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    • 12. 发明授权
    • Radio frequency identification (RFID) in communication connections, including fiber optic components
    • 通信连接中的射频识别(RFID),包括光纤组件
    • US08333518B2
    • 2012-12-18
    • US13418752
    • 2012-03-13
    • Ashley Wesley JonesPeter Timothy TravisJames Scott Sutherland
    • Ashley Wesley JonesPeter Timothy TravisJames Scott Sutherland
    • G02B6/36H04B10/12G08B13/14
    • G02B6/3895G02B6/3825G02B6/3879G02B6/3885G02B6/3893
    • Radio frequency identification (RFID)-equipped communication components are disclosed. The communication components can include fiber optic components, such as fiber optic connectors and fiber optic adapters as examples. An RFID-equipped circuit is provided in the communication components to communicate information. In order that the electrical circuit be provided in the communication component without altering the communication component connection type, the circuit may be disposed in at least one recessed area of the communication component housing. In this manner, the communication component maintains its connection type such that it is compatible with a complementary communication component connection type for backwards compatibility while also being RFID-equipped. The circuit may also be provided in a substrate containing one or more electrical contacts coupled to the circuit such that a wired coupling is established with one or more electrical contacts provided in another communication component when connected.
    • 公开了射频识别(RFID)装置的通信部件。 通信组件可以包括光纤组件,例如光纤连接器和光纤适配器。 在通信部件中提供配备RFID的电路以传送信息。 为了使电路设置在通信部件中而不改变通信部件连接类型,电路可以设置在通信部件壳体的至少一个凹陷区域中。 以这种方式,通信组件保持其连接类型,使得其与用于向后兼容性的互补通信组件连接类型兼容,同时还具有RFID装备。 电路还可以设置在包含耦合到电路的一个或多个电触点的基板中,使得当连接时,在与另一个通信部件中提供的一个或多个电触点建立有线耦合。
    • 17. 发明申请
    • HONEYCOMB MINI-REACTOR SYSTEMS AND METHODS
    • 蜂窝电子微反应器系统和方法
    • US20100132928A1
    • 2010-06-03
    • US12623737
    • 2009-11-23
    • James Scott Sutherland
    • James Scott Sutherland
    • F28F9/22B21D53/02F28D7/00
    • B21D53/02B01J19/2485F28F7/02F28F21/04Y10T29/49345Y10T29/4935
    • Disclosed is a reactor or reactor component comprising a honeycomb structure having cells extending along a common direction and having one or more passages each extending across at least some of the cells, wherein the path or paths of the one or more passages, taken within a plane perpendicular to the common direction, includes or include a number of repeating sub-path units arranged in a two-dimensional array, each sub-path unit including one or more turns or bends in the path. Methods of making, and methods of use, including resulting standardized reactor or reactor component systems, and standardized reactor or reactor component engineering or design, are also disclosed.
    • 公开了一种反应器或反应器部件,其包括蜂窝结构,蜂窝结构具有沿公共方向延伸的单元,并且具有跨越至少一些单元的一个或多个通道,其中一个或多个通道的路径在一个平面内 垂直于公共方向,包括或包括以二维阵列布置的多个重复子路径单元,每个子路径单元包括路径中的一个或多个匝或弯曲。 还公开了制备方法和使用方法,包括得到的标准化反应器或反应器组分体系,以及标准化反应器或反应器组件工程或设计。
    • 18. 发明授权
    • Glass-based micropositioning systems and methods
    • 玻璃微定位系统和方法
    • US07724992B2
    • 2010-05-25
    • US11978411
    • 2007-10-29
    • James Scott Sutherland
    • James Scott Sutherland
    • G02B6/26
    • G02B6/4226G02B6/30G02B6/423G02B6/4234G02B6/4239G02B7/003
    • A method of forming a microbump for micropositioning an optical element comprises providing a base substrate, providing a first optical element to be supported by the base substrate, and providing an alignment element capable of locally expanding when locally heated and adapted to support the first optical element from the base substrate. The method further comprises locally heating the alignment element to cause local expansion of the alignment element so as to create a microbump alignment element, terminating heating of the alignment element so as to fix the microbump and securing the alignment element to the base substrate, thereby supporting the first optical element from the base substrate.
    • 形成用于微定位光学元件的微型块的方法包括提供基底基板,提供要由基底基板支撑的第一光学元件,以及提供一种当局部加热时能够局部扩张并适于支撑第一光学元件的对准元件 从基底。 该方法还包括局部加热对准元件以引起对准元件的局部膨胀,以便产生微型块对准元件,终止对准元件的加热,以便固定微型储存器并将对准元件固定到基底基板上,从而支撑 该第一光学元件来自该基底。