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11. 发明申请

US20090143560A1 Optical Element and Achromatic Lens 失效
标题翻译：光学元件和消色差透镜
公开(公告)号：US20090143560A1
公开(公告)日：2009-06-04
申请号：US12084620
申请日：2006-11-08
申请人： Kunio Hatanaka , Yoshihiko Imanaka , Masanori Monri
发明人： Kunio Hatanaka , Yoshihiko Imanaka , Masanori Monri
IPC分类号： C08G64/06
CPC分类号： G02B1/04 , C08G64/10 , G02B1/041 , G02B27/0037 , G02B27/4211 , G02B27/4272 , C08L69/00
摘要： There are provided an optical element that comprises a polymer which has a structural unit derived from a specific dihydroxy compound typified by 2,2-bis(4-hydroxyphenyl)-1,1,1,3,3,3-hexafluoro propane (bisphenol AF) and in which the relationship between a refractive index nD and an Abbe number νD satisfies the following formula (I): nD+0.0076×νD≦1.78 (I) and that is used for correction of chromatic aberration, and an achromatic lens using the optical element.
摘要翻译：提供了一种光学元件，其包含聚合物，其具有衍生自以2,2-双（4-羟基苯基）-1,1,1,3,3,3-六氟丙烷（双酚）为代表的特定二羟基化合物的结构单元 AF），折射率nD与阿贝数nuD之间的关系满足下式（I）：<？in-line-formula description =“In-line Formulas”end =“lead”？> nD + 0.0076 xnuD <= 1.78（I）<？in-line-formula description =“In-line Formulas”end =“tail”？>，用于色差校正，以及使用该光学元件的消色差透镜。

12. 发明申请

US20070230151A1 Circuit substrate and electronic apparatus, fabrication process thereof 有权
标题翻译：电路基板及电子设备及其制造工艺
公开(公告)号：US20070230151A1
公开(公告)日：2007-10-04
申请号：US11507505
申请日：2006-08-22
申请人： Nobuyuki Hayashi , Yoshihiko Imanaka
发明人： Nobuyuki Hayashi , Yoshihiko Imanaka
IPC分类号： H05K1/11 , H05K1/14
CPC分类号： H05K1/162 , H05K3/4602 , H05K2201/0175 , H05K2201/0187 , H05K2201/09509 , H05K2201/096 , H05K2201/09809 , H05K2201/09827 , H05K2203/1366
摘要： A circuit substrate comprises a lamination of plural resin insulation films and includes, on a surface and in an interior of the circuit substrate, plural interconnection layers. One of the plural resin insulation films is formed on a first conductor pattern constituting one of the plural interconnection layers in such a manner that a bottom principal surface of the resin insulation film makes a contact with a surface of the first conductor pattern, the resin insulation film including an opening defined by a sloped surface and exposing the first conductor pattern at the bottom principal surface. A ceramic high-K dielectric film is formed at a bottom of the opening in contact with the surface of the first conductor pattern, wherein there is formed a second conductor pattern constituting one of the plural interconnection layers on the resin insulation film so as to cover the sloped surface and in contact with a surface of the ceramic high-K dielectric film.
摘要翻译：电路基板包括多个树脂绝缘膜的叠层，并且在电路基板的表面和内部包括多个互连层。多个树脂绝缘膜之一形成在构成多个互连层之一的第一导体图案上，使得树脂绝缘膜的底部主表面与第一导体图案的表面接触，树脂绝缘体膜包括由倾斜表面限定的开口并且在底部主表面处暴露第一导体图案。陶瓷高K电介质膜形成在与第一导体图案的表面接触的开口的底部，其中在树脂绝缘膜上形成构成多个互连层之一的第二导体图案，以覆盖倾斜的表面并与陶瓷高K电介质膜的表面接触。

