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11. 发明授权

US08583043B2 High-frequency device and wireless IC device 有权
标题翻译：高频设备和无线IC设备
公开(公告)号：US08583043B2
公开(公告)日：2013-11-12
申请号：US13094928
申请日：2011-04-27
申请人： Noboru Kato , Nobuo Ikemoto , Yuya Dokai , Koji Shiroki
发明人： Noboru Kato , Nobuo Ikemoto , Yuya Dokai , Koji Shiroki
IPC分类号： H04B7/00
CPC分类号： H01Q9/285 , G06K19/07718 , G06K19/07735 , G06K19/07749 , H01L23/60 , H01L23/642 , H01L23/645 , H01L23/66 , H01L2223/6677 , H01L2924/0002 , H01L2924/3011 , H01Q1/2225 , H01Q1/38 , H01Q9/24 , H01L2924/00
摘要： A high-frequency device includes a wireless IC chip and a board which is coupled to the wireless IC chip and electrically connected to radiator plates, and an inductor and/or a capacitance are provided as a static electricity countermeasure element in the board. The inductor is connected in parallel between the wireless IC chip and the radiator plates, and its impedance at the frequency of static electricity is less than an impedance of the wireless IC chip.
摘要翻译：高频器件包括无线IC芯片和耦合到无线IC芯片并电连接到散热器板的板，并且在板中提供电感器和/或电容作为静电对抗元件。电感器并联在无线IC芯片和散热板之间，其静电频率下的阻抗小于无线IC芯片的阻抗。

12. 发明申请

US20090262041A1 WIRELESS IC DEVICE 审中-公开
标题翻译：无线IC器件
公开(公告)号：US20090262041A1
公开(公告)日：2009-10-22
申请号：US12496709
申请日：2009-07-02
申请人： Nobuo Ikemoto , Yuya Dokai , Noboru Kato
发明人： Nobuo Ikemoto , Yuya Dokai , Noboru Kato
IPC分类号： H01Q1/50
CPC分类号： G06K19/0723 , G06K19/073 , G06K19/07749 , G06K19/07756 , H01L2224/16225 , H01L2224/73204 , H01Q1/2225 , H01Q1/40 , H01Q7/00 , H01Q9/16 , H01Q9/20 , H04B5/0012
摘要： An electromagnetic coupling module includes a wireless IC chip and a functional substrate. The electromagnetic coupling module is mounted on a radiation plate, preferably using an adhesive, for example. On the upper surface of a base material of the radiation plate, two long radiation electrodes are provided. On the undersurface of the functional substrate, capacitive coupling electrodes that individually face inner ends of the radiation electrodes are provided. A matching circuit arranged to perform the impedance matching between the wireless IC chip and each of the radiation electrodes includes the capacitive coupling electrodes. As a result, it is possible to reduce the size, facilitate the design, and reduce the cost of a wireless IC device.
摘要翻译：电磁耦合模块包括无线IC芯片和功能基板。电磁耦合模块例如安装在辐射板上，优选使用粘合剂。在辐射板的基材的上表面上设置两个长的辐射电极。在功能基板的下表面上，设置分别面对辐射电极内端的电容耦合电极。布置成执行无线IC芯片和每个辐射电极之间的阻抗匹配的匹配电路包括电容耦合电极。结果，可以减小无线IC器件的尺寸，便于设计和降低成本。

