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11. 发明授权

US07538566B2 Electrical test system including coaxial cables 有权
标题翻译：电测试系统包括同轴电缆
公开(公告)号：US07538566B2
公开(公告)日：2009-05-26
申请号：US11926172
申请日：2007-10-29
申请人： Young-Soo An , Se-Jang Oh , Jung-Hyun Nam
发明人： Young-Soo An , Se-Jang Oh , Jung-Hyun Nam
IPC分类号： G01R31/02 , G01R31/28
CPC分类号： G01R31/2889
摘要： An electrical test system includes a test head, a performance board, a probe card and coaxial cables. The performance board includes a first side and an opposite second side, where the first side of the performance board is electrically connected to the test head and the second side of the performance board includes first coaxial cable connection portions. The probe card includes a first side and an opposite second side, where the first side of the probe card includes second coaxial cable connection portions and the second side includes a wafer test probes. The coaxial cables respectively electrically connect the first coaxial cable connection portions of the performance board to the second coaxial cable connection portions of the probe card.
摘要翻译：电气测试系统包括测试头，演奏板，探针卡和同轴电缆。所述性能板包括第一侧和相对的第二侧，其中所述性能板的第一侧电连接到所述测试头，并且所述性能板的第二侧包括第一同轴电缆连接部分。探针卡包括第一侧和相对的第二侧，其中探针卡的第一侧包括第二同轴电缆连接部分，并且第二侧包括晶片测试探针。同轴电缆分别将性能板的第一同轴电缆连接部分电连接到探针卡的第二同轴电缆连接部分。

12. 发明申请

US20100025682A1 Interface device for wireless testing, semiconductor device and semiconductor package including the same, and method for wirelessly testing using the same 审中-公开
标题翻译：用于无线测试的接口设备，包括其的半导体器件和半导体封装以及使用其的无线测试的方法
公开(公告)号：US20100025682A1
公开(公告)日：2010-02-04
申请号：US12462373
申请日：2009-08-03
申请人： Sang-Hoon Lee , Eun-Jo Byun , Se-Jang Oh , Young-Soo An , Chang-Hyun Cho
发明人： Sang-Hoon Lee , Eun-Jo Byun , Se-Jang Oh , Young-Soo An , Chang-Hyun Cho
IPC分类号： H01L21/66 , H01L23/00
CPC分类号： G01R31/2889 , G01R31/3025 , G01R31/303 , H01L2224/48472 , H01L2924/3011 , H01L2924/00
摘要： In an interface device for wireless testing capable of testing a semiconductor chip in a non-contact manner, a semiconductor device and a semiconductor package including the same, and a method for wirelessly testing a semiconductor device using the same are provided, the interface device for wireless testing includes an interface substrate, interface antennas on the interface substrate, and interface transmitting and receiving circuits on the interface substrate, wherein the interface transmitting and receiving circuits are electrically connected to input/output pads of a semiconductor chip via interface vias passing through the interface substrate.
摘要翻译：在能够以非接触方式测试半导体芯片的无线测试用接口装置中，提供一种半导体器件和包括该半导体器件的半导体封装以及使用其的半导体器件的无线测试方法，无线测试包括接口基板，接口基板上的接口天线和接口基板上的接口发射和接收电路，其中接口发射和接收电路通过经过接口基板的接口通孔电连接到半导体芯片的输入/输出焊盘界面基板。

