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11. 发明申请

US20070045863A1 PACKAGE STRUCTURE AND FABRICATION PROCESS THEREOF 审中-公开
标题翻译：其包装结构及其制造工艺
公开(公告)号：US20070045863A1
公开(公告)日：2007-03-01
申请号：US11306099
申请日：2005-12-16
申请人： Ya-Yu Hsieh , Wei-Chung Wang , Tzu-Bin Lin
发明人： Ya-Yu Hsieh , Wei-Chung Wang , Tzu-Bin Lin
IPC分类号： H01L23/52
CPC分类号： H01L24/13 , H01L24/11 , H01L2224/13099 , H01L2224/83894 , H01L2924/0001 , H01L2924/01006 , H01L2924/01018 , H01L2924/01024 , H01L2924/01033 , H01L2924/01079 , H01L2924/014
摘要： A packaging process including the following steps is provided. First, a first substrate and a second substrate are provided. The first substrate has first contacts, and the second substrate has second contacts. Next, the first substrate is placed on the second substrate, such that the first contacts are aligned with the second contacts. Then, the first substrate and the second substrate are submerged in a solution having BDMT. After that, the first substrate and the second substrate are removed from the solution, such that self-assembly mono-layers are formed between the first substrate and the second substrate, to electrically connect the first substrate and the second substrate. A package structure formed according to the above process is also provided.
摘要翻译：提供包括以下步骤的包装过程。首先，提供第一基板和第二基板。第一基板具有第一触点，第二基板具有第二触点。接下来，将第一基板放置在第二基板上，使得第一触点与第二触点对齐。然后，将第一基板和第二基板浸没在具有BDMT的溶液中。之后，从溶液中除去第一衬底和第二衬底，使得在第一衬底和第二衬底之间形成自组装单层，以电连接第一衬底和第二衬底。还提供了根据上述方法形成的封装结构。

12. 发明申请

US20070031994A1 Method for Fabricating Protective Caps for Protecting Elements on a Wafer Surface 有权
标题翻译：制造用于保护晶片表面元件的保护盖的方法
公开(公告)号：US20070031994A1
公开(公告)日：2007-02-08
申请号：US11164965
申请日：2005-12-13
申请人： Wei-Chung Wang
发明人： Wei-Chung Wang
IPC分类号： H01L21/00
CPC分类号： H01L23/04 , B81C1/00333 , B81C2203/0127 , H01L2924/0002 , H01L2924/01079 , H01L2924/00
摘要： A method of fabricating protective caps for protecting devices on wafer surface includes: (a) providing a non-metal cap substrate and forming a metal layer on the non-metal cap substrate; (b) forming a plurality of cavities on a surface of the metal layer, wherein the location of each cavity corresponds to each of the devices on the wafer surface; and (c) forming a protective cap in each cavity and forming a plurality of bonding media around the cavities.
摘要翻译：一种制造用于保护晶片表面上的器件的保护帽的方法包括：（a）提供非金属帽衬底并在非金属帽衬底上形成金属层; （b）在金属层的表面上形成多个空腔，其中每个空腔的位置对应于晶片表面上的每个器件; 和（c）在每个空腔中形成保护帽，并且在空腔周围形成多个粘合介质。

13. 发明授权

US06383846B1 Method and apparatus for molding a flip chip semiconductor device 有权
标题翻译：用于成型倒装芯片半导体器件的方法和装置
公开(公告)号：US06383846B1
公开(公告)日：2002-05-07
申请号：US09528617
申请日：2000-03-20
申请人： Chi-Chih Shen , Wei-Chung Wang , Chun-Hung Lin
发明人： Chi-Chih Shen , Wei-Chung Wang , Chun-Hung Lin
IPC分类号： H01L2144
CPC分类号： H01L21/565 , H01L23/13 , H01L23/3121 , H01L2224/16 , H01L2224/16235 , H01L2924/00014 , H01L2924/15151 , H01L2924/15174 , H01L2224/0401
摘要： A method and apparatus for molding a flip chip semiconductor device are disclosed herein. A substrate having at least one air hole is provided. A chip is mounted on the substrate by multiple solder balls such that the air hole is beneath the chip and surrounded by the multiple solder balls. The substrate mounted with the chip is placed in a mold apparatus which defines at least one air channel aligning with the air hole, such that air can be exhausted via the air hole and the air channel when encapsulation material is filling the mold apparatus.
摘要翻译：本文公开了一种用于模制倒装芯片半导体器件的方法和装置。提供具有至少一个空气孔的基板。芯片通过多个焊球安装在基板上，使得空气孔在芯片下方并被多个焊球围绕。安装有芯片的基板被放置在模具装置中，该模具装置限定与空气孔对准的至少一个空气通道，使得当封装材料填充模具装置时，空气可以经由空气孔和空气通道排出。