13. 发明授权

US07176556B2 Semiconductor system-in-package 有权
标题翻译：半导体系统封装
公开(公告)号：US07176556B2
公开(公告)日：2007-02-13
申请号：US10092525
申请日：2002-03-08
申请人： Keishiro Okamoto , Takeshi Shioga , Osamu Taniguchi , Koji Omote , Yoshihiko Imanaka , Yasuo Yamagishi
发明人： Keishiro Okamoto , Takeshi Shioga , Osamu Taniguchi , Koji Omote , Yoshihiko Imanaka , Yasuo Yamagishi
IPC分类号： H01L29/40 , H01L29/00 , H01L23/34
CPC分类号： H01L23/49816 , H01L21/4846 , H01L23/49822 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H01L2224/16235 , H01L2924/01019 , H01L2924/01046 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/15192 , H01L2924/3011
摘要： A semiconductor apparatus comprises a support substrate having through holes filles with conductor adapted to a first pitch; a capacitor formed on or above said support substrate; a wiring layer formed on or above said support substrate, leading some of said through holes filles with conductor upwards through said capacitor, having branches, and having wires of a second pitch different from said first pitch; and plural semiconductor elements disposed on or above said wiring layer, having terminals adapted to the second pitch, and connected with said wiring layer via said terminals. A semiconductor apparatus, in which semiconductor elements having a narrow terminal pitch, a support having through wires at a wider pitch, and a capacitor are suitably electrically connected to realize the decoupling function with reduced inductance and large capacitance.
摘要翻译：一种半导体装置，包括：支撑基板，其具有填充有适于第一间距的导体的通孔; 形成在所述支撑基板上或上方的电容器; 形成在所述支撑基板上或上方的布线层，使一些所述通孔向上填充有通过所述电容器的导体，具有分支，并且具有不同于所述第一间距的第二间距的导线; 以及设置在所述布线层上或上方的多个半导体元件，具有适于所述第二间距的端子，并且经由所述端子与所述布线层连接。其中具有窄端子间距的半导体元件，具有较宽节距的导线的支撑件和电容器的半导体装置被适当地电连接以实现具有减小的电感和大电容的去耦功能。

14. 发明授权

US06846567B1 Surface-protected transparent plastic composite 失效
标题翻译：表面保护透明塑料复合材料
公开(公告)号：US06846567B1
公开(公告)日：2005-01-25
申请号：US09890326
申请日：2000-01-31
申请人： Tatsuya Ekinaka , Yoshihiko Imanaka
发明人： Tatsuya Ekinaka , Yoshihiko Imanaka
IPC分类号： C08J7/04 , B32B25/20
CPC分类号： C08J7/042 , C08J2369/00 , Y10T428/31507 , Y10T428/31663 , Y10T428/31667 , Y10T428/31855
摘要： A surface-protected plastic composite material comprising a transparent plastic, a coating layer (I) as a first layer stacked on the transparent plastic and a thermally cured coating layer (II) as a second layer stacked on the first layer, the coating layer (I) being formed of a resin composition containing at least 50% by weight, based on the resin content thereof, of an acrylic resin which is an acrylic resin containing at least 50 mol % of recurring unit based on an alkyl methacrylate, the thermally cured coating layer (II) being made of an organosiloxane resin formed from the following components a, b and c, (A) colloidal silica (component a), (B) a hydrolysis condensate (component b) of a trialkoxysilane, (C) a hydrolysis condensate (component c) of a tetraalkoxysilane, the organosiloxane resin containing 5 to 45% by weight of the component a, 50 to 80% by weight of the component b and 2 to 30% by weight of the component c, and use of the composite material as a window glass. The present invention provides a transparent plastic composite material that is remarkably improved in abrasion resistance and anti-peeling properties.
摘要翻译：一种表面保护的塑料复合材料，其包括透明塑料，作为层叠在透明塑料上的第一层的涂层（I）和作为层叠在第一层上的第二层的热固化涂层（II），涂层 I）由含有至少50重量％的树脂组合物形成，其树脂含量为丙烯酸树脂，丙烯酸树脂为含有至少50摩尔％的基于甲基丙烯酸烷基酯的重复单元的丙烯酸树脂，热固化涂层（II）由以下组分a，b和c，（A）胶体二氧化硅（组分a），（B）三烷氧基硅烷的水解缩合物（组分b）形成的有机硅氧烷树脂制成，（C）四烷氧基硅烷的水解缩合物（组分c），含有5〜45重量％的组分a的有机硅氧烷树脂，50〜80重量％的组分b和2〜30重量％的组分c，以及使用复合材料作为窗玻璃本发明提供了一种在耐磨性和抗剥离性方面显着提高的透明塑料复合材料。