13. 发明授权

US08081121B2 Article having electromagnetic coupling module attached thereto 有权
标题翻译：具有电磁耦合模块的物品
公开(公告)号：US08081121B2
公开(公告)日：2011-12-20
申请号：US12401767
申请日：2009-03-11
申请人： Noboru Kato , Yuya Dokai , Nobuo Ikemoto
发明人： Noboru Kato , Yuya Dokai , Nobuo Ikemoto
IPC分类号： H01Q1/38
CPC分类号： H04B5/0012 , G06K7/10178 , G06K19/04 , G06K19/07749
摘要： An article having an electromagnetic coupling module attached thereto includes an electromagnetic coupling module and a PET bottle having the electromagnetic coupling module bonded thereto. The electromagnetic coupling module includes a wireless IC chip arranged to process transmission and reception signals and the feed circuit board having the wireless IC chip mounted thereon. The feed circuit board includes a feed circuit including a resonant circuit having a predetermined resonant frequency. The feed circuit performs characteristic impedance matching between the PET bottle and the wireless IC chip. The PET bottle functions as a radiator arranged to radiate a transmission signal supplied from the feed circuit using electromagnetic field coupling and to supply a received reception signal to the feed circuit using electromagnetic field coupling.
摘要翻译：具有附接有电磁耦合模块的物品包括电磁耦合模块和具有与其结合的电磁耦合模块的PET瓶。电磁耦合模块包括布置成处理发送和接收信号的无线IC芯片以及安装有无线IC芯片的馈电电路板。馈电电路板包括具有预定谐振频率的谐振电路的馈电电路。馈电电路执行PET瓶和无线IC芯片之间的特征阻抗匹配。 PET瓶用作散热器，其布置成使用电磁场耦合辐射从馈电电路提供的传输信号，并使用电磁场耦合将接收到的接收信号提供给馈电电路。

14. 发明授权

US08078106B2 Wireless IC device and component for wireless IC device 有权
标题翻译：无线IC器件及无线IC器件组件
公开(公告)号：US08078106B2
公开(公告)日：2011-12-13
申请号：US12543553
申请日：2009-08-19
申请人： Yuya Dokai , Noboru Kato , Satoshi Ishino
发明人： Yuya Dokai , Noboru Kato , Satoshi Ishino
IPC分类号： H04B7/00 , H04B1/16
CPC分类号： H05K1/0243 , G06K19/07749 , H01L23/49822 , H01L23/642 , H01L23/645 , H01L23/66 , H01L2223/665 , H01L2223/6677 , H01L2224/13144 , H01L2224/16 , H01L2224/16235 , H01L2224/16238 , H01L2924/01079 , H01L2924/09701 , H01L2924/14 , H01L2924/3011 , H05K1/0239 , H05K1/16 , H05K1/162 , H05K1/165 , H05K2201/10098 , H05K2201/10727 , Y02D70/10
摘要： A wireless IC device includes a wireless IC chip, a power supply circuit board upon which the wireless IC chip is mounted, and in which a power supply circuit is provided, the power supply circuit includes a resonant circuit having a predetermined resonant frequency, and a radiation pattern, which is adhered to the underside of the power supply circuit board, for radiating a transmission signal supplied from the power supply circuit, and for receiving a reception signal to supply this to the power supply circuit. The resonant circuit is an LC resonant circuit including an inductance device and capacitance devices. The power supply circuit board is a multilayer rigid board or a single-layer rigid board, and between the wireless IC chip and the radiation pattern is connected by DC connection, magnetic coupling, or capacitive coupling.
摘要翻译：无线IC器件包括无线IC芯片，安装有无线IC芯片的电源电路板，并且其中设置有电源电路，电源电路包括具有预定谐振频率的谐振电路，以及辐射图案，其粘附到电源电路板的下侧，用于辐射从电源电路提供的传输信号，并且用于接收接收信号以将其提供给电源电路。谐振电路是包括电感器件和电容器件的LC谐振电路。电源电路板是多层刚性板或单层刚性板，无线IC芯片和辐射图之间通过直流连接，磁耦合或电容耦合连接。

15. 发明授权

US08632014B2 Wireless IC device 有权
标题翻译：无线IC设备
公开(公告)号：US08632014B2
公开(公告)日：2014-01-21
申请号：US12510347
申请日：2009-07-28
申请人： Noboru Kato , Yuya Dokai , Nobuo Ikemoto
发明人： Noboru Kato , Yuya Dokai , Nobuo Ikemoto
IPC分类号： G06K19/06
CPC分类号： G06K19/07749 , G06K19/07758 , G06K19/07786
摘要： A wireless IC device includes a radiating plate, a wireless IC chip, and a feeder circuit board, on which the wireless IC chip is mounted. The feeder circuit board includes a resonant circuit with an inductance element, and the resonant circuit is electromagnetically coupled with the radiating plate. The wireless IC chip is interposed between the radiating plate and the feeder circuit board.
摘要翻译：无线IC器件包括安装无线IC芯片的辐射板，无线IC芯片和馈电电路板。馈电电路板包括具有电感元件的谐振电路，并且谐振电路与辐射板电磁耦合。无线IC芯片插在散热板和馈电电路板之间。

