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11. 发明授权

US08558460B2 Plasma processing apparatus 有权
标题翻译：等离子体处理装置
公开(公告)号：US08558460B2
公开(公告)日：2013-10-15
申请号：US13146086
申请日：2010-01-25
申请人： Masaru Nonomura , Hiroshi Haji , Kiyoshi Arita
发明人： Masaru Nonomura , Hiroshi Haji , Kiyoshi Arita
IPC分类号： H01J7/24
CPC分类号： H01J37/32935
摘要： A plasma processing apparatus includes: a vacuum chamber; a plasma processing execution portion; a discharge state detecting unit; a window portion; a camera; a first storing portion; a second storing portion; and an image data extracting unit. The image data extracting unit extracts at least moving image data, which show the generation state of the abnormal discharge, from the first storing portion and stores the extracted moving image data in the second storing portion when the discharge state detecting unit detects the abnormal discharge.
摘要翻译：一种等离子体处理装置，包括：真空室; 等离子体处理执行部分; 放电状态检测单元; 窗口部分; 相机; 第一存储部分; 第二存储部分; 和图像数据提取单元。当排出状态检测单元检测到异常放电时，图像数据提取单元至少从第一存储部分中提取表示异常放电的生成状态的运动图像数据并将提取的运动图像数据存储在第二存储部分中。

12. 发明申请

US20130000554A1 RESIN COATING DEVICE IN LED PACKAGE MANUFACTURING SYSTEM 审中-公开
标题翻译： LED封装制造系统中的树脂涂层设备
公开(公告)号：US20130000554A1
公开(公告)日：2013-01-03
申请号：US13634153
申请日：2011-05-09
申请人： Masaru Nonomura
发明人： Masaru Nonomura
IPC分类号： B05C11/00
CPC分类号： H01L33/0095 , H01L2224/48091 , H01L2224/49107 , H01L2224/83192 , H01L2224/92247 , H01L2933/0041 , H01L2924/00014
摘要： There are preliminarily prepared element characteristic information 12 that is obtained by individually, previously measuring emission characteristics of a plurality of LED elements and resin coating information 14 that makes a coating quantity of resin appropriate for obtaining an LED package exhibiting a specified emission characteristic correlated with the element characteristic information. A map preparation processing section 74 prepares, for each substrate, map data 18 that correlate populating position information 71a showing a position of an LED element populated on the substrate by a component populating machine M1 with the element characteristic information 12. According to the map data 18 and the resin coating information 14, a resin coating machine M4 coats the respective LED elements populated on the substrate with an appropriate coating quantity of resin.
摘要翻译：预先准备的元素特征信息12是通过分别预先测量多个LED元件的发光特性和树脂涂层信息14获得的，树脂涂层信息14使得树脂的涂布量适于获得具有与元素特征信息。地图准备处理部分74为每个基板准备地图数据18，其将表示由元件填充机M1填充在基板上的LED元件的位置的填充位置信息71a与元件特性信息12相关联。根据地图数据如图18所示，树脂涂布信息14，树脂涂布机M4以适当的树脂涂布量涂覆填充在基板上的各个LED元件。

13. 发明授权

US6120585A Reflow soldering device 失效
标题翻译：回流焊接装置
公开(公告)号：US6120585A
公开(公告)日：2000-09-19
申请号：US155932
申请日：1998-10-07
申请人： Akio Inomata , Masaru Nonomura , Masuo Masui , Naoichi Chikahisa
发明人： Akio Inomata , Masaru Nonomura , Masuo Masui , Naoichi Chikahisa
IPC分类号： B01D53/34 , B01D46/42 , B23K1/012 , H05K3/34 , B01D46/00
CPC分类号： B23K1/012
摘要： A reflow soldering device extracts a vaporized component of a contaminative material, such as flux, from exhaust gas from a reflow furnace. The device includes a conveyor for transferring a circuit substrate, a heater for heating the transferred circuit substrate, a cooler for cooling the circuit substrate which has been reflow soldered by heater, discharge pipes and a discharge blower for discharging an exhaust gas at high temperature from the heater to the outside of the device, and a flux remover mounted in the discharge pipes which cools the exhaust gas to 70.degree. C. and below, preferably 60.degree. C. and below, so as to cause a vaporized component, such as flux contained in the exhaust gas, to become liquid or solid and to be removed.
摘要翻译： PCT No.PCT / JP97 / 01608 Sec。 371日期：1998年10月7日 102（e）日期1998年10月7日PCT提交1997年5月12日PCT公布。出版物WO97 / 43884 日期1997年11月20日回流焊接装置从回流炉的废气中提取污染物质（例如助熔剂）的蒸发成分。该装置包括用于传送电路基板的输送机，用于加热转移的电路基板的加热器，用于冷却已经被加热器回流焊接的电路基板的冷却器，排出管和用于将高温排出的废气排出的排气鼓风机加热器到装置的外部，以及安装在排气管中的助焊剂去除器，其将排气冷却至70℃以下，优选在60℃以下，从而使汽化成分例如助熔剂包含在废气中，成为液体或固体并被除去。