13. 发明申请

US20060121757A1 Connector for testing a semiconductor package 有权
标题翻译：用于测试半导体封装的连接器
公开(公告)号：US20060121757A1
公开(公告)日：2006-06-08
申请号：US11295208
申请日：2005-12-05
申请人： Young-Bae Chung , Hyun-Seop Shim , Jeong-Ho Bang , Jae-Il Lee , Hyun-Kyo Seo , Young-Soo An , Soon-Geol Hwang
发明人： Young-Bae Chung , Hyun-Seop Shim , Jeong-Ho Bang , Jae-Il Lee , Hyun-Kyo Seo , Young-Soo An , Soon-Geol Hwang
IPC分类号： H01R4/58
CPC分类号： G01R1/0483 , G01R1/045 , G01R1/0466 , G01R31/2863
摘要： In one embodiment, a connector is made using a mixture of insulating silicone powder and conductive powder. The connector comprises a connector body formed from the insulating silicone powder and on or more preferably regularly arrayed conductive silicone members that are formed by migrating the conductive powder to a site of the connector corresponding to a solder ball of the semiconductor package. The conductive silicone member comprises a high-density conductive silicone part formed to be proximate an upper surface of the connector body and to protrude therefrom and a low-density conductive silicone part formed in substantial vertical alignment beneath the high-density conductive silicone part, the low-density conductive silicone part having a lower surface exposed from a lower surface of the connector body.
摘要翻译：在一个实施例中，使用绝缘硅氧烷粉末和导电粉末的混合物制造连接器。连接器包括由绝缘硅氧烷粉末形成的连接器主体，并且通过将导电粉末迁移到对应于半导体封装的焊料球的连接部位而形成的或更优选地规则排列的导电硅树脂构件。导电硅树脂构件包括形成为接近连接器主体的上表面并从其突出的高密度导电硅树脂部件，以及在高密度导电硅树脂部件下方大致垂直取向地形成的低密度导电硅树脂部件，低密度导电硅部件，其具有从连接器本体的下表面露出的下表面。

14. 发明授权

US08347216B2 Mobile terminal and video sharing method thereof 失效
标题翻译：移动终端及其视频共享方法
公开(公告)号：US08347216B2
公开(公告)日：2013-01-01
申请号：US12570509
申请日：2009-09-30
申请人： Hyun-Bin Shin , Eun-Woo Cho , Young-Soo An
发明人： Hyun-Bin Shin , Eun-Woo Cho , Young-Soo An
IPC分类号： G06F3/00 , H04W4/00
CPC分类号： H04N7/173 , H04L12/1822 , H04L65/403 , H04M1/56 , H04M1/72522 , H04M2250/62 , H04N7/147 , H04N7/15 , H04N21/42203 , H04N21/4223 , H04N21/4788
摘要： A mobile terminal for providing a video sharing function in a multi-party call state and its video sharing method are disclosed. When a video sharing menu is selected while a user is performing individual call communication or multi-party call communication, one or a plurality of video share keys in relation to a user selected for video sharing are displayed, so that the user can select a desired one of the displayed video share keys to share video with the selected user. In addition, a video share authority change key is disposed on the screen of a terminal set as a video share authority (chief authority) change target, so that a corresponding terminal can select the video share authority change key during individual or multi-party video sharing to acquire the authority of video sharing (chief authority) from a terminal currently having the authority of video sharing, thus perform bi-directional video sharing in real time.
摘要翻译：公开了一种用于在多方呼叫状态中提供视频共享功能的移动终端及其视频共享方法。当用户正在执行个人呼叫通信或多方呼叫通信时选择视频共享菜单时，显示与选择用于视频共享的用户相关的一个或多个视频共享密钥，使得用户可以选择期望的所显示的视频共享密钥之一与所选择的用户共享视频。此外，视频共享权限更改密钥设置在作为视频共享权限（主管当局）改变目标的终端机的屏幕上，使得相应的终端可以在个人或多方视频期间选择视频共享权限改变密钥共享以从当前具有视频共享权限的终端获取视频共享权限（主要授权），从而实时执行双向视频共享。

15. 发明申请

US20090102500A1 Interposer and probe card having the same 有权
标题翻译：内插器和探针卡具有相同的功能
公开(公告)号：US20090102500A1
公开(公告)日：2009-04-23
申请号：US12285962
申请日：2008-10-17
申请人： Young-Soo An , Sang-Hoon Lee , Se-Jang Oh
发明人： Young-Soo An , Sang-Hoon Lee , Se-Jang Oh
IPC分类号： G01R31/26 , H01R12/00
CPC分类号： G01R31/2889 , H01R12/714
摘要： An interposer may include a first base, at least one first signal line in the first base, and at least one first ground line in the first base, wherein the ground line surrounds the at least one first signal line. The at least one first signal line and the at least one first ground line may be exposed through an upper surface of the first base. The at least one first signal line may be configured to conduct a test current through the first base. An interposer may also include a second base below the first base and may include a printed circuit board between the first base and the second base. A probe card may include a multilayer substrate having at least one contact needle, a coaxial board having at least one coaxial signal cable and the above described interposer between the multilayer substrate and the coaxial board.
摘要翻译：插入器可以包括第一基极，第一基极中的至少一个第一信号线和第一基极中的至少一个第一接地线，其中接地线包围至少一个第一信号线。所述至少一个第一信号线和所述至少一个第一接地线可以通过所述第一基座的上表面暴露。所述至少一个第一信号线可以被配置为进行穿过所述第一基座的测试电流。插入器还可以包括位于第一基座下方的第二基座，并且可以包括在第一基座和第二基座之间的印刷电路板。探针卡可以包括具有至少一个接触针的多层衬底，具有至少一个同轴信号电缆的同轴板以及多层衬底和同轴板之间的上述插入器。