14. 发明授权

US6153939A Flip-chip semiconductor device with enhanced reliability and manufacturing efficiency, and the method for under filling the same 有权
标题翻译：具有提高的可靠性和制造效率的倒装芯片半导体器件，以及用于填充其的方法
公开(公告)号：US6153939A
公开(公告)日：2000-11-28
申请号：US317354
申请日：1999-05-24
申请人： Wei-Chung Wang , Hsueh-Te Wang , Jen-Kuang Fang , Su Tao
发明人： Wei-Chung Wang , Hsueh-Te Wang , Jen-Kuang Fang , Su Tao
IPC分类号： H01L21/56 , H01L21/44 , H01L21/48 , H01L21/50
CPC分类号： H01L21/563 , H01L24/28 , H01L2224/16225 , H01L2224/73203 , H01L2224/73204 , H01L2224/83102 , H01L2224/92125 , H01L2924/00014 , H01L2924/01013 , H01L2924/01033 , H01L2924/15151 , H01L2924/351
摘要： A flip-chip semiconductor device and a method for under filling the flip-chip semiconductor device are disclosed. The flip-chip semiconductor device is provided with a substrate and a die having a plurality of solder bumps for connecting to the substrate. Encapsulation material is under filled between the die and the substrate. The substrate has a non-mask area defied in a center portion thereof while the remaining surface area is covered by a solder mask. The non-mask area defines a hole in the center thereof so that the encapsulation material can be dispensed along all sides of the die to flow toward the non-mask area and stop when reaching the non-mask area whereby the encapsulation material does not block the hole and air between said die and the substrate is limited in a void formed around the hole and communicated with the atmosphere via the hole.
摘要翻译：公开了一种倒装芯片半导体器件和用于填充倒装芯片半导体器件的方法。倒装芯片半导体器件设置有具有用于连接到衬底的多个焊料凸块的衬底和管芯。封装材料在模具和基板之间被填充。基板在其中心部分具有不掩蔽的非掩模区域，而剩余表面积被焊接掩模覆盖。非掩模区域在其中心限定一个孔，使得封装材料可以沿芯片的所有侧面分配以流向非掩模区域，并在达到非掩模区域时停止，从而封装材料不会阻塞所述模具和基板之间的孔和空气被限制在形成在孔周围并且经由孔与大气连通的空隙中。

15. 发明授权

US08803943B2 Formation apparatus using digital image correlation 有权
标题翻译：使用数字图像相关的形成装置
公开(公告)号：US08803943B2
公开(公告)日：2014-08-12
申请号：US13238142
申请日：2011-09-21
申请人： Chi-Hung Huang , Yung-Hsiang Chen , Wei-Chung Wang , Tai-Shan Liao
发明人： Chi-Hung Huang , Yung-Hsiang Chen , Wei-Chung Wang , Tai-Shan Liao
IPC分类号： H04N13/02 , G06T7/00 , G01B11/16 , H04N17/00
CPC分类号： G01B11/16 , G01B2210/52 , G06T7/85 , G06T2207/10012 , H04N13/243 , H04N13/246
摘要： The present disclosure uses at least three cameras to monitor even a large-scale area. Displacement and strain are measured in a fast, convenient and effective way. The present disclosure has advantages on whole field, far distance and convenience.
摘要翻译：本公开使用至少三台照相机甚至监视大规模区域。位移和应变以快速，方便和有效的方式测量。本公开在整个领域具有优势，远距离和便利。

