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11. 发明授权

US08446736B2 Circuit board and manufacturing method thereof 失效
标题翻译：电路板及其制造方法
公开(公告)号：US08446736B2
公开(公告)日：2013-05-21
申请号：US12305046
申请日：2008-05-28
申请人： Takayuki Kita , Masaaki Katsumata , Tadashi Nakamura , Kota Fukasawa , Kazuhiro Furugoori
发明人： Takayuki Kita , Masaaki Katsumata , Tadashi Nakamura , Kota Fukasawa , Kazuhiro Furugoori
IPC分类号： H05K1/11
CPC分类号： H05K1/183 , H01L21/481 , H01L21/4857 , H01L23/13 , H01L23/49822 , H01L2224/16 , H01L2224/16235 , H01L2924/00011 , H01L2924/00014 , H01L2924/01078 , H01L2924/01079 , H01L2924/09701 , H01L2924/15153 , H01L2924/15165 , H01L2924/1517 , H01L2924/19105 , H05K3/4614 , H05K3/4697 , H05K2201/10378 , H05K2203/061 , H05K2203/063 , Y10T29/49126 , Y10T29/49144 , Y10T29/49165 , Y10T156/1062 , Y10T428/24273 , Y10T428/24893 , Y10T428/24917 , H01L2224/0401
摘要： An upper board having an opening and forming a circuit on a surface layer, a connection sheet between boards having an opening and forming conductive holes filled with conductive paste in through-holes, and a lower board forming a circuit on a surface layer are stacked up, heated and pressed. In particular, the connection sheet between boards is made of a material different from the upper board and the lower board. A multi-layer circuit board having a cavity structure, and a full-layer IVH structure with high interlayer connection reliability can be manufactured.
摘要翻译：具有开口并在表面层上形成电路的上板，具有开口的板和在通孔中填充有导电膏的形成导电孔的连接片和在表面层上形成电路的下板被堆叠，加热按压。特别地，板之间的连接片由与上板和下板不同的材料制成。可以制造具有空腔结构的多层电路板和具有高层间连接可靠性的全层IVH结构。

12. 发明申请

US20120272520A1 METHOD OF MANUFACTURING CIRCUIT BOARD 失效
标题翻译：制造电路板的方法
公开(公告)号：US20120272520A1
公开(公告)日：2012-11-01
申请号：US13446562
申请日：2012-04-13
申请人： Tsuyoshi Himori , Masaaki Katsumata , Toshikazu Kondou
发明人： Tsuyoshi Himori , Masaaki Katsumata , Toshikazu Kondou
IPC分类号： H01K3/10
CPC分类号： H05K3/4069 , B23K35/025 , B23K35/302 , H05K3/4652 , H05K2203/178 , Y02P70/613 , Y10T29/49126 , Y10T29/49158 , Y10T29/49165
摘要： In a method of manufacturing a circuit board, a conductive paste is filled in a first hole formed on a first prepreg having both sides to which a first protective film is caused to stick so that a first circuit board is manufactured. A fiber piece housing paste obtained by mixing a fiber piece is recovered to obtain a recovery paste; filtration is carried out through a filter; a solvent or the like is added; and a viscosity, a composition ratio or the like is adjusted so that a reuse paste is fabricated. The reuse paste is filled in a second hole formed on a second prepreg having both sides to which a second protective film is caused to stick.
摘要翻译：在制造电路板的方法中，将导电浆料填充在形成有第一预浸料坯的第一孔中，该第一预浸料坯具有使第一保护膜粘合的两侧，从而制造第一电路板。回收通过混合纤维片获得的纤维片外壳糊，得到回收膏; 过滤通过过滤器进行; 加入溶剂等; 并且调节粘度，组成比等，从而制造再利用浆料。将再利用糊料填充在形成有第二预浸料坯的第二孔中，所述第二预浸料坯具有使第二保护膜粘附的两侧。