16. 发明授权

US07931206B2 Wireless IC device 有权
标题翻译：无线IC设备
公开(公告)号：US07931206B2
公开(公告)日：2011-04-26
申请号：US12469896
申请日：2009-05-21
申请人： Noboru Kato , Yuya Dokai , Nobuo Ikemoto
发明人： Noboru Kato , Yuya Dokai , Nobuo Ikemoto
IPC分类号： G06K19/06
CPC分类号： H01Q7/00 , G06K19/07749 , G06K19/07756 , H01Q1/2208
摘要： A wireless IC device includes a radiation plate, a feeding circuit substrate on which a feeding circuit including a resonant circuit including an inductance element is provided, the feeding circuit being electromagnetically coupled to the radiation plate, and a wireless IC chip including a connection electrode, the wireless IC chip being disposed on the feeding circuit substrate. A mounting electrode is provided on the feeding circuit substrate. The frequency of signals sent and received using the radiation plate substantially corresponds to the resonant frequency of the resonant circuit. The wireless IC chip is electromagnetically coupled to the mounting electrode.
摘要翻译：无线IC器件包括辐射板，馈电电路基板，其上设有包括电感元件的谐振电路的馈电电路，馈电电路与放射板电磁耦合;以及无线IC芯片，包括连接电极，无线IC芯片设置在馈电电路基板上。馈电电路基板上设有安装电极。使用辐射板发送和接收的信号的频率基本上对应于谐振电路的谐振频率。无线IC芯片电磁耦合到安装电极。

17. 发明申请

US20090277967A1 WIRELESS IC DEVICE 有权
标题翻译：无线IC器件
公开(公告)号：US20090277967A1
公开(公告)日：2009-11-12
申请号：US12510347
申请日：2009-07-28
申请人： Noboru Kato , Yuya Dokai , Nobuo Ikemoto
发明人： Noboru Kato , Yuya Dokai , Nobuo Ikemoto
IPC分类号： G06K19/06
CPC分类号： G06K19/07749 , G06K19/07758 , G06K19/07786
摘要： A wireless IC device includes a radiating plate, a wireless IC chip, and a feeder circuit board, on which the wireless IC chip is mounted. The feeder circuit board includes a resonant circuit with an inductance element, and the resonant circuit is electromagnetically coupled with the radiating plate. The wireless IC chip is interposed between the radiating plate and the feeder circuit board.
摘要翻译：无线IC器件包括安装无线IC芯片的辐射板，无线IC芯片和馈电电路板。馈电电路板包括具有电感元件的谐振电路，并且谐振电路与辐射板电磁耦合。无线IC芯片插在散热板和馈电电路板之间。

18. 发明授权

US08676117B2 Wireless IC device and component for wireless IC device 有权
公开(公告)号：US08676117B2
公开(公告)日：2014-03-18
申请号：US13567108
申请日：2012-08-06
申请人： Yuya Dokai , Noboru Kato , Satoshi Ishino
发明人： Yuya Dokai , Noboru Kato , Satoshi Ishino
IPC分类号： H04B5/00
CPC分类号： H05K1/0243 , G06K19/07749 , H01L23/49822 , H01L23/642 , H01L23/645 , H01L23/66 , H01L2223/665 , H01L2223/6677 , H01L2224/13144 , H01L2224/16 , H01L2224/16235 , H01L2224/16238 , H01L2924/01079 , H01L2924/09701 , H01L2924/14 , H01L2924/3011 , H05K1/0239 , H05K1/16 , H05K1/162 , H05K1/165 , H05K2201/10098 , H05K2201/10727 , Y02D70/10
摘要： A wireless IC device includes a wireless IC chip, a power supply circuit board upon which the wireless IC chip is mounted, and in which a power supply circuit is provided, the power supply circuit includes a resonant circuit having a predetermined resonant frequency, and a radiation pattern, which is adhered to the underside of the power supply circuit board, for radiating a transmission signal supplied from the power supply circuit, and for receiving a reception signal to supply this to the power supply circuit. The resonant circuit is an LC resonant circuit including an inductance device and capacitance devices. The power supply circuit board is a multilayer rigid board or a single-layer rigid board, and between the wireless IC chip and the radiation pattern is connected by DC connection, magnetic coupling, or capacitive coupling.