16. 发明申请

US20070166630A1 Photomasks including multi-layered light-shielding and methods of manufacturing the same 审中-公开
标题翻译：光掩模包括多层光屏蔽及其制造方法
公开(公告)号：US20070166630A1
公开(公告)日：2007-07-19
申请号：US11649775
申请日：2007-01-05
申请人： Chang-Hwan Kim , Suk-Ho Lee , Young-Soo An
发明人： Chang-Hwan Kim , Suk-Ho Lee , Young-Soo An
IPC分类号： B32B9/00 , B32B17/06 , B32B17/10 , G03C5/00 , G03F1/00
CPC分类号： C03C17/36 , C03C17/361 , C03C17/3613 , C03C17/3649 , C03C17/3665 , G03F1/58 , G03F1/80 , Y10T428/31616
摘要： Example embodiments may provide photomasks including multi-layered light-shielding, and methods of manufacturing the same. An example embodiment may include a transparent substrate, and a multi-layered light-shielding layer having non-transparent and transparent layers alternately laminated on the transparent substrate.
摘要翻译：示例性实施例可以提供包括多层遮光的光掩模及其制造方法。示例性实施例可以包括透明基板和具有交替层压在透明基板上的非透明和透明层的多层遮光层。

17. 发明授权

US07884628B2 Interposer and probe card having the same 有权
标题翻译：内插器和探针卡具有相同的功能
公开(公告)号：US07884628B2
公开(公告)日：2011-02-08
申请号：US12285962
申请日：2008-10-17
申请人： Young-Soo An , Sang-Hoon Lee , Se-Jang Oh
发明人： Young-Soo An , Sang-Hoon Lee , Se-Jang Oh
IPC分类号： G01R31/02
CPC分类号： G01R31/2889 , H01R12/714
摘要： An interposer may include a first base, at least one first signal line in the first base, and at least one first ground line in the first base, wherein the ground line surrounds the at least one first signal line. The at least one first signal line and the at least one first ground line may be exposed through an upper surface of the first base. The at least one first signal line may be configured to conduct a test current through the first base. An interposer may also include a second base below the first base and may include a printed circuit board between the first base and the second base. A probe card may include a multilayer substrate having at least one contact needle, a coaxial board having at least one coaxial signal cable and the above described interposer between the multilayer substrate and the coaxial board.
摘要翻译：插入器可以包括第一基极，第一基极中的至少一个第一信号线和第一基极中的至少一个第一接地线，其中接地线包围至少一个第一信号线。所述至少一个第一信号线和所述至少一个第一接地线可以通过所述第一基座的上表面暴露。所述至少一个第一信号线可以被配置为进行穿过所述第一基座的测试电流。插入器还可以包括位于第一基座下方的第二基座，并且可以包括在第一基座和第二基座之间的印刷电路板。探针卡可以包括具有至少一个接触针的多层衬底，具有至少一个同轴信号电缆的同轴板以及多层衬底和同轴板之间的上述插入器。

