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    • 13. 发明申请
    • Schottky device and process of making the same
    • 肖特基器件和制作过程相同
    • US20080116539A1
    • 2008-05-22
    • US11601131
    • 2006-11-17
    • Chiu-Chih ChiangChih-Feng HuangYou-Kuo WuLong Shih Lin
    • Chiu-Chih ChiangChih-Feng HuangYou-Kuo WuLong Shih Lin
    • H01L29/872H01L21/329
    • H01L29/872H01L29/0692
    • A Schottky device and a semiconductor process of making the same are provided. The Schottky device comprises a substrate, a deep well, a Schottky contact, and an Ohmic contact. The substrate is doped with a first type of ions. The deep well is doped with a second type of ions, and formed in the substrate. The Schottky contact contacts a first electrode with the deep well. The Ohmic contact contacts a second electrode with a heavily doped region with the second type of ions in the deep well. Wherein the deep well has a geometry gap with a width formed under the Schottky contact, the first type of ions and the second type of ions are complementary, and the width of the gap adjusts the breakdown voltage. In addition, the semiconductor process comprises the steps of forming a deep well with a second type of ions in a substrate with a first type of ions; forming a first doped region with the first type of ions; forming an oxide layer; forming a second doped region in the deep well with the first type of ions; forming a heavily doped region in the deep well with the second type of ions; and forming a first electrode on a Schottky contact on the deep well and a second electrode on an Ohmic contact on the heavily doped region.
    • 提供了一种肖特基器件及其制造方法。 肖特基器件包括衬底,深阱,肖特基接触和欧姆接触。 衬底掺杂有第一类型的离子。 深阱掺杂有第二类离子,并形成在衬底中。 肖特基接触器与深井接触第一电极。 欧姆接触接触具有重掺杂区域的第二电极,第二种类型的离子在深阱中。 其中深阱具有在肖特基接触下形成的宽度的几何间隙,第一类型的离子和第二类型的离子是互补的,并且间隙的宽度调节击穿电压。 此外,半导体工艺包括以下步骤:在具有第一类型离子的衬底中形成具有第二类型离子的深阱; 形成具有所述第一类型离子的第一掺杂区域; 形成氧化物层; 在所述深井中用所述第一类型的离子形成第二掺杂区域; 在深井中用第二类离子形成重掺杂区; 以及在深阱上的肖特基接触上形成第一电极,在重掺杂区域上的欧姆接触上形成第二电极。
    • 14. 发明申请
    • Semiconductor resistor and semiconductor process of making the same
    • 半导体电阻和半导体制程相同
    • US20080061374A1
    • 2008-03-13
    • US11516982
    • 2006-09-07
    • Chiu-Chih ChiangChih-Feng Huang
    • Chiu-Chih ChiangChih-Feng Huang
    • H01L29/76
    • H01L29/8605
    • A semiconductor resistor and a semiconductor process of making the same are provided. The semiconductor resistor comprises a substrate, a deep well, at least two contact regions, and a doped region. The substrate is doped with a first type of ions. The deep well is doped with a second type of ions, and formed in the substrate. The contact regions are heavily doped with the second type of ions, and formed in the deep well. The doped region is doped with the first type of ions, and is separated from the deep well by a distance. Wherein the first type of ions and the second type of ions are complementary, and the distance between the deep well and the doped region adjusts the breakdown voltage. In addition, the semiconductor process comprises the steps of forming a deep well containing a first type of ions; forming a doped region containing a second type of ions; forming an oxide layer; and forming at least two contact regions containing the first type of ions in the deep well.
    • 提供半导体电阻器及其制造方法。 半导体电阻器包括衬底,深阱,至少两个接触区域和掺杂区域。 衬底掺杂有第一类型的离子。 深阱掺杂有第二类离子,并形成在衬底中。 接触区域被第二类离子重掺杂,形成在深阱中。 掺杂区域掺杂有第一类离子,并与深阱分离一定距离。 其中第一类离子和第二类离子是互补的,并且深阱和掺杂区之间的距离调节击穿电压。 此外,半导体工艺包括形成含有第一类型离子的深阱的步骤; 形成含有第二类离子的掺杂区; 形成氧化物层; 以及在所述深井中形成含有所述第一类型离子的至少两个接触区域。
    • 15. 发明申请
    • Semiconductor structure of a high side driver and method for manufacturing the same
    • 高侧驱动器的半导体结构及其制造方法
    • US20080023786A1
    • 2008-01-31
    • US11492039
    • 2006-07-25
    • Chiu-Chih ChiangChih-Feng Huang
    • Chiu-Chih ChiangChih-Feng Huang
    • H01L29/00
    • H01L29/10H01L29/063H01L29/7835
    • A semiconductor structure of a high side driver includes an ion-doped junction. The ion-doped junction includes a substrate, a first deep well and a second deep well, a first heavy ion-doped region and a second heavy ion-doped region. The first deep well and second deep well are formed in the substrate, which are separated but partially linked with each other, and the first deep well and the second deep well have the same ion-doped type. The first heavy ion-doped region is formed in the first deep well for connecting to a first high voltage, and the first heavy ion-doped region has the same ion-doped type as the first deep well. The second heavy ion-doped region is formed in the second deep well for connecting to a second high voltage, and the second heavy ion-doped region has the same ion-doped type as the first deep well.