14. 发明授权

US08993353B2 LED package manufacturing system and resin coating method for use in LED package manufacturing system 有权
标题翻译： LED封装制造系统和树脂涂层方法用于LED封装制造系统
公开(公告)号：US08993353B2
公开(公告)日：2015-03-31
申请号：US14000346
申请日：2012-05-30
申请人： Masaru Nonomura
发明人： Masaru Nonomura
IPC分类号： H01L21/66 , H01L33/50 , H01L23/00
CPC分类号： H01L22/10 , H01L24/97 , H01L33/50 , H01L2224/48091 , H01L2224/49107 , H01L2924/12041 , H01L2924/12042 , H01L2924/3025 , H01L2933/0041 , H01L2924/00014 , H01L2924/00
摘要： In resin coating, carrying a light-passing member test-coated with a resin on a light-passing member carrying unit; making a light source placed above the light-passing member carrying unit emit excitation light exciting the fluorescent substance; measuring light emission characteristics of the light by irradiating the excitation light emitted from the light source unit from above to the resin coated onto the light-passing member and receiving the light that the resin emits from below the light-passing member by a light emission characteristic measurement unit; obtaining a deviation between a measurement result of the light emission characteristic measurement unit and a prescribed light emission characteristic; and deriving the appropriate resin coating quantity of the resin to be coated onto the LED element as what is used for practical production based on the deviation.
摘要翻译：在树脂涂层中，在透光构件承载单元上承载用树脂测试的光通过构件; 使得放置在光通过构件承载单元上方的光源发射激发荧光物质的激发光; 通过将从光源单元发射的激发光从上方照射到涂覆在光通过构件上的树脂并通过发光特性接收树脂从光通过构件下方发出的光来测量光的发光特性测量单位; 获得发光特性测量单元的测量结果与规定的发光特性之间的偏差; 并根据偏差将用于实际生产的涂料的树脂的合适树脂涂布量导出到LED元件上。

15. 发明授权

US08614118B2 Component bonding method, component laminating method and bonded component structure 有权
标题翻译：组分粘合方法，组分层压方法和结合组分结构
公开(公告)号：US08614118B2
公开(公告)日：2013-12-24
申请号：US12280615
申请日：2007-02-09
申请人： Hiroshi Haji , Mitsuru Ozono , Teruaki Kasai , Masaru Nonomura
发明人： Hiroshi Haji , Mitsuru Ozono , Teruaki Kasai , Masaru Nonomura
IPC分类号： H01L21/00
CPC分类号： H01L24/83 , H01L24/29 , H01L24/32 , H01L24/73 , H01L24/75 , H01L25/0657 , H01L25/50 , H01L2224/29007 , H01L2224/2919 , H01L2224/29298 , H01L2224/32145 , H01L2224/32225 , H01L2224/32245 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/73265 , H01L2224/83191 , H01L2224/83193 , H01L2224/83855 , H01L2224/83856 , H01L2224/92247 , H01L2225/0651 , H01L2225/06575 , H01L2924/00013 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01018 , H01L2924/01033 , H01L2924/01057 , H01L2924/01082 , H01L2924/0665 , H01L2924/07802 , H01L2924/00014 , H01L2924/00 , H01L2924/00012 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2224/2929
摘要： Provided is a component bonding method of bonding a semiconductor component having a thermosetting adhesive layer formed on a lower surface thereof to a circuit board having a resin layer formed on a surface thereof. In the method, wettability is improved by surface modification that performs a plasma treatment on a resin surface of the circuit board, the semiconductor component is held by a component holding nozzle having a heater, the adhesive layer is contacted to the surface-modified resin layer, and the adhesive layer is heated and thermally cured by the heater. Thereby, adhesion between the adhesive layer and the resin surface is improved, and thus the component holding nozzle can be separated from the semiconductor component without wait for completely hardening the adhesive layer. Accordingly, it is possible to improve productivity in the heat pressing process by reducing the time required for the component bonding.
摘要翻译：提供了一种将在其下表面上形成有热固性粘合层的半导体部件与其表面上形成有树脂层的电路板接合的部件接合方法。在该方法中，通过对电路板的树脂表面进行等离子体处理的表面改性来提高润湿性，半导体部件由具有加热器的部件保持喷嘴保持，粘合层与表面改性树脂层接触，并且通过加热器加热并热固化粘合剂层。由此，可以提高粘合剂层与树脂表面之间的粘附性，从而能够使部件保持用喷嘴与半导体部件分离，而不用等待粘合剂层的完全硬化。因此，通过减少部件接合所需的时间，可以提高热压加工的生产率。