19. 发明授权

US07519328B2 Wireless IC device and component for wireless IC device 有权
标题翻译：无线IC器件及无线IC器件组件
公开(公告)号：US07519328B2
公开(公告)日：2009-04-14
申请号：US11624382
申请日：2007-01-18
申请人： Yuya Dokai , Noboru Kato , Satoshi Ishino
发明人： Yuya Dokai , Noboru Kato , Satoshi Ishino
IPC分类号： H04B5/00 , H04B7/00 , H04B1/16
CPC分类号： H05K1/0243 , G06K19/07749 , H01L23/49822 , H01L23/642 , H01L23/645 , H01L23/66 , H01L2223/665 , H01L2223/6677 , H01L2224/13144 , H01L2224/16 , H01L2224/16235 , H01L2224/16238 , H01L2924/01079 , H01L2924/09701 , H01L2924/14 , H01L2924/3011 , H05K1/0239 , H05K1/16 , H05K1/162 , H05K1/165 , H05K2201/10098 , H05K2201/10727 , Y02D70/10
摘要： A wireless IC device includes a wireless IC chip, a power supply circuit board upon which the wireless IC chip is mounted, and in which a power supply circuit is provided, the power supply circuit includes a resonant circuit having a predetermined resonant frequency, and a radiation pattern, which is adhered to the underside of the power supply circuit board, for radiating a transmission signal supplied from the power supply circuit, and for receiving a reception signal to supply this to the power supply circuit. The resonant circuit is an LC resonant circuit including an inductance device and capacitance devices. The power supply circuit board is a multilayer rigid board or a single-layer rigid board, and between the wireless IC chip and the radiation pattern is connected by DC connection, magnetic coupling, or capacitive coupling.
摘要翻译：无线IC器件包括无线IC芯片，安装有无线IC芯片的电源电路板，并且其中设置有电源电路，电源电路包括具有预定谐振频率的谐振电路，以及辐射图案，其粘附到电源电路板的下侧，用于辐射从电源电路提供的传输信号，并且用于接收接收信号以将其提供给电源电路。谐振电路是包括电感器件和电容器件的LC谐振电路。电源电路板是多层刚性板或单层刚性板，无线IC芯片和辐射图之间通过直流连接，磁耦合或电容耦合连接。

20. 发明授权

US08544754B2 Wireless IC device and wireless IC device composite component 有权
标题翻译：无线IC器件和无线IC器件复合元件
公开(公告)号：US08544754B2
公开(公告)日：2013-10-01
申请号：US12276444
申请日：2008-11-24
申请人： Noboru Kato , Yuya Dokai , Satoshi Ishino
发明人： Noboru Kato , Yuya Dokai , Satoshi Ishino
IPC分类号： G06K19/06
CPC分类号： H01Q1/2208 , G06K19/07749 , G06K19/07756 , G06K19/07779 , G06K19/07783 , G06K19/07784 , H01F17/0006 , H01F38/14 , H01L23/49855 , H01L2224/16225 , H01L2924/09701 , H01L2924/3011 , H01Q1/2283 , H01Q1/242 , H01Q1/50 , H01Q7/00 , H01Q23/00 , H01Q25/02
摘要： A wireless IC device includes a wireless IC chip, a feed circuit board having the wireless IC chip mounted thereon and including a feed circuit including inductance elements, and a radiation plate electromagnetically coupled to the inductance elements in the feed circuit. A high-permeability magnetic body made of a high-permeability magnetic material is provided in the feed circuit board and a portion of the inductance elements is provided in the high-permeability magnetic body.
摘要翻译：无线IC器件包括无线IC芯片，其上安装有无线IC芯片的馈电电路板，并且包括具有电感元件的馈电电路，以及电磁耦合到馈电电路中的电感元件的辐射板。由高磁导率磁性材料制成的高导磁率磁体设置在馈电电路板中，并且电感元件的一部分设置在高磁导率磁体中。

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