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    • 15. 发明申请
    • Low-Doped Semi-Insulating Sic Crystals and Method
    • 低掺杂半绝缘矽晶体和方法
    • US20080190355A1
    • 2008-08-14
    • US11629584
    • 2005-07-06
    • Jihong ChenIlya ZwiebackAvinash K. GuptaDonovan L. BarrettRichard H. HopkinsEdward SemenasThomas A. AndersonAndrew E. Souzis
    • Jihong ChenIlya ZwiebackAvinash K. GuptaDonovan L. BarrettRichard H. HopkinsEdward SemenasThomas A. AndersonAndrew E. Souzis
    • C30B33/02H01B1/02
    • H01L29/1608C30B23/00C30B29/36H01L21/02378H01L21/02529H01L21/02581H01L21/02631
    • The invention relates to substrates of semi-insulating silicon carbide used for semiconductor devices and a method for making the same. The substrates have a resistivity above 106 Ohm-cm, and preferably above 108 Ohm-cm, and most preferably above 109 Ohm-cm, and a capacitance below 5 pF/mm2 and preferably below 1 pF/mm2. The electrical properties of the substrates are controlled by a small amount of added deep level impurity, large enough in concentration to dominate the electrical behavior, but small enough to avoid structural defects. The substrates have concentrations of unintentional background impurities, including shallow donors and acceptors, purposely reduced to below 5·1016 cm−3, and preferably to below 1·1016 cm−3, and the concentration of deep level impurity is higher, and preferably at least two times higher, than the difference between the concentrations of shallow acceptors and shallow donors. The deep level impurity comprises one of selected metals from the periodic groups IB, IIB, IIIB, IVB, VB, VIB, VIIB and VIIIB. Vanadium is a preferred deep level element. In addition to controlling the resistivity and capacitance, a further advantage of the invention is an increase in electrical uniformity over the entire crystal and reduction in the density of crystal defects.
    • 本发明涉及用于半导体器件的半绝缘碳化硅的衬底及其制造方法。 基板的电阻率高于106欧姆 - 厘米,优选高于108欧姆 - 厘米,最优选高于109欧姆 - 厘米,电容低于5 pF / mm2,最好低于1 pF / mm2。 基板的电学特性由少量的加入的深度杂质控制,其浓度足够大以控制电气行为,但足够小以避免结构缺陷。 底物具有无意的背景杂质浓度,包括浅供体和受体,故意降低至5.1016cm-3以下,优选低于1.1016cm-3,深层杂质的浓度较高,优选至少高两倍 ,比浅受体和浅供体的浓度之间的差异。 深层杂质包括选自周期性基团IB,IIB,IIIB,IVB,VB,VIB,VIIB和VIIIB的金属之一。 钒是首选的深层元素。 除了控制电阻率和电容之外,本发明的另一个优点是在整个晶体上的电均匀性的增加和晶体缺陷密度的降低。
    • 17. 发明申请
    • System, apparatus, and methods for performing state-based authentication
    • 用于执行基于状态的认证的系统,装置和方法
    • US20070283418A1
    • 2007-12-06
    • US11344894
    • 2006-02-01
    • Jihong ChenSam HsuSaeed Rajput
    • Jihong ChenSam HsuSaeed Rajput
    • G06F7/04
    • G06F21/31
    • A system for authenticating access to a data processing device or database is provided. The system includes a comparison module for comparing an attempt identifier with an account identifier, and a state-determining module for determining a state variable associated with at least one of the attempt identifier and the account identifier. The state-determining module determines the state variable by incrementing the state variable if the attempt identifier does not match the account identifier and if the state variable is less than a predetermined upper bound threshold, decrementing the state variable if the attempt identifier does match the account identifier and if the state variable is greater than a predetermined lower bound threshold, and authenticating the attempt identifier if the attempt identifier does match the account identifier and if the state variable equals the predetermined lower bound threshold.
    • 提供了用于认证对数据处理设备或数据库的访问的系统。 该系统包括用于将尝试标识符与帐户标识符进行比较的比较模块,以及用于确定与至少一个尝试标识符和帐户标识符相关联的状态变量的状态确定模块。 状态确定模块如果尝试标识符与帐户标识符不匹配并且如果状态变量小于预定的上限阈值则通过递增状态变量来确定状态变量,如果尝试标识符与帐户匹配则递减状态变量 标识符,如果状态变量大于预定的下限阈值,并且如果尝试标识符与帐户标识符匹配并且状态变量等于预定下限阈值则认证尝试标识符。
    • 18. 发明申请
    • Novel method to form memory cells to improve programming performance of embedded memory technology
    • 用于形成内存单元以提高嵌入式存储器技术编程性能的新方法
    • US20070278557A1
    • 2007-12-06
    • US11443779
    • 2006-05-31
    • Jihong ChenEddie Hearl BreashearsXin WangJohn Howard Macpeak
    • Jihong ChenEddie Hearl BreashearsXin WangJohn Howard Macpeak
    • H01L29/788
    • H01L29/7881H01L21/26586H01L27/115H01L27/11521H01L29/40114
    • An embedded memory device and method of forming MOS transistors having reduced masking requirements and defects using a single drain sided halo implant in the NMOS FLASH or EEPROM memory regions is discussed. The memory device comprises a memory region and a logic region. Logic transistors within the logic region have halos implanted at an angle underlying the channel from both drain and source region sides. Asymmetric memory cell transistors within the memory region receive a selective halo implant only from the drain side of the channel and not from the source side to form a larger halo on the drain side and leave a higher dopant concentration more deeply into the source side. One method of asymmetrically forming memory cell transistors comprises masking over the memory region; halo implanting a first conductivity dopant in NMOS regions of the logic region in first and second implant directions; masking over the logic region; halo implanting the first conductivity dopant in NMOS regions of the memory region in the second implant direction only, thereby reducing the number of masks required; masking over the memory region; halo implanting a second conductivity dopant in PMOS regions of the logic region in the first and second implant directions.
    • 讨论了在NMOS闪存或EEPROM存储器区域中使用单个漏极侧卤素注入形成具有减小的掩模要求和缺陷的MOS晶体管的嵌入式存储器件和方法。 存储器件包括存储器区域和逻辑区域。 逻辑区域内的逻辑晶体管具有从沟道和源极区两侧的通道下方的角度注入的光晕。 存储器区域内的不对称存储单元晶体管仅从沟道的漏极侧接收选择性晕圈注入而不从源极接收,以在漏极侧形成较大的卤素,并且在源极侧更高的掺杂浓度。 一种不对称形成存储单元晶体管的方法包括:对存储区进行掩蔽; 在第一和第二植入方向上在所述逻辑区域的NMOS区域中注入第一电导率掺杂剂; 屏蔽逻辑区域; 在第二注入方向仅在存储区域的NMOS区域中注入第一电导率掺杂剂,从而减少所需的掩模数量; 掩蔽内存区域; 在所述第一和第二植入方向上在所述逻辑区域的PMOS区域中注入第二电导率掺杂剂。