16. 发明申请

US20130288404A1 LIGHT EMITTING ELEMENT MANUFACTURING SYSTEM AND MANUFACTURING METHOD AND LIGHT EMITTING ELEMENT PACKAGE MANUFACTURING SYSTEM AND MANUFACTURING METHOD 审中-公开
标题翻译：发光元件制造系统及制造方法及发光元件包装制造系统及制造方法
公开(公告)号：US20130288404A1
公开(公告)日：2013-10-31
申请号：US13822489
申请日：2012-08-31
申请人： Masaru Nonomura
发明人： Masaru Nonomura
IPC分类号： H01L33/52
CPC分类号： H01L33/52 , H01L24/97 , H01L33/0095 , H01L33/50 , H01L2224/48091 , H01L2224/49107 , H01L2224/743 , H01L2224/83192 , H01L2224/92247 , H01L2924/181 , H01L2933/0041 , H01L2924/00014 , H01L2924/00012
摘要： In manufacturing light emitting element packages by coating the top surfaces of LED elements with the resin containing the fluorescent substance, in a resin supplying operation of discharging to supply the resin onto the LED elements in a wafer state, the light emission characteristics of the light that the resin emits when excitation light from a light source part is irradiated onto a light-passing member on which the resin is test supplied for light emission characteristic measurement are measured, and the appropriate resin supply quantity is revised based on the result of the measurement and light emission characteristics prescribed beforehand, to derive an appropriate resin supply quantity of the resin which should be supplied to the LED elements for practical production.
摘要翻译：在通过用包含荧光物质的树脂涂覆LED元件的顶表面来制造发光元件封装中，在以晶片状态将树脂供应到LED元件的树脂供给操作中进行放电的树脂的发光特性，当来自光源部分的激发光照射到被供给用于发光特性测量的测试树脂的光通过部件上时，树脂发射，并且基于测量结果修改适当的树脂供给量，预先规定的发光特性，得到适用于实际生产中应提供给LED元件的树脂的树脂供给量。

17. 发明申请

US20130236991A1 RESIN COATING DEVICE AND A RESIN COATING METHOD 有权
标题翻译：树脂涂料设备和树脂涂料方法
公开(公告)号：US20130236991A1
公开(公告)日：2013-09-12
申请号：US13885510
申请日：2012-05-30
申请人： Masaru Nonomura
发明人： Masaru Nonomura
IPC分类号： H01L21/66
CPC分类号： H01L22/12 , H01L24/97 , H01L33/50 , H01L2224/49107 , H01L2224/92247 , H01L2924/12041 , H01L2924/12042 , H01L2933/0041 , H01L2924/00
摘要： In a resin coating which is used in the manufacture of an LED package which is made by covering an LED element with resin that includes fluorescent substance, a light-passing member (43) on which the resin (8) is test coated for light emission characteristic measurement is carried on a light-passing member carrying unit (41), a deviation between a measurement result obtained after the light emission characteristic of the light that the resin (8) emits, when an light source unit (45), which is placed above, emits excitation light which excites the fluorescent substance, and irradiates the excitation light from above to the resin (8) which is coated on the light-passing member (43), is measured and the light emission characteristic prescribed beforehand is obtained, and an appropriate resin coating quantity with which the resin should be coated on the LED element is derived for practical production based on the deviation.
摘要翻译：在用于制造LED封装的树脂涂层中，所述LED封装通过用包含荧光物质的树脂覆盖LED元件而制成，其上涂有树脂（8）的发光元件（43）用于发光在光通过部件承载单元（41）上进行特性测量，即当光源单元（45）（即，树脂（8））发出时，在树脂（8）发射的光的发光特性之后获得的测量结果之间的偏差发射激发荧光物质的激发光，并将来自上面的激发光照射到涂覆在光通过部件（43）上的树脂（8）上，并获得预先规定的发光特性，基于偏差实现生产，得出在LED元件上涂布树脂的合适的树脂涂布量。