15. 发明授权

US08373966B2 Structural body, capacitor, and method of fabricating the capacitor 有权
标题翻译：结构体，电容器和制造电容器的方法
公开(公告)号：US08373966B2
公开(公告)日：2013-02-12
申请号：US12575791
申请日：2009-10-08
申请人： Yoshihiko Imanaka
发明人： Yoshihiko Imanaka
IPC分类号： H01G4/018
CPC分类号： H01G4/20 , H01G4/10 , H01G4/33 , Y10T428/24942
摘要： A structural body which includes a first dielectric layer formed on a first substrate and including first conductive particles, each surface of the first conductive particles being entirely covered with a first dielectric film; and a second dielectric layer formed on the first dielectric layer wherein a volume ratio of a dielectric in the second dielectric layer is higher than a volume ratio of a dielectric in the first dielectric layer.
摘要翻译：一种结构体，包括形成在第一基板上并包括第一导电颗粒的第一介电层，第一导电颗粒的每个表面全部被第一介电膜覆盖; 以及形成在所述第一电介质层上的第二电介质层，其中所述第二电介质层中的电介质的体积比高于所述第一电介质层中的电介质的体积比。

16. 发明授权

US07557014B2 Semiconductor system-in-package 有权
标题翻译：半导体系统封装
公开(公告)号：US07557014B2
公开(公告)日：2009-07-07
申请号：US11600211
申请日：2006-11-16
申请人： Keishiro Okamoto , Takeshi Shioga , Osamu Taniguchi , Koji Omote , Yoshihiko Imanaka , Yasuo Yamagishi
发明人： Keishiro Okamoto , Takeshi Shioga , Osamu Taniguchi , Koji Omote , Yoshihiko Imanaka , Yasuo Yamagishi
IPC分类号： H01L21/00 , H01L21/20 , H01L21/4763
CPC分类号： H01L23/49816 , H01L21/4846 , H01L23/49822 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H01L2224/16235 , H01L2924/01019 , H01L2924/01046 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/15192 , H01L2924/3011
摘要： A semiconductor apparatus comprises a support substrate having through holes filles with conductor adapted to a first pitch; a capacitor formed on or above said support substrate; a wiring layer formed on or above said support substrate, leading some of said through holes filles with conductor upwards through said capacitor, having branches, and having wires of a second pitch different from said first pitch; and plural semiconductor elements disposed on or above said wiring layer, having terminals adapted to the second pitch, and connected with said wiring layer via said terminals. A semiconductor apparatus, in which semiconductor elements having a narrow terminal pitch, a support having through wires at a wider pitch, and a capacitor are suitably electrically connected to realize the decoupling function with reduced inductance and large capacitance.
摘要翻译：一种半导体装置，包括：支撑基板，其具有填充有适于第一间距的导体的通孔; 形成在所述支撑基板上或上方的电容器; 形成在所述支撑基板上或上方的布线层，使一些所述通孔向上填充有通过所述电容器的导体，具有分支，并且具有不同于所述第一间距的第二间距的导线; 以及设置在所述布线层上或上方的多个半导体元件，具有适于所述第二间距的端子，并且经由所述端子与所述布线层连接。其中具有窄端子间距的半导体元件，具有较宽节距的导线的支撑件和电容器的半导体装置被适当地电连接以实现具有减小的电感和大电容的去耦功能。

