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    • 18. 发明授权
    • Two component polyurethane coating
    • 双组分聚氨酯涂料
    • US4743653A
    • 1988-05-10
    • US61208
    • 1987-06-12
    • Syuhei NumataMasanori OhiwaToshihiro MaekawaAkio KashiharaTadafumi Miyazono
    • Syuhei NumataMasanori OhiwaToshihiro MaekawaAkio KashiharaTadafumi Miyazono
    • C09D175/04C08G75/04
    • C09D175/04
    • A two component polyurethane coating consisting of a principal component (A) comprising a hydroxyl group containing film-forming resin, crosslinked polymer particles and a solvent for said film-forming resin, and a hardener component (B) comprising a polyisocyanate compound, which is characterized by using as said crosslinked polymer particles the composite resin particles each comprising a particulate crosslinked polymer core and a number of substantially linear polymer chains coupled with said core in either way of chemical bonding, semi-interpenetration or both of them, the solid weight ratio of said hydroxyl group containing film-forming resin to said composite resin particles being 99/1 to 40/60 and the equivalent ratio of isocyanate groups in the hardener component (B) to hydroxyl groups in the principal component (A) (if the linear polymer chains contain hydroxyl groups, the sum of said hydroxyl groups and those of the hydroxyl group containing film-forming resin) being 0.5 to 2.0.The coating composition is excellent in dispersion stability, application characteristics and drying fastness and capable of resulting an excellent coat.
    • 由包含含羟基的成膜树脂的主成分(A),交联聚合物颗粒和所述成膜树脂的溶剂组成的双组分聚氨酯涂料和包含多异氰酸酯化合物的固化剂组分(B) 其特征在于使用作为所述交联聚合物颗粒的复合树脂颗粒,其各自包含颗粒状交联聚合物芯和多个基本上线性的聚合物链,以与化学键合,半互穿或两者两者的方式与所述芯连接,固体重量比 所述含羟基的成膜树脂对所述复合树脂颗粒为99/1至40/60,并且固化剂组分(B)中异氰酸酯基团与主成分(A)中羟基的当量比(如果为直链 聚合物链含有羟基,所述羟基和含羟基的成膜树脂的总和)为0.5〜2 .0。 涂料组合物的分散稳定性,使用特性和耐干燥性优异,能够得到优异的涂膜。
    • 19. 发明授权
    • Method of forming solder mask
    • 形成焊接掩模的方法
    • US5368884A
    • 1994-11-29
    • US118231
    • 1993-09-09
    • Yoshikazu YamagamiAkio KashiharaMamoru SeioHisaki Tanabe
    • Yoshikazu YamagamiAkio KashiharaMamoru SeioHisaki Tanabe
    • G03F7/16H05K3/00H05K3/28B05D1/00
    • G03F7/164H05K3/28H05K2203/1105H05K2203/1355H05K3/0079
    • The present invention has as its object providing a solder mask which permits high density mounting, is suitable for protecting conductor circuits, particularly has mask thickness on the circuit parts and each edge part of the circuits which make almost no difference from those on other parts, and is excellent in electrical insulation, heat resistance and solvent resistance.This invention provides a method of forming a solder mask for printed circuit boards, using any powder paint which is curable by both irradiation of ultraviolet ray and heat, comprising:(1) a step of coating the powder paint on a printed circuit board, while holding it at a temperature higher than a softening point of the powder paint,(2) a step of irradiating ultraviolet rays thereon through a pattern mask,(3) a step of making development with a medium which dissolves the region not irradiated by ultraviolet rays and,(4) a step of completely curing the coating part developed on the printed circuit board at a temperature higher than the curing temperature of the powder paint.
    • 本发明的目的是提供一种允许高密度安装的焊接掩模,适用于保护导体电路,特别是在电路部件和电路的每个边缘部分具有掩模厚度,与其它部件几乎没有区别, 电绝缘性,耐热性和耐溶剂性优异。 本发明提供一种形成印刷电路板用焊料掩模的方法,使用可通过紫外线照射和热照射两者固化的任何粉末涂料,其包括:(1)在粉末涂料上涂布印刷电路板的步骤,同时 将其保持在高于粉末涂料的软化点的温度下,(2)通过图案掩模在其上照射紫外线的步骤,(3)利用溶解未被紫外线照射的区域的介质进行显影的步骤 和(4)在高于粉末涂料的固化温度的温度下完全固化在印刷电路板上显影的涂层部分的步骤。