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    • 13. 发明授权
    • Method of forming contacts, methods of contacting lines, methods of operating integrated circuitry, and integrated circuits
    • 形成触点的方法,接触线的方法,操作集成电路的方法和集成电路
    • US06784502B2
    • 2004-08-31
    • US09512978
    • 2000-02-24
    • Robert KerrBrian ShirleyLuan C. TranTyler A. Lowrey
    • Robert KerrBrian ShirleyLuan C. TranTyler A. Lowrey
    • H01L2976
    • H01L27/10897H01L21/76895H01L23/535H01L27/10891H01L27/10894H01L2924/0002H01L2924/00
    • Methods of forming contacts, methods of contacting lines, methods of operating integrated circuitry, and related integrated circuitry constructions are described. In one embodiment, a plurality of conductive lines are formed over a substrate and diffusion regions are formed within the substrate elevationally below the lines. The individual diffusion regions are disposed proximate individual conductive line portions and collectively define therewith individual contact pads with which electrical connection is desired. Insulative material is formed over the conductive line portions and diffusion regions, with contact openings being formed therethrough to expose portions of the individual contact pads. Conductive contacts are formed within the contact openings and in electrical connection with the individual contact pads. In a preferred embodiment, the substrate and diffusion regions provide a pn junction which is configured for biasing into a reverse-biased diode configuration. In operation, the pn junction is sufficiently biased to preclude electrical shorting between the conductive line and the substrate for selected magnitudes of electrical current provided through the conductive line and the conductive material forming the conductive contacts.
    • 描述形成触点的方法,接触线的方法,操作集成电路的方法以及相关的集成电路结构。 在一个实施例中,多个导电线形成在衬底之上,扩散区形成在衬底正下方的线下方。 单独的扩散区域设置在各个导电线部分附近,并且与其共同地限定需要电连接的各个接触焊盘。 绝缘材料形成在导电线部分和扩散区域上,其中接触开口穿过其形成以暴露各个接触焊盘的部分。 导电触点形成在接触开口内并与各个接触垫电连接。 在优选实施例中,衬底和扩散区域提供pn结,其被配置为偏置成反向偏置二极管配置。 在操作中,pn结被充分地偏置,以防止导电线和衬底之间的电短路,用于通过导电线和形成导电触点的导电材料提供的选定大小的电流。
    • 14. 发明授权
    • Methods of forming contacts, methods of contacting lines, methods of operating integrated circuitry, and integrated circuits
    • 形成触点的方法,接触线的方法,操作集成电路的方法和集成电路
    • US06380023B2
    • 2002-04-30
    • US09146115
    • 1998-09-02
    • Robert KerrBrian ShirleyLuan C. TranTyler A. Lowrey
    • Robert KerrBrian ShirleyLuan C. TranTyler A. Lowrey
    • H01L218234
    • H01L27/10897H01L21/76895H01L23/535H01L27/10891H01L27/10894H01L2924/0002H01L2924/00
    • Methods of forming contacts, methods of contacting lines, methods of operating integrated circuitry, and related integrated circuitry constructions are described. In one embodiment, a plurality of conductive lines are formed over a substrate and diffusion regions are formed within the substrate elevationally below the lines. The individual diffusion regions are disposed proximate individual conductive line portions and collectively define therewith individual contact pads with which electrical connection is desired. Insulative material is formed over the conductive line portions and diffusion regions, with contact openings being formed therethrough to expose portions of the individual contact pads. Conductive contacts are formed within the contact openings and in electrical connection with the individual contact pads. In a preferred embodiment, the substrate and diffusion regions provide a pn junction which is configured for biasing into a reverse-biased diode configuration. In operation, the pn junction is sufficiently biased to preclude electrical shorting between the conductive line and the substrate for selected magnitudes of electrical current provided through the conductive line and the conductive material forming the conductive contacts.
    • 描述形成触点的方法,接触线的方法,操作集成电路的方法以及相关的集成电路结构。 在一个实施例中,多个导电线形成在衬底之上,扩散区形成在衬底正下方的线下方。 单独的扩散区域设置在各个导电线部分附近,并且与其共同地限定需要电连接的各个接触焊盘。 绝缘材料形成在导电线部分和扩散区域上,其中接触开口穿过其形成以暴露各个接触焊盘的部分。 导电触点形成在接触开口内并与各个接触垫电连接。 在优选实施例中,衬底和扩散区域提供pn结,其被配置为偏置成反向偏置二极管配置。 在操作中,pn结被充分地偏置,以防止导电线和衬底之间的电短路,用于通过导电线和形成导电触点的导电材料提供的选定大小的电流。
    • 15. 发明授权
    • Methods of forming integrated circuitry and integrated circuitry
    • 形成集成电路和集成电路的方法
    • US06215151B1
    • 2001-04-10
    • US09255667
    • 1999-02-23
    • Zhiqiang WuLuan C. TranRobert KerrShubneesh BatraRongsheng Yang
    • Zhiqiang WuLuan C. TranRobert KerrShubneesh BatraRongsheng Yang
    • H01L27148
    • H01L21/823807
    • Integrated circuitry and methods of forming integrated circuitry are described. In one implementation, a common masking step is utilized to provide source/drain diffusion regions and halo ion implantation or dopant regions relative to the source/drain regions within one well region of a substrate; and well contact diffusion regions within another well region of the substrate. The common masking step preferably defines at least one mask opening over the substrate within which the well contact diffusion region is to be formed, and the mask opening is suitably dimensioned to reduce the amount of halo ion implantation dopant which ultimately reaches the substrate therebelow. According to one aspect, a plurality of mask openings are provided. According to another aspect, a suitably-dimensioned single mask opening is provided. In yet another aspect, a unique well region construction is provided with one or more complementary mask openings which is (are) configured to, in connection with the provision of the halo ion implantation dopant, block the amount of implantation dopant which ultimately reaches the substrate adjacent the well contact diffusion regions. Accordingly, at least some of the well contact diffusion region(s) remain in substantial contact with the well region after the doping of the substrate with the halo ion implantation dopant.