17. 发明授权

US07468490B2 Circuit substrate and electronic apparatus, fabrication process thereof 有权
标题翻译：电路基板及电子设备及其制造工艺
公开(公告)号：US07468490B2
公开(公告)日：2008-12-23
申请号：US11507505
申请日：2006-08-22
申请人： Nobuyuki Hayashi , Yoshihiko Imanaka
发明人： Nobuyuki Hayashi , Yoshihiko Imanaka
IPC分类号： H05K1/03
CPC分类号： H05K1/162 , H05K3/4602 , H05K2201/0175 , H05K2201/0187 , H05K2201/09509 , H05K2201/096 , H05K2201/09809 , H05K2201/09827 , H05K2203/1366
摘要： A circuit substrate comprises a lamination of plural resin insulation films and includes, on a surface and in an interior of the circuit substrate, plural interconnection layers. One of the plural resin insulation films is formed on a first conductor pattern constituting one of the plural interconnection layers in such a manner that a bottom principal surface of the resin insulation film makes a contact with a surface of the first conductor pattern, the resin insulation film including an opening defined by a sloped surface and exposing the first conductor pattern at the bottom principal surface. A ceramic high-K dielectric film is formed at a bottom of the opening in contact with the surface of the first conductor pattern, wherein there is formed a second conductor pattern constituting one of the plural interconnection layers on the resin insulation film so as to cover the sloped surface and in contact with a surface of the ceramic high-K dielectric film.
摘要翻译：电路基板包括多个树脂绝缘膜的叠层，并且在电路基板的表面和内部包括多个互连层。多个树脂绝缘膜之一形成在构成多个互连层之一的第一导体图案上，使得树脂绝缘膜的底部主表面与第一导体图案的表面接触，树脂绝缘体膜包括由倾斜表面限定的开口并且在底部主表面处露出第一导体图案。陶瓷高K电介质膜形成在与第一导体图案的表面接触的开口的底部，其中在树脂绝缘膜上形成构成多个互连层之一的第二导体图案，以覆盖倾斜的表面并与陶瓷高K电介质膜的表面接触。

18. 发明申请

US20070065981A1 Semiconductor system-in-package 有权
公开(公告)号：US20070065981A1
公开(公告)日：2007-03-22
申请号：US11600211
申请日：2006-11-16
申请人： Keishiro Okamoto , Takeshi Shioga , Osamu Taniguchi , Koji Omote , Yoshihiko Imanaka , Yasuo Yamagishi
发明人： Keishiro Okamoto , Takeshi Shioga , Osamu Taniguchi , Koji Omote , Yoshihiko Imanaka , Yasuo Yamagishi
IPC分类号： H01L21/00
CPC分类号： H01L23/49816 , H01L21/4846 , H01L23/49822 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H01L2224/16235 , H01L2924/01019 , H01L2924/01046 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/15192 , H01L2924/3011
摘要： A semiconductor apparatus comprises a support substrate having through holes filles with conductor adapted to a first pitch; a capacitor formed on or above said support substrate; a wiring layer formed on or above said support substrate, leading some of said through holes filles with conductor upwards through said capacitor, having branches, and having wires of a second pitch different from said first pitch; and plural semiconductor elements disposed on or above said wiring layer, having terminals adapted to the second pitch, and connected with said wiring layer via said terminals. A semiconductor apparatus, in which semiconductor elements having a narrow terminal pitch, a support having through wires at a wider pitch, and a capacitor are suitably electrically connected to realize the decoupling function with reduced inductance and large capacitance.

