , Paul Andrew Papworth , Kia Silverbrook
IPC分类号： B29C65/00 , B29C65/02 , B32B37/00 , B32B38/00 , B31B1/60
CPC分类号： B41J2/16 , B41J2/155 , B41J2/1623 , B41J2/1634 , B41J2002/14362 , B41J2002/14419 , B41J2002/14491 , B41J2202/20 , C09J163/00 , Y10T156/10
摘要： A method of attaching one or more printhead integrated circuits to an ink supply manifold. The method comprises the steps of: (a) providing a laminated film having a plurality of ink supply holes defined therein, the laminated film comprising a central polymeric film sandwiched between first and second adhesive layers, wherein a first melt temperature of the first adhesive layer is at least 20° C. less than a second melt temperature of the second adhesive layer; (b) aligning the film with the ink supply manifold such that each ink supply hole is aligned with a respective ink outlet defined in a manifold bonding surface of the ink supply manifold; (b) bonding the first adhesive layer to the manifold bonding surface by applying heat and pressure to an opposite side of the film; (c) aligning the printhead integrated circuits with the film such that each ink supply hole is aligned with an ink inlet defined in a printhead bonding surface of each printhead integrated circuit; and (d) bonding the printhead integrated circuits to the second adhesive layer.
摘要翻译：将一个或多个打印头集成电路附接到墨水供应歧管的方法。该方法包括以下步骤：（a）提供层压膜，其中限定有多个供墨孔，所述层压膜包括夹在第一和第二粘合层之间的中心聚合物膜，其中第一粘合层的第一熔融温度低于第二粘合剂层的第二熔融温度至少20℃; （b）使膜与供墨歧管对准，使得每个供墨孔与限定在供墨歧管的歧管接合表面中的相应墨出口对齐; （b）通过向膜的相对侧施加热和压力将第一粘合剂层粘合到歧管接合表面; （c）将打印头集成电路与胶片对准，使得每个供墨孔与限定在每个打印头集成电路的打印头接合表面中的墨水入口对齐; 和（d）将打印头集成电路连接到第二粘合剂层。

20. 发明申请

US20090079097A1 ELECTRONIC COMPONENT WITH WIRE BONDS IN LOW MODULUS FILL ENCAPSULANT 审中-公开
公开(公告)号：US20090079097A1
公开(公告)日：2009-03-26
申请号：US12237387
申请日：2008-09-25
申请人： Susan Williams , Laval Chung-Long-Shan , Kiangkai Tankongchumruskul
发明人： Susan Williams , Laval Chung-Long-Shan , Kiangkai Tankongchumruskul
IPC分类号： H01L23/28
CPC分类号： H01L21/56 , H01L23/3157 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/78 , H01L24/85 , H01L2224/45015 , H01L2224/451 , H01L2224/4809 , H01L2224/48091 , H01L2224/48227 , H01L2224/48472 , H01L2224/49175 , H01L2224/78313 , H01L2224/85181 , H01L2224/85205 , H01L2224/859 , H01L2224/8592 , H01L2224/8593 , H01L2224/85947 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01014 , H01L2924/01033 , H01L2924/01047 , H01L2924/01082 , H01L2924/09701 , H01L2924/10253 , H01L2924/12041 , H01L2924/14 , H01L2924/1461 , H01L2924/15153 , H01L2924/15165 , H01L2924/20753 , H01L2924/20752 , H01L2924/00 , H01L2924/20754 , H01L2224/05599
摘要： An electronic component that has a support structure with a plurality of electrical conductors, a series of wire bonds, each of the wire bonds extending from one of the electrical conductors respectively, each of the wire bonds having an end section contacting the electrical conductor and an intermediate section contiguous with the end section, a bead of dam encapsulant encapsulating the electrical conductors and the end section of each of the wire bonds, and a bead of fill encapsulant contacting the bead of dam encapsulant and encapsulating the intermediate portion of each of the wire bonds. The dam encapsulant has a higher modulus of elasticity than the fill encapsulant.

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