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    • 13. 发明授权
    • System and method for making a LDMOS device with electrostatic discharge protection
    • 制造具有静电放电保护功能的LDMOS器件的系统和方法
    • US07414287B2
    • 2008-08-19
    • US11063312
    • 2005-02-21
    • Sameer P. PendharkarJonathan S. Brodsky
    • Sameer P. PendharkarJonathan S. Brodsky
    • H01L29/94
    • H01L29/66681H01L27/088H01L29/086H01L29/42368H01L29/7436H01L29/749H01L29/7816
    • A semiconductor device includes one or more LDMOS transistors and one of more SCR-LDMOS transistors. Each LDMOS transistor includes a LDMOS well of a first conductivity type, a LDMOS source region of a second conductivity type formed in the LDMOS well, and a LDMOS drain region of a second conductivity type separated from the LDMOS well by a LDMOS drift region of the second conductivity type. Each SCR-LDMOS transistor comprising a SCR-LDMOS well of the first conductivity type, a SCR-LDMOS source region of the second conductivity type formed in the SCR-LDMOS well, a SCR-LDMOS drain region of a second conductivity type, and a anode region of the first conductivity type between the SCR-LDMOS drain region and the SCR-LDMOS drift region. The anode region is separated from the SCR-LDMOS well by a SCR-LDMOS drift region of the second conductivity type.
    • 半导体器件包括一个或多个LDMOS晶体管和一个更多的SCR-LDMOS晶体管。 每个LDMOS晶体管包括第一导电类型的LDMOS阱,在LDMOS阱中形成的第二导电类型的LDMOS源极区,以及由LDMOS阱的LDMOS漂移区分离的第二导电类型的LDMOS漏极区, 第二导电类型。 每个SCR-LDMOS晶体管包括第一导电类型的SCR-LDMOS阱,形成在SCR-LDMOS阱中的第二导电类型的SCR-LDMOS源区,第二导电类型的SCR-LDMOS漏极区和 SCR-LDMOS漏区和SCR-LDMOS漂移区之间的第一导电类型的阳极区。 阳极区域通过第二导电类型的SCR-LDMOS漂移区与SCR-LDMOS阱分离。
    • 20. 发明授权
    • Low resistance LDMOS with reduced gate charge
    • 低电阻LDMOS具有减少的栅极电荷
    • US09362398B2
    • 2016-06-07
    • US13281274
    • 2011-10-25
    • Sameer P. Pendharkar
    • Sameer P. Pendharkar
    • H01L29/66H01L29/78H01L29/06H01L29/40H01L29/423
    • H01L29/7835H01L29/0653H01L29/402H01L29/4238H01L29/66659
    • An integrated circuit containing an MOS transistor with a drain drift region adjacent to the channel region, a field oxide element in the drain region, a first gate section over the channel region and a second gate section over the field oxide element, with a gap between the gate sections so that at least half of the drift region is not covered by gate. A process of forming an integrated circuit containing an MOS transistor with a drain drift region adjacent to the channel region, a field oxide element in the drain region, a first gate section over the channel region and a second gate section over the field oxide element, with a gap between the gate sections so that at least half of the drift region is not covered by gate, so that the source/drain implant is blocked from the drift region below the gap.
    • 一种集成电路,其包含具有与沟道区相邻的漏极漂移区域的MOS晶体管,漏极区域中的场氧化物元件,沟道区域上的第一栅极部分以及场氧化物元件上方的第二栅极部分之间的间隙, 栅极部分,使得漂移区域的至少一半不被栅极覆盖。 一种形成集成电路的过程,该集成电路包含具有与沟道区相邻的漏极漂移区的MOS晶体管,漏极区中的场氧化物元件,沟道区上的第一栅极部分和场氧化物元件上的第二栅极部分, 在栅极部分之间具有间隙,使得至少一半的漂移区域不被栅极覆盖,使得源极/漏极注入被阻挡在间隙下方的漂移区域。