13. 发明授权

US07382628B2 Circuit-component-containing module 有权
标题翻译：电路元件模块
公开(公告)号：US07382628B2
公开(公告)日：2008-06-03
申请号：US10499036
申请日：2003-09-04
申请人： Eiji Kawamoto , Masaaki Hayama , Masaaki Katsumata , Hiroki Yabe , Takeo Yasuho
发明人： Eiji Kawamoto , Masaaki Hayama , Masaaki Katsumata , Hiroki Yabe , Takeo Yasuho
IPC分类号： H05K1/18
CPC分类号： H05K3/284 , H01L2924/15311 , H05K1/0218 , H05K1/141 , H05K3/3442 , H05K3/3452 , H05K2201/0989 , H05K2201/10636 , Y02P70/611
摘要： A circuit component built-in module is provided in which a solder that is remelted when the circuit component built-in module is mounted on a motherboard by using the solder is prevented from flowing to the outside of the prescribed electrodes.A first groove (116) is formed in a solder resist (106) located between two electrodes (103) to which a circuit component (104) is connected. A configuration is used in which the space between the first groove (116) and circuit component (104) is filled with a first insulating resin (107).
摘要翻译：提供了一种电路部件内置模块，其中当电路部件内置模块通过使用焊料安装在母板上时被重新熔化的焊料被防止流向规定电极的外部。第一凹槽（116）形成在位于电路部件（104）所连接的两个电极（103）之间的阻焊剂（106）中。使用其中第一凹槽（116）和电路部件（104）之间的空间填充有第一绝缘树脂（107）的构造。

14. 发明申请

US20050067177A1 Module and method of manufacturing module 失效
标题翻译：模块和制造模块的方法
公开(公告)号：US20050067177A1
公开(公告)日：2005-03-31
申请号：US10952476
申请日：2004-09-29
申请人： Ryuichi Saito , Hiroshi Kagata , Masaaki Katsumata
发明人： Ryuichi Saito , Hiroshi Kagata , Masaaki Katsumata
IPC分类号： H01L23/12 , H01L21/48 , H01L21/56 , H01L21/60 , H01L23/13 , H01L23/31 , H01L23/498 , H01L25/065 , H01L25/16 , H03H9/10 , H05K1/03 , H05K3/28 , H05K3/30 , H01L23/28
CPC分类号： H01L25/16 , H01L21/4857 , H01L21/563 , H01L23/13 , H01L23/3121 , H01L23/49822 , H01L24/81 , H01L2224/05001 , H01L2224/05023 , H01L2224/05568 , H01L2224/16225 , H01L2224/16235 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2224/81801 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01033 , H01L2924/01047 , H01L2924/01057 , H01L2924/01075 , H01L2924/014 , H01L2924/09701 , H01L2924/12042 , H01L2924/14 , H01L2924/15151 , H01L2924/15192 , H01L2924/15787 , H01L2924/181 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19105 , H03H9/0542 , H03H9/0557 , H03H9/1085 , H05K1/0306 , H05K3/284 , H05K3/305 , H05K2201/09036 , H05K2201/10636 , H05K2201/10674 , Y02P70/611 , Y02P70/613 , Y10T29/43 , Y10T29/435 , Y10T29/49126 , Y10T29/49163 , Y10T29/49165 , Y10T29/49171 , H01L2924/00 , H01L2224/05599 , H01L2224/05099
摘要： A module includes a ceramic substrate, first and second electrodes provided on the ceramic substrate, a component having third and fourth electrodes connected to the first and second electrodes, respectively, and a resin filled in a space between the component and the ceramic substrate. The ceramic substrate has a surface thereof having a recess formed therein. The first and second electrodes are provided on the surface of the ceramic substrate so that the recess is located between the first and second electrodes. The component is located over the recess and spaced from the ceramic substrate with a space including the recess. The space including the recess is filled with the resin. The module allows each component to be surface mounted at higher bonding strength, thus preventing short-circuit between the electrodes on the substrate and improving the operation reliability.
摘要翻译：模块包括陶瓷基板，设置在陶瓷基板上的第一和第二电极，分别具有连接到第一和第二电极的第三和第四电极以及填充在部件和陶瓷基板之间的空间中的树脂。陶瓷基板的表面具有形成在其中的凹部。第一和第二电极设置在陶瓷基板的表面上，使得凹槽位于第一和第二电极之间。所述部件位于所述凹部之上并与所述陶瓷基板间隔开并具有包括所述凹部的空间。包含凹部的空间用树脂填充。该模块允许每个部件以更高的接合强度进行表面安装，从而防止基板上的电极之间的短路并提高操作可靠性。