    • 高侧驱动器的半导体结构包括离子掺杂结。 离子掺杂结包括衬底,第一深阱和第二深阱,第一重离子掺杂区和第二重离子掺杂区。 第一深阱和第二深阱形成在衬底中,其被分离但部分地彼此连接,并且第一深阱和第二深阱具有相同的离子掺杂型。 第一重离子掺杂区域形成在第一深阱中以连接到第一高电压,并且第一重离子掺杂区域具有与第一深阱相同的离子掺杂类型。 第二重离子掺杂区域形成在第二深阱中用于连接到第二高电压,并且第二重离子掺杂区域具有与第一深阱相同的离子掺杂类型。
    • 17. 发明授权
    • Semiconductor device for electrostatic discharge protection
    • 用于静电放电保护的半导体器件
    • US07888704B2
    • 2011-02-15
    • US12222746
    • 2008-08-15
    • Chiu-Chih ChiangHan-Chung Tai
    • Chiu-Chih ChiangHan-Chung Tai
    • H01L29/74
    • H01L27/0262H01L29/7436
    • A semiconductor device for electrostatic discharge protection is disclosed, and at least comprises a high-voltage parasite silicon controlled rectifier (HVSCR) and a diode. The HVSCR has an anode and a cathode, and the cathode of HVSCR is coupled to a ground. The diode, coupled to the HVSCR in series, also has an anode and a cathode. The anode of the diode is coupled to the anode of the HVSCR, and the cathode of the diode is coupled to a terminal applied with a positive voltage. The diode has a second conductivity type zone that could be constructed to form several strips or small blocks spaced apart from each other. Those small blocks could be any shapes and arranged regularly or randomly.
    • 公开了一种用于静电放电保护的半导体器件,并且至少包括高压寄生器可控硅整流器(HVSCR)和二极管。 HVSCR具有阳极和阴极,HVSCR的阴极耦合到地面。 串联连接到HVSCR的二极管也具有阳极和阴极。 二极管的阳极耦合到HVSCR的阳极,二极管的阴极耦合到施加正电压的端子。 二极管具有第二导电类型区域,其可以构造成形成彼此间隔开的几个条或小块。 这些小块可以是任何形状,并定期或随机排列。
    • 18. 发明申请
    • Semiconductor device for electrostatic discharge protection
    • 用于静电放电保护的半导体器件
    • US20100038677A1
    • 2010-02-18
    • US12222746
    • 2008-08-15
    • Chiu-Chih ChiangHan-Chung Tai
    • Chiu-Chih ChiangHan-Chung Tai
    • H01L29/74
    • H01L27/0262H01L29/7436
    • A semiconductor device for electrostatic discharge protection is disclosed, and at least comprises a high-voltage parasite silicon controlled rectifier (HVSCR) and a diode. The HVSCR has an anode and a cathode, and the cathode of HVSCR is coupled to a ground. The diode, coupled to the HVSCR in series, also has an anode and a cathode. The anode of the diode is coupled to the anode of the HVSCR, and the cathode of the diode is coupled to a terminal applied with a positive voltage. The diode has a second conductivity type zone that could be constructed to form several strips or small blocks spaced apart from each other. Those small blocks could be any shapes and arranged regularly or randomly.
    • 公开了一种用于静电放电保护的半导体器件,并且至少包括高压寄生器可控硅整流器(HVSCR)和二极管。 HVSCR具有阳极和阴极,并且HVSCR的阴极耦合到地面。 串联连接到HVSCR的二极管也具有阳极和阴极。 二极管的阳极耦合到HVSCR的阳极,二极管的阴极耦合到施加正电压的端子。 二极管具有第二导电类型区域,其可以构造成形成彼此间隔开的几个条或小块。 这些小块可以是任何形状,并定期或随机排列。
    • 20. 发明授权
    • Semiconductor structure of a high side driver for two high voltage nodes with partially linked deep wells and method for manufacturing the same
    • 具有部分连接的深井的两个高压节点的高侧驱动器的半导体结构及其制造方法
    • US07589393B2
    • 2009-09-15
    • US11492039
    • 2006-07-25
    • Chiu-Chih ChiangChih-Feng Huang
    • Chiu-Chih ChiangChih-Feng Huang
    • H01L29/06
    • H01L29/10H01L29/063H01L29/7835
    • A semiconductor structure of a high side driver includes an ion-doped junction. The ion-doped junction includes a substrate, a first deep well and a second deep well, a first heavy ion-doped region and a second heavy ion-doped region. The first deep well and second deep well are formed in the substrate, which are separated but partially linked with each other, and the first deep well and the second deep well have the same ion-doped type. The first heavy ion-doped region is formed in the first deep well for connecting to a first high voltage, and the first heavy ion-doped region has the same ion-doped type as the first deep well. The second heavy ion-doped region is formed in the second deep well for connecting to a second high voltage, and the second heavy ion-doped region has the same ion-doped type as the first deep well.
    • 高侧驱动器的半导体结构包括离子掺杂结。 离子掺杂结包括衬底,第一深阱和第二深阱,第一重离子掺杂区和第二重离子掺杂区。 第一深阱和第二深阱形成在衬底中,其被分离但部分地彼此连接,并且第一深阱和第二深阱具有相同的离子掺杂型。 第一重离子掺杂区域形成在第一深阱中以连接到第一高电压,并且第一重离子掺杂区域具有与第一深阱相同的离子掺杂类型。 第二重离子掺杂区域形成在第二深阱中用于连接到第二高电压,并且第二重离子掺杂区域具有与第一深阱相同的离子掺杂类型。