18. 发明申请

US20130210174A1 RESIN COATING DEVICE AND RESIN COATING METHOD 审中-公开
标题翻译：树脂涂料和树脂涂料方法
公开(公告)号：US20130210174A1
公开(公告)日：2013-08-15
申请号：US13881881
申请日：2011-05-11
申请人： Masaru Nonomura
发明人： Masaru Nonomura
IPC分类号： H01L21/67
CPC分类号： H01L21/6715 , H01L22/10 , H01L24/97 , H01L33/0095 , H01L2224/48091 , H01L2224/49107 , H01L2224/73265 , H01L2224/92247 , H01L2924/12041 , H01L2924/181 , H01L2933/0041 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： In a resin coating used for manufacturing an LED package including an LED element coated with resin containing phosphor, a light-transmitting member test-coated with resin for an emission characteristic measurement on a light-transmitting member placing section including a light source unit, a deviation between a measurement result of an emission characteristic of light emitted from the resin coated on the light-transmitting member measured by an emission characteristic measurement unit by irradiating the resin with excitation light emitted from the light source unit and a prescribed emission characteristic is obtained, and an appropriate resin coating amount of the resin to be coated on the LED element for an actual production is derived based on the deviation.
摘要翻译：在用于制造LED封装的树脂涂层中，所述LED封装包括涂覆有含有荧光体的树脂的LED元件，在包括光源单元的透光元件放置部分上测试用于发射特性测量的树脂的透光元件，获得由通过用光源单元发射的激发光照射树脂和由规定的发射特性通过发射特性测量单元测量的涂覆在透光部件上的树脂的发射特性的测量结果之间的偏差，基于偏差导出用于实际生产的要涂覆在LED元件上的树脂的合适的树脂涂布量。

19. 发明申请

US20130192061A1 LED PACKAGE MANUFACTURING SYSTEM AND RESIN COATING METHOD IN LED PACKAGE MANUFACTURING SYSTEM 有权
标题翻译： LED封装制造系统中的LED封装制造系统及树脂涂装方法
公开(公告)号：US20130192061A1
公开(公告)日：2013-08-01
申请号：US13877746
申请日：2011-05-11
申请人： Masaru Nonomura
发明人： Masaru Nonomura
IPC分类号： H05K3/30
CPC分类号： H05K3/301 , H01L33/0095 , H01L33/507 , H01L2224/48091 , H01L2224/49107 , H01L2933/0041 , Y10T29/53174 , H01L2924/00014
摘要： In resin coating used for manufacturing the LED package in which the LED elements is covered with a resin containing a phosphor, a translucent member 43 coated with a resin 8 on trial as light emitting characteristic measurement is mounted on a translucent member mounting unit 41 having a light source unit, and an excitation light emitted from the light source unit is irradiated onto the resin 8 coated on the translucent member 43, and a deviation between a measurement result obtained by measuring the light emitting characteristics of a light emitted by the resin 8 by a light emitting characteristic measurement unit 39 and light emitting characteristics specified in advance is obtained, and an appropriate resin coating amount of the resin to be coated on the LED elements as real production is calculated on the basis of the deviation.
摘要翻译：在用于制造其中LED元件被含有荧光体的树脂覆盖的LED封装的树脂涂层中，在作为发光特性测量的试验中涂覆有树脂8的透光性部件43安装在具有发光特性测量的半透明部件安装单元41上，光源单元和从光源单元发射的激发光照射到涂覆在透光部件43上的树脂8上，并且通过测量由树脂8发射的光的发光特性而得到的测量结果之间的偏差获得发光特性测量单元39和预先规定的发光特性，并且基于偏差计算作为实际生产的要涂覆在LED元件上的树脂的合适的树脂涂布量。

20. 发明申请

US20120204793A1 LED PACKAGE MANUFACTURING SYSTEM 审中-公开
标题翻译： LED封装制造系统
公开(公告)号：US20120204793A1
公开(公告)日：2012-08-16
申请号：US13503695
申请日：2011-05-09
申请人： Masaru Nonomura
发明人： Masaru Nonomura
IPC分类号： H01L21/00
CPC分类号： H01L33/50 , H01L33/0095 , H01L2224/48091 , H01L2224/49107 , H01L2224/73265 , H01L2224/83192 , H01L2224/92247 , H01L2933/0041 , H01L2924/00014
摘要： There are preliminarily prepared element characteristic information 12 that is obtained by individually, previously measuring emission characteristics of a plurality of LED elements and resin coating information 14 that makes a coating quantity of resin appropriate for obtaining an LED package exhibiting a specified emission characteristic correlated with the element characteristic information. A map preparation processing section 74 prepares, for each substrate, map data 18 that correlate populating position information 71 a showing a position of an LED element populated on the substrate by a component populating machine Ml with the element characteristic information 12. According to the map data 18 and the resin coating information 14, a resin coating machine M4 coats the respective LED elements populated on the substrate with an appropriate coating quantity of resin.
摘要翻译：预先准备的元素特征信息12是通过分别预先测量多个LED元件的发光特性和树脂涂层信息14获得的，树脂涂层信息14使得树脂的涂布量适于获得具有与元素特征信息。地图准备处理部分74为每个基板准备地图数据18，其将表示基板上填充的LED元件的位置的填充位置信息71a与元件特征信息12相关联。根据该图数据18和树脂涂布信息14，树脂涂布机M4以适当的树脂涂布量涂覆填充在基板上的各个LED元件。

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