16. 发明授权

US08605264B2 Apparatus and method for quantifying residual stress of a birefringent material 有权
标题翻译：用于量化双折射材料的残余应力的装置和方法
公开(公告)号：US08605264B2
公开(公告)日：2013-12-10
申请号：US13158434
申请日：2011-06-12
申请人： Wei-Chung Wang , Chi-Hung Huang , Yu-Cheng Tseng , Po-Chi Sung
发明人： Wei-Chung Wang , Chi-Hung Huang , Yu-Cheng Tseng , Po-Chi Sung
IPC分类号： G01B11/16
CPC分类号： G01L5/0047 , G01L1/24
摘要： An apparatus for quantifying residual stress of a birefringent material comprises a light source generating light; a vertical polarizer converting a beam of light into a beam with vertical polarization; a standard material being mounted in front of the vertical polarizer; a horizontal polarizer converting a beam of light into a beam with horizontal polarization; an applied force unit applying different forces to the standard material; a spectrometer being mounted in front of the horizontal polarizer and recording intensity of light passing through the horizontal polarizer and transmittance of the standard material and a processing module being connected to the spectrometer, deriving a stress formula from the applied forces and transmittances of the standard material and obtaining a stress distribution of the birefringent material. A method for quantifying residual stress of a birefringent material is also disclosed.
摘要翻译：用于量化双折射材料的残余应力的装置包括产生光的光源; 垂直偏振器将光束转换成具有垂直偏振的光束; 标准材料安装在垂直偏振器的前面; 水平偏振器将光束转换成具有水平偏振的光束; 施加的力单元对标准材料施加不同的力; 安装在水平偏振器前面的光谱仪和记录通过水平偏振器的光的强度和标准材料的透射率以及连接到光谱仪的处理模块，从施加的力和标准材料的透射率得出应力公式并获得双折射材料的应力分布。还公开了一种用于量化双折射材料的残余应力的方法。

17. 发明授权

US08538187B2 Defocus calibration module for light-sensing system and method thereof 有权
标题翻译：用于光感测系统的散焦校准模块及其方法
公开(公告)号：US08538187B2
公开(公告)日：2013-09-17
申请号：US12818112
申请日：2010-06-17
申请人： Wei-Chung Wang , Hui-Hsuan Chen
发明人： Wei-Chung Wang , Hui-Hsuan Chen
IPC分类号： G06K9/40 , G03B27/74 , G01B11/14
CPC分类号： G03B3/00 , G03B13/00 , H04N17/002
摘要： A defocus calibration module is applied in a light-sensing system for sensing a measured object to generate a sensed image. The light-sensing system contains a light-emitting component, a focusing component, and an image sensor. The light-emitting component emits a detecting light to the measured object so that the measured object generates a reflecting light. The focusing component focuses the reflecting light to the image sensor, and the image sensor generates the sensed image according to the reflecting light. The defocus calibration module has a calibrating object for blocking a part of the detecting light and the reflecting light for forming images at a first and a second calibration imaging locations in the sensed image. In this way, the defocus calibration module calculates a defocus parameter representing the defocus level of the light-sensing system according to the first and the second calibration imaging locations, and accordingly calibrates the sensed image.
摘要翻译：散焦校准模块被应用于光感测系统中，用于感测被测物体以产生感测图像。光感测系统包含发光部件，聚焦部件和图像传感器。发光部件向测量对象发射检测光，使得被测物体产生反射光。聚焦组件将反射光聚焦到图像传感器，并且图像传感器根据反射光产生感测图像。散焦校准模块具有用于阻挡检测光的一部分的校准对象和用于在感测图像中的第一和第二校准成像位置处形成图像的反射光。以这种方式，散焦校准模块根据第一和第二校准成像位置计算表示光感测系统的散焦水平的散焦参数，并因此校准感测图像。

