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11. 发明授权

US07457111B2 Computer component protection 失效
标题翻译：计算机组件保护
公开(公告)号：US07457111B2
公开(公告)日：2008-11-25
申请号：US11624141
申请日：2007-01-17
申请人： Nick Merz , John DiFonzo , Stephen Zadesky , Michael Prichard
发明人： Nick Merz , John DiFonzo , Stephen Zadesky , Michael Prichard
IPC分类号： G06F1/16
CPC分类号： G06F1/20 , F28D15/02 , F28D15/0275 , F28F3/02 , G02F1/133308 , G02F2201/503 , G06F1/1616 , G06F1/1637 , G06F1/1656 , G06F1/1658 , G06F1/1662 , G06F1/1681 , G06F1/183 , G06F1/184 , G06F1/187 , G06F1/203 , G11B33/08 , G11B33/1426 , H01L23/367 , H01L23/427 , H01L2924/0002 , H05K7/20336 , Y10T29/4935 , H01L2924/00
摘要： A computing device is disclosed. The computing device includes a shock mount assembly that is configured to provide impact absorption to sensitive components such as a display and an optical disk drive. The computing device also includes an enclosureless optical disk drive that is housed by an enclosure and other structures of the computing device. The computing device further includes a heat transfer system that removes heat from a heat producing element of the computing device. The heat transfer system is configured to thermally couple the heat producing element to a structural member of the computing device so as to sink heat through the structural member, which generally has a large surface area for dissipating the heat.
摘要翻译：公开了一种计算设备。该计算装置包括一个冲击安装组件，其被配置为向诸如显示器和光盘驱动器的敏感部件提供冲击吸收。计算设备还包括由机壳和计算设备的其他结构容纳的无外壳光盘驱动器。计算装置还包括从计算装置的发热元件移除热量的传热系统。传热系统被配置为将发热元件热耦合到计算装置的结构构件，以便通过结构构件吸收热量，结构构件通常具有用于散热的大的表面积。

12. 发明授权

US07019967B2 Computer component protection 有权
公开(公告)号：US07019967B2
公开(公告)日：2006-03-28
申请号：US11002484
申请日：2004-12-01
申请人： John DiFonzo , Stephen Zadesky , Michael Prichard
发明人： John DiFonzo , Stephen Zadesky , Michael Prichard
IPC分类号： H05K7/20
CPC分类号： G06F1/20 , F28D15/02 , F28D15/0275 , F28F3/02 , G02F1/133308 , G02F2201/503 , G06F1/1616 , G06F1/1637 , G06F1/1656 , G06F1/1658 , G06F1/1662 , G06F1/1681 , G06F1/183 , G06F1/184 , G06F1/187 , G06F1/203 , G11B33/08 , G11B33/1426 , H01L23/367 , H01L23/427 , H01L2924/0002 , H05K7/20336 , Y10T29/4935 , H01L2924/00
摘要： A computing device is disclosed. The computing device includes a shock mount assembly that is configured to provide impact absorption to sensitive components such as a display and an optical disk drive. The computing device also includes an enclosureless optical disk drive that is housed by an enclosure and other structures of the computing device. The computing device further includes a heat transfer system that removes heat from a heat producing element of the computing device. The heat transfer system is configured to thermally couple the heat producing element to a structural member of the computing device so as to sink heat through the structural member, which generally has a large surface area for dissipating the heat.