18. 发明授权

US07880490B2 Wireless interface probe card for high speed one-shot wafer test and semiconductor testing apparatus having the same 有权
标题翻译：无线接口探针卡，用于高速单片晶圆测试和半导体测试装置
公开(公告)号：US07880490B2
公开(公告)日：2011-02-01
申请号：US12200716
申请日：2008-08-28
申请人： Sang-Hoon Lee , Kwang-Yong Lee , Se-Jang Oh , Young-Soo An
发明人： Sang-Hoon Lee , Kwang-Yong Lee , Se-Jang Oh , Young-Soo An
IPC分类号： G01R31/28
CPC分类号： G01R31/2889 , G01R31/3025
摘要： A wireless interface probe card includes a substrate member and a transmission member. The substrate member has a plurality of probe terminals arranged at a constant pitch. The probe terminals may directly contact a plurality of pads arranged at a constant pitch on each of a plurality of semiconductor chips arranged on a wafer to perform a test of the semiconductor chips arranged on the wafer. The transmission member is arranged on the substrate member, wirelessly receives a test signal and provides the received test signal to the pads of the wafer through the probe terminals, and wirelessly and externally transmits an electrical characteristic signal provided from the pads of the wafer through the probe terminals.
摘要翻译：无线接口探针卡包括基板部件和传输部件。基板构件具有以恒定间距排列的多个探针端子。探针端子可以直接接触布置在晶片上的多个半导体芯片中的每一个上以恒定间距布置的多个焊盘，以对布置在晶片上的半导体芯片进行测试。传输构件布置在基板构件上，无线地接收测试信号，并通过探针端子将接收到的测试信号提供给晶片的焊盘，并且通过以下方式无线地和外部地传输从晶片的焊盘提供的电特性信号探头端子。

19. 发明授权

US07438563B2 Connector for testing a semiconductor package 有权
标题翻译：用于测试半导体封装的连接器
公开(公告)号：US07438563B2
公开(公告)日：2008-10-21
申请号：US11295208
申请日：2005-12-05
申请人： Young-Bae Chung , Hyun-Seop Shim , Jeong-Ho Bang , Jae-Il Lee , Hyun-Kyo Seo , Young-Soo An , Soon-Geol Hwang
发明人： Young-Bae Chung , Hyun-Seop Shim , Jeong-Ho Bang , Jae-Il Lee , Hyun-Kyo Seo , Young-Soo An , Soon-Geol Hwang
IPC分类号： H01R4/58
CPC分类号： G01R1/0483 , G01R1/045 , G01R1/0466 , G01R31/2863
摘要： In one embodiment, a connector is made using a mixture of insulating silicone powder and conductive powder. The connector comprises a connector body formed from the insulating silicone powder and on or more preferably regularly arrayed conductive silicone members that are formed by migrating the conductive powder to a site of the connector corresponding to a solder ball of the semiconductor package. The conductive silicone member comprises a high-density conductive silicone part formed to be proximate an upper surface of the connector body and to protrude therefrom and a low-density conductive silicone part formed in substantial vertical alignment beneath the high-density conductive silicone part, the low-density conductive silicone part having a lower surface exposed from a lower surface of the connector body.
摘要翻译：在一个实施例中，使用绝缘硅氧烷粉末和导电粉末的混合物制造连接器。连接器包括由绝缘硅氧烷粉末形成的连接器主体，并且通过将导电粉末迁移到对应于半导体封装的焊料球的连接部位而形成的或更优选地规则排列的导电硅树脂构件。导电硅树脂构件包括形成为接近连接器主体的上表面并从其突出的高密度导电硅树脂部件和在高密度导电硅树脂部件下方基本上垂直取向形成的低密度导电硅树脂部件，低密度导电硅部件，其具有从连接器本体的下表面露出的下表面。

20. 发明申请

US20060076965A1 Contact-free test system for semiconductor device 审中-公开
标题翻译：无接触式半导体器件测试系统
公开(公告)号：US20060076965A1
公开(公告)日：2006-04-13
申请号：US11147437
申请日：2005-06-08
申请人： Young-Soo An , Hun-Kyo Seo , Hyun-Seop Shim , Jeong-Seon Kim , Ki-Don Hong , Tcherniak Valeri
发明人： Young-Soo An , Hun-Kyo Seo , Hyun-Seop Shim , Jeong-Seon Kim , Ki-Don Hong , Tcherniak Valeri
IPC分类号： G01R31/305
CPC分类号： G01R31/307
摘要： The present invention provides a contact-free test system for testing a semiconductor device. The contact-free test system comprises a test signal member applying a test signal to the semiconductor device, an electronic beam radiator generating a first electronic beam and radiating it to an area of the semiconductor device, a detector to detect a second electronic beam reflected from the semiconductor device, and a comparator to compare the test signal with the second electronic beam.
摘要翻译：本发明提供了一种用于测试半导体器件的无接触测试系统。无接触测试系统包括向半导体器件施加测试信号的测试信号部件，产生第一电子束并将其辐射到半导体器件的区域的电子束辐射器，检测器，用于检测从半导体器件反射的第二电子束半导体器件和比较器，用于将测试信号与第二电子束进行比较。

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