    • 描述了形成集成电路的集成电路和方法。 在一个实现中,利用公共掩模步骤来相对于衬底的一个阱区域内的源极/漏极区域提供源极/漏极扩散区域和晕圈离子注入或掺杂区域; 以及在衬底的另一个阱区域内的良好接触扩散区域。 常见的掩蔽步骤优选地限定在其上将要形成阱接触扩散区的衬底上的至少一个掩模开口,并且掩模开口被适当地设定尺寸以减少最终到达衬底的卤素离子注入掺杂剂的量。 根据一个方面,提供了多个掩模开口。 根据另一方面,提供了适当尺寸的单个掩模开口。 在另一方面,独特的井区结构设置有一个或多个互补掩模开口,其被配置为与提供卤素离子注入掺杂剂相结合,阻止最终到达衬底的注入掺杂剂的量 邻近阱接触扩散区。 因此,在用卤素离子注入掺杂剂掺杂衬底之后,至少一些阱接触扩散区域保持与阱区基本接触。
    • 19. 发明授权
    • Double LDD devices for improved DRAM refresh
    • 双LDD器件可改善DRAM刷新
    • US06759288B2
    • 2004-07-06
    • US10208830
    • 2002-08-01
    • Luan C. TranMark McQueenRobert Kerr
    • Luan C. TranMark McQueenRobert Kerr
    • H01L21337
    • H01L27/10894H01L27/10897H01L29/6653H01L29/6656H01L29/6659
    • An integrated circuit device with improved DRAM refresh characteristics, and a novel method of making the device, is provided. A semiconductor substrate is provided with gate structures formed on its surface in each of an array portion and a peripheral portion. Single lightly doped regions are formed adjacent to the channel regions by ion implantation in the substrate. Dielectric spacers having a first width are formed on the substrate surface adjacent to the gate structures covering at least a portion of the single lightly doped regions. Heavily-doped regions are ion-implanted on opposite sides of the gate structure in the peripheral portion. The dielectric spacers are etched back to a second width smaller than the first width. Double lightly doped regions are formed by ion implantation in the substrate in an area of the substrate left exposed by the spacer etch back. Triple lightly doped regions may be also be formed by a first implant at the gate edge, a second implant through an intermediate spacer, and a third implant after the spacer etch back.
    • 提供了具有改进的DRAM刷新特性的集成电路器件,以及制造该器件的新颖方法。 半导体基板在阵列部分和周边部分中的表面上设置有栅极结构。 单个轻掺杂区域通过在衬底中的离子注入形成在沟道区附近。 具有第一宽度的电介质间隔物形成在与覆盖单个轻掺杂区域的至少一部分的栅极结构相邻的衬底表面上。 重掺杂区域被离子注入在外围部分中的栅极结构的相对侧上。 电介质间隔物被回蚀到小于第一宽度的第二宽度。 通过离子注入形成双重轻掺杂区域,该衬底在衬底的由间隔物回蚀刻暴露的区域中。 三个轻掺杂区域也可以通过在栅极边缘处的第一注入,通过中间间隔物的第二植入物和间隔物回蚀后的第三植入物形成。
    • 20. 发明授权
    • Double LDD devices for improved dram refresh
    • 双LDD设备,可改善电脑刷新
    • US06455362B1
    • 2002-09-24
    • US09642780
    • 2000-08-22
    • Luan C. TranMark McQueenRobert Kerr
    • Luan C. TranMark McQueenRobert Kerr
    • H01L21337
    • H01L27/10894H01L27/10897H01L29/6653H01L29/6656H01L29/6659
    • An integrated circuit device with improved DRAM refresh characteristics, and a novel method of making the device, is provided. A semiconductor substrate is provided with gate structures formed on its surface in each of an array portion and a peripheral portion. Single lightly doped regions are formed adjacent to the channel regions by ion implantation in the substrate. Dielectric spacers having a first width are formed on the substrate surface adjacent to the gate structures covering at least a portion of the single lightly doped regions. Heavily-doped regions are ion-implanted on opposite sides of the gate structure in the peripheral portion. The dielectric spacers are etched back to a second width smaller than the first width. Double lightly doped regions are formed by ion implantation in the substrate in an area of the substrate left exposed by the spacer etch back. Triple lightly doped regions may be also be formed by a first implant at the gate edge, a second implant through an intermediate spacer, and a third implant after the spacer etch back.
    • 提供了具有改进的DRAM刷新特性的集成电路器件,以及制造该器件的新颖方法。 半导体基板在阵列部分和周边部分中的表面上设置有栅极结构。 单个轻掺杂区域通过在衬底中的离子注入形成在沟道区附近。 具有第一宽度的电介质间隔物形成在与覆盖单个轻掺杂区域的至少一部分的栅极结构相邻的衬底表面上。 重掺杂区域被离子注入在外围部分中的栅极结构的相对侧上。 电介质间隔物被回蚀到小于第一宽度的第二宽度。 通过离子注入形成双重轻掺杂区域,该衬底在衬底的由间隔物回蚀刻暴露的区域中。 三个轻掺杂区域也可以通过在栅极边缘处的第一注入,通过中间间隔物的第二植入物和间隔物回蚀后的第三植入物形成。