13. 发明申请

US20050117292A1 Computer component protection 有权
标题翻译：计算机组件保护
公开(公告)号：US20050117292A1
公开(公告)日：2005-06-02
申请号：US11002484
申请日：2004-12-01
申请人： John DiFonzo , Stephen Zadesky , Michael Prichard
发明人： John DiFonzo , Stephen Zadesky , Michael Prichard
IPC分类号： G02F1/13 , G06F1/16 , G06F1/18 , G06F1/20 , G11B33/08 , G11B33/14
CPC分类号： G06F1/20 , F28D15/02 , F28D15/0275 , F28F3/02 , G02F1/133308 , G02F2201/503 , G06F1/1616 , G06F1/1637 , G06F1/1656 , G06F1/1658 , G06F1/1662 , G06F1/1681 , G06F1/183 , G06F1/184 , G06F1/187 , G06F1/203 , G11B33/08 , G11B33/1426 , H01L23/367 , H01L23/427 , H01L2924/0002 , H05K7/20336 , Y10T29/4935 , H01L2924/00
摘要： A computing device is disclosed. The computing device includes a shock mount assembly that is configured to provide impact absorption to sensitive components such as a display and an optical disk drive. The computing device also includes an enclosureless optical disk drive that is housed by an enclosure and other structures of the computing device. The computing device further includes a heat transfer system that removes heat from a heat producing element of the computing device. The heat transfer system is configured to thermally couple the heat producing element to a structural member of the computing device so as to sink heat through the structural member, which generally has a large surface area for dissipating the heat.
摘要翻译：公开了一种计算设备。该计算装置包括一个冲击安装组件，其被配置为向诸如显示器和光盘驱动器的敏感部件提供冲击吸收。计算设备还包括由机壳和计算设备的其他结构容纳的无外壳光盘驱动器。计算装置还包括从计算装置的发热元件移除热量的传热系统。传热系统被配置为将发热元件热耦合到计算装置的结构构件，以便通过结构构件吸收热量，结构构件通常具有用于散热的大的表面积。

14. 发明授权

US08605426B2 Heat dissipation in computing device 有权
公开(公告)号：US08605426B2
公开(公告)日：2013-12-10
申请号：US13244108
申请日：2011-09-23
申请人： Nick Merz , John DiFonzo , Stephen Zadesky , Michael Prichard
发明人： Nick Merz , John DiFonzo , Stephen Zadesky , Michael Prichard
IPC分类号： H05K7/20
CPC分类号： G06F1/20 , F28D15/02 , F28D15/0275 , F28F3/02 , G02F1/133308 , G02F2201/503 , G06F1/1616 , G06F1/1637 , G06F1/1656 , G06F1/1658 , G06F1/1662 , G06F1/1681 , G06F1/183 , G06F1/184 , G06F1/187 , G06F1/203 , G11B33/08 , G11B33/1426 , H01L23/367 , H01L23/427 , H01L2924/0002 , H05K7/20336 , Y10T29/4935 , H01L2924/00
摘要： A computing device is disclosed. The computing device includes a shock mount assembly that is configured to provide impact absorption to sensitive components such as a display and an optical disk drive. The computing device also includes an enclosureless optical disk drive that is housed by an enclosure and other structures of the computing device. The computing device further includes a heat transfer system that removes heat from a heat producing element of the computing device. The heat transfer system is configured to thermally couple the heat producing element to a structural member of the computing device so as to sink heat through the structural member, which generally has a large surface area for dissipating the heat.

15. 发明授权

US08587955B2 Electronic device with a ceramic component 有权
标题翻译：具有陶瓷元件的电子元件
公开(公告)号：US08587955B2
公开(公告)日：2013-11-19
申请号：US11752854
申请日：2007-05-23
申请人： John DiFonzo , Chris Ligtenberg
发明人： John DiFonzo , Chris Ligtenberg
IPC分类号： H05K1/18
CPC分类号： G06F1/1698 , G06F1/1613 , G06F1/1656 , G06F1/1662 , G06F1/169
摘要： An electronic device is disclosed. The electronic device may include a component made of a ceramic material. The electronic device may also include circuitry configured to transmit signals. The signals may pertain to input received through the component.
摘要翻译：公开了一种电子设备。电子设备可以包括由陶瓷材料制成的部件。电子设备还可以包括被配置为传输信号的电路。信号可能与通过组件接收的输入有关。