18. 发明授权

US08513041B2 MEMS integrated chip and method for making same 失效
标题翻译： MEMS集成芯片及其制造方法
公开(公告)号：US08513041B2
公开(公告)日：2013-08-20
申请号：US12627480
申请日：2009-11-30
申请人： Chuan-Wei Wang , Sheng-Ta Lee , Hsin-Hui Hsu , Wei-Chung Wang
发明人： Chuan-Wei Wang , Sheng-Ta Lee , Hsin-Hui Hsu , Wei-Chung Wang
IPC分类号： H01L21/00
CPC分类号： H01L23/481 , B81B2207/07 , B81C1/00246 , B81C2203/0714 , B81C2203/0735 , H01L29/78 , H01L2924/0002 , H01L2924/00
摘要： The present invention discloses a MEMS (Micro-Electro-Mechanical System) chip and a method for making the MEMS chip. The MEMS chip comprises: a first substrate having a first surface and a second surface opposing each other; a microelectronic device area on the first surface; a first MEMS device area on the second surface; and a conductive interconnection structure electrically connecting the microelectronic device area and the first MEMS device area.
摘要翻译：本发明公开了一种MEMS（微电子机械系统）芯片及其制造方法。 MEMS芯片包括：具有第一表面和彼此相对的第二表面的第一基板; 第一表面上的微电子器件区域; 第二表面上的第一MEMS器件区域; 以及电连接微电子器件区域和第一MEMS器件区域的导电互连结构。

19. 发明申请

US20130070048A1 Formation Apparatus Using Digital Image Correlation 有权
标题翻译：使用数字图像相关的形成装置
公开(公告)号：US20130070048A1
公开(公告)日：2013-03-21
申请号：US13238142
申请日：2011-09-21
申请人： Chi-Hung Huang , Yung-Hsiang Chen , Wei-Chung Wang , Tai-Shan Liao
发明人： Chi-Hung Huang , Yung-Hsiang Chen , Wei-Chung Wang , Tai-Shan Liao
IPC分类号： H04N13/02 , H04N7/18
CPC分类号： G01B11/16 , G01B2210/52 , G06T7/85 , G06T2207/10012 , H04N13/243 , H04N13/246
摘要： The present disclosure uses at least three cameras to monitor even a large-scale area. Displacement and strain are measured in a fast, convenient and effective way. The present disclosure has advantages on whole field, far distance and convenience.
摘要翻译：本公开使用至少三台照相机甚至监视大规模区域。位移和应变以快速，方便和有效的方式测量。本公开在整个领域具有优势，远距离和便利。

20. 发明申请

US20120176598A1 APPARATUS AND METHOD FOR QUANTIFYING RESIDUAL STRESS OF A BIREFRINGENT MATERIAL 有权
标题翻译：用于定量材料残留应力的装置和方法
公开(公告)号：US20120176598A1
公开(公告)日：2012-07-12
申请号：US13158434
申请日：2011-06-12
申请人： Wei-Chung Wang , Chi-Hung Huang , Yu-Cheng Tseng , Po-Chi Sung
发明人： Wei-Chung Wang , Chi-Hung Huang , Yu-Cheng Tseng , Po-Chi Sung
IPC分类号： G01B11/16
CPC分类号： G01L5/0047 , G01L1/24
摘要： An apparatus for quantifying residual stress of a birefringent material comprises a light source generating light; a vertical polarizer converting a beam of light into a beam with vertical polarization; a standard material being mounted in front of the vertical polarizer; a horizontal polarizer converting a beam of light into a beam with horizontal polarization; an applied force unit applying different forces to the standard material; a spectrometer being mounted in front of the horizontal polarizer and recording intensity of light passing through the horizontal polarizer and transmittance of the standard material and a processing module being connected to the spectrometer, deriving a stress formula from the applied forces and transmittances of the standard material and obtaining a stress distribution of the birefringent material. A method for quantifying residual stress of a birefringent material is also disclosed.
摘要翻译：用于量化双折射材料的残余应力的装置包括产生光的光源; 垂直偏振器将光束转换成具有垂直偏振的光束; 标准材料安装在垂直偏振器的前面; 水平偏振器将光束转换成具有水平偏振的光束; 施加的力单元对标准材料施加不同的力; 安装在水平偏振器前面的光谱仪和记录通过水平偏振器的光的强度和标准材料的透射率以及连接到光谱仪的处理模块，从施加的力和标准材料的透射率得出应力公式并获得双折射材料的应力分布。还公开了一种用于量化双折射材料的残余应力的方法。

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