19. 发明授权

US5286713A Method for manufacturing an oxide superconducting circuit board by printing 失效
标题翻译：通过印刷制造氧化物超导电路板的方法
公开(公告)号：US5286713A
公开(公告)日：1994-02-15
申请号：US64668
申请日：1993-05-21
申请人： Hiromitsu Yokoyama , Yoshihiko Imanaka , Kazunori Yamanaka , Nobuo Kamehara , Koichi Niwa , Takuya Uzumaki , Hitoshi Suzuki , Takato Machi
发明人： Hiromitsu Yokoyama , Yoshihiko Imanaka , Kazunori Yamanaka , Nobuo Kamehara , Koichi Niwa , Takuya Uzumaki , Hitoshi Suzuki , Takato Machi
IPC分类号： B32B18/00 , C04B35/45 , H01L21/48 , H01L21/768 , H01L23/498 , H01L39/24 , B05D3/02 , B05D5/12
CPC分类号： H01L21/4846 , B32B18/00 , C04B35/4504 , C04B35/4512 , C04B35/4521 , C04B37/005 , H01L21/76891 , H01L23/49888 , H01L39/2429 , C04B2235/6567 , C04B2235/6585 , C04B2237/066 , C04B2237/125 , C04B2237/34 , C04B2237/343 , C04B2237/592 , C04B2237/62 , C04B2237/68 , C04B2237/704 , C04B2237/708 , H01L2924/0002 , H01L2924/09701 , Y10S428/901 , Y10S428/93 , Y10S505/701 , Y10S505/703 , Y10S505/741
摘要： A superconducting circuit board is provided comprising a sintered alumina board containing more than 99% by weight of alumina and an interconnection pattern of an superconducting ceramics formed on the alumina board. Adhesion of the interconnection pattern to the alumina board is improved by an addition of Ti or Si coupling agent to a paste for forming the interconnection pattern. The use of copper powder in place of copper oxide powder as an ingredient forming a superconducting ceramics in the paste is advantageous for printing and obtaining a uniform superconducting ceramic pattern.
摘要翻译：提供了一种超导电路板，其包括含有超过99重量％的氧化铝的烧结氧化铝板和形成在氧化铝板上的超导陶瓷的互连图案。通过在用于形成互连图案的糊料中添加Ti或Si偶联剂来改善互连图案与氧化铝板的粘合性。使用铜粉代替氧化铜粉末作为糊料中形成超导陶瓷的成分有利于印刷和获得均匀的超导陶瓷图案。

20. 发明授权

US5196384A Method for preparing green sheets 失效
标题翻译：制作绿皮书的方法
公开(公告)号：US5196384A
公开(公告)日：1993-03-23
申请号：US761006
申请日：1991-09-17
申请人： Hiroshi Kamezaki , Masato Wakamura , Kishio Yokouchi , Yoshihiko Imanaka , Nobuo Kamehara
发明人： Hiroshi Kamezaki , Masato Wakamura , Kishio Yokouchi , Yoshihiko Imanaka , Nobuo Kamehara
IPC分类号： C04B38/08 , C03C11/00 , C03C14/00 , C03C17/02 , C03C17/25 , C04B35/622 , H01L21/48 , H01L23/15 , H05K1/03 , H05K3/46
CPC分类号： H05K1/0306 , C03C11/002 , C03C14/004 , C03C17/02 , C03C17/25 , H01L21/4807 , C03C2214/04 , C03C2218/113
摘要： Methods for preparing a green sheet and a glass ceramic substrate are herein disclosed.The object of these methods is to make green sheets and glass ceramic substrates practically acceptable, the green sheets and the glass ceramic substrates having a low dielectric constant and low scattering in properties, and the method comprises the steps of preparing a mixture of hollow silica microspheres, borosilicate glass powder and ceramic powder as a principal ingredient, adding a plasticizer, a binder and a solvent to the mixture, kneading the mixture and forming it into a green sheet, wherein the shell-thickness of the hollow silica microspheres is controlled so that the specific gravity of the hollow silica microspheres is approximately equal to that of the solvent and wherein an inorganic substance containing aluminum as a constituent element such as alumina, mullite or aluminum nitride is used as the ceramic powder for forming the green sheet; or the method further comprises the step of calcining the resulting green sheet.
摘要翻译：本文公开了制备生片和玻璃陶瓷衬底的方法。这些方法的目的是使生片和玻璃陶瓷基板实际上可接受，生片和玻璃陶瓷基片具有低介电常数和低散射特性，并且该方法包括制备中空二氧化硅微球的混合物的步骤，硼硅酸盐玻璃粉末和陶瓷粉末作为主要成分，向混合物中加入增塑剂，粘合剂和溶剂，捏合混合物并将其形成生片，其中控制中空二氧化硅微球的壳厚度，使得中空二氧化硅微球的比重近似等于溶剂的比重，其中使用含有铝作为构成元素的无机物质如氧化铝，莫来石或氮化铝作为形成生片的陶瓷粉末; 或者该方法还包括煅烧所得生片的步骤。

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