16. 发明授权

US08562886B2 Composite laminate having an improved cosmetic surface and method of making same 有权
标题翻译：具有改善的化妆品表面的复合层压板及其制造方法
公开(公告)号：US08562886B2
公开(公告)日：2013-10-22
申请号：US12875885
申请日：2010-09-03
申请人： John DiFonzo , Chris Ligtenberg
发明人： John DiFonzo , Chris Ligtenberg
IPC分类号： B29C70/02
CPC分类号： D03D15/02 , B29C70/083 , B29C70/34 , B32B5/022 , B32B5/26 , B32B2260/023 , B32B2260/046 , B32B2262/101 , B32B2262/106 , B32B2307/718 , B32B2457/00 , D10B2101/12 , Y10T428/24124 , Y10T428/24132 , Y10T428/249921 , Y10T442/184 , Y10T442/191 , Y10T442/198 , Y10T442/2984 , Y10T442/2992 , Y10T442/30
摘要： A composite laminate includes a plurality of sheets of prepreg stacked one over another, and a scrim layer provided on an exterior surface of the sheets of prepreg. Each prepreg sheet is formed of fibers preimpregnated with resin. The scrim layer and the sheets of prepreg form a composite laminate whereby the scrim layer constitutes an outer, exposed surface of the composite laminate. The scrim layer may be a nonwoven carbon or glass fiber scrim that has absorbed resin from the sheets of prepreg. A method of making a composite laminate includes placing into a mold a scrim and a plurality of sheets of prepreg, with the scrim extending between an exterior surface of the sheets of prepreg and an inner surface of the mold; forming a composite laminate whereby the scrim is adhered to the sheets of prepreg; and removing the composite laminate from the mold. An outer layer of the composite laminate includes the scrim.
摘要翻译：复合层叠体包括多个堆叠在一起的预浸料片，以及设置在预浸料片的外表面上的稀松布层。每个预浸料片材由预先用树脂浸渍的纤维形成。稀松布层和预浸料片形成复合层压材料，由此稀松布层构成复合层压板的外露面。稀松布层可以是从预浸料片吸收树脂的非织造碳纤维或玻璃纤维稀松布。制造复合层压材料的方法包括在模具中放置稀松布和多片预浸料，其中，稀松布在预浸料的片材的外表面和模具的内表面之间延伸; 形成复合层压体，由此将稀松布粘附到预浸料片上; 并从模具中去除复合层压材料。复合层压材料的外层包括稀松布。

17. 发明授权

US08482930B2 Electronic device with a ceramic component 有权
公开(公告)号：US08482930B2
公开(公告)日：2013-07-09
申请号：US11752854
申请日：2007-05-23
申请人： John DiFonzo , Chris Ligtenberg
发明人： John DiFonzo , Chris Ligtenberg
IPC分类号： H05K1/18
摘要： An electronic device is disclosed. The electronic device may include a component made of a ceramic material. The electronic device may also include circuitry configured to transmit signals. The signals may pertain to input received through the component.

18. 发明授权

US08050028B2 Heat dissipation in computing device 有权
标题翻译：计算设备散热
公开(公告)号：US08050028B2
公开(公告)日：2011-11-01
申请号：US12912671
申请日：2010-10-26
申请人： Nick Merz , John DiFonzo , Stephen Zadesky , Michael Prichard
发明人： Nick Merz , John DiFonzo , Stephen Zadesky , Michael Prichard
IPC分类号： H05K7/20
CPC分类号： G06F1/20 , F28D15/02 , F28D15/0275 , F28F3/02 , G02F1/133308 , G02F2201/503 , G06F1/1616 , G06F1/1637 , G06F1/1656 , G06F1/1658 , G06F1/1662 , G06F1/1681 , G06F1/183 , G06F1/184 , G06F1/187 , G06F1/203 , G11B33/08 , G11B33/1426 , H01L23/367 , H01L23/427 , H01L2924/0002 , H05K7/20336 , Y10T29/4935 , H01L2924/00
摘要： A computing device is disclosed. The computing device includes a shock mount assembly that is configured to provide impact absorption to sensitive components such as a display and an optical disk drive. The computing device also includes an enclosureless optical disk drive that is housed by an enclosure and other structures of the computing device. The computing device further includes a heat transfer system that removes heat from a heat producing element of the computing device. The heat transfer system is configured to thermally couple the heat producing element to a structural member of the computing device so as to sink heat through the structural member, which generally has a large surface area for dissipating the heat.
摘要翻译：公开了一种计算设备。该计算装置包括一个冲击安装组件，其被配置为向诸如显示器和光盘驱动器的敏感部件提供冲击吸收。计算设备还包括由机壳和计算设备的其他结构容纳的无外壳光盘驱动器。计算装置还包括从计算装置的发热元件移除热量的传热系统。传热系统被配置为将发热元件热耦合到计算装置的结构构件，以便通过结构构件吸收热量，结构构件通常具有用于散热的大的表面积。

19. 发明申请

US20060291154A1 GUARD SYSTEM FOR PORTABLE COMPUTER DISK DRIVE SLOT 审中-公开
标题翻译：便携式计算机磁盘驱动器保护系统
公开(公告)号：US20060291154A1
公开(公告)日：2006-12-28
申请号：US11160443
申请日：2005-06-23
申请人： John DiFonzo , Chris Ligtenberg
发明人： John DiFonzo , Chris Ligtenberg
IPC分类号： G06F1/16
CPC分类号： G06F1/1656 , G06F1/1616 , G06F1/181
摘要： A guard system is provided for a portable computer disk drive slot. A guard is positioned substantially adjacent the computer disk drive slot for movement between an open position and a closed position. The open position is substantially adjacent, and not obstructing access through, the disk drive slot. The closed position is substantially adjacent and across the disk drive slot, and obstructs access through the disk drive slot. The guard is positioned in the closed position across the disk drive slot for at least one of a configuration of the portable computer when the disk drive is not to be used, and a configuration of the portable computer when a disk has been loaded into the disk drive.
摘要翻译：为便携式计算机磁盘驱动器插槽提供防护系统。防护件基本上邻近计算机盘驱动器槽定位，以在打开位置和关闭位置之间移动。打开位置基本上相邻，并且不阻碍通过磁盘驱动器槽。闭合位置基本上相邻并穿过磁盘驱动器槽，并且妨碍通过盘驱动器槽的通路。当不使用磁盘驱动器时，防护件位于通过磁盘驱动器插槽的关闭位置中，用于便携式计算机的配置中的至少一个，以及当盘已经被加载到磁盘时的便携式计算机的配置驾驶。

20. 发明授权

US06900984B2 Computer component protection 失效
公开(公告)号：US06900984B2
公开(公告)日：2005-05-31
申请号：US09842408
申请日：2001-04-24
申请人： Nick Merz , John DiFonzo , Stephen Zadesky , Michael Prichard
发明人： Nick Merz , John DiFonzo , Stephen Zadesky , Michael Prichard
IPC分类号： G02F1/13 , G06F1/16 , G06F1/18 , G06F1/20 , G11B33/08 , G11B33/14
CPC分类号： G06F1/20 , F28D15/02 , F28D15/0275 , F28F3/02 , G02F1/133308 , G02F2201/503 , G06F1/1616 , G06F1/1637 , G06F1/1656 , G06F1/1658 , G06F1/1662 , G06F1/1681 , G06F1/183 , G06F1/184 , G06F1/187 , G06F1/203 , G11B33/08 , G11B33/1426 , H01L23/367 , H01L23/427 , H01L2924/0002 , H05K7/20336 , Y10T29/4935 , H01L2924/00
摘要： A computing device is disclosed. The computing device includes a shock mount assembly that is configured to provide impact absorption to sensitive components such as a display and an optical disk drive. The computing device also includes an enclosureless optical disk drive that is housed by an enclosure and other structures of the computing device. The computing device further includes a heat transfer system that removes heat from a heat producing element of the computing device. The heat transfer system is configured to thermally couple the heat producing element to a structural member of the computing device so as to sink heat through the structural member, which generally has a large surface area for dissipating the heat.

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