15. 发明申请

US20050051358A1 Circuit-component-containing module 有权
标题翻译：电路元件模块
公开(公告)号：US20050051358A1
公开(公告)日：2005-03-10
申请号：US10499036
申请日：2003-09-04
申请人： Eiji Kawamoto , Masaaki Hayama , Masaaki Katsumata , Hiroki Yabe , Takeo Yasuho
发明人： Eiji Kawamoto , Masaaki Hayama , Masaaki Katsumata , Hiroki Yabe , Takeo Yasuho
IPC分类号： H05K1/02 , H05K1/14 , H05K3/28 , H05K3/34 , H05K3/46 , H05K9/00 , H05K7/06
CPC分类号： H05K3/284 , H01L2924/15311 , H05K1/0218 , H05K1/141 , H05K3/3442 , H05K3/3452 , H05K2201/0989 , H05K2201/10636 , Y02P70/611
摘要： A circuit component built-in module is provided in which a solder that is remelted when the circuit component built-in module is mounted on a motherboard by using the solder is prevented from flowing to the outside of the prescribed electrodes. A first groove (116) is formed in a solder resist (106) located between two electrodes (103) to which a circuit component (104) is connected. A configuration is used in which the space between the first groove (116) and circuit component (104) is filled with a first insulating resin (107).
摘要翻译：提供了一种电路部件内置模块，其中当电路部件内置模块通过使用焊料安装在母板上时被重新熔化的焊料被防止流向规定电极的外部。第一凹槽（116）形成在位于电路部件（104）所连接的两个电极（103）之间的阻焊剂（106）中。使用其中第一凹槽（116）和电路部件（104）之间的空间填充有第一绝缘树脂（107）的构造。

16. 发明授权

US5594406A Zinc oxide varistor and process for the production thereof 失效
标题翻译：氧化锌变阻器及其生产方法
公开(公告)号：US5594406A
公开(公告)日：1997-01-14
申请号：US122604
申请日：1993-10-01
申请人： Kazushige Koyama , Naoki Mutoh , Masaaki Katsumata
发明人： Kazushige Koyama , Naoki Mutoh , Masaaki Katsumata
IPC分类号： H01C7/112 , H01C7/10
CPC分类号： H01C7/112 , Y10T29/49099
摘要： A product and process of making such product in which a varistor is formed by diffusing lead borosilicate-type glass, into a surface of a fired or sintered zinc oxide substrate, i.e., "varistor element," during formation of an electrode on the surface of the substrate. Typically, an electrode paste or material, comprising a mixture or lead borosilicate-type glass frit and Ag powder, is applied to the substrate and provides the lead borosilicate-type glass for diffusing into the substrate. The improvement is that the lead borosilicate-type glass frit for the electrode paste or material comprises a mixture of PbO, B.sub.2 O.sub.3, SiO.sub.2 and at least one metal oxide selected from the group consisting of cobalt oxide, magnesium oxide, yttrium oxide, antimony oxide, manganese oxide, tellurium oxide, lanthanum oxide, cerium oxide, praseodium oxide, neodymium oxide, samarium oxide, europium oxide, gadolinium oxide, terbium oxide, dysprosium oxide, holmium oxide, erbium oxide, thulium oxide, ytterbium oxide and lutetium oxide.
摘要翻译： PCT No.PCT / JP93 / 00224 Sec。 371日期：1993年10月1日 102（e）日期1993年10月1日PCT提交1993年2月24日PCT公布。公开号WO93 / 17438 日期1993年9月2日制造这样的产品的方法，其中通过将硼硅酸铅型玻璃扩散到形成火焰或烧结氧化锌衬底的表面中，即形成“变阻器元件” 电极在基板的表面上。通常，将包含混合物或硼硅酸铅型玻璃料和Ag粉末的电极浆料或材料施加到基底上，并提供用于扩散到基底中的硼硅酸铅型玻璃。改进之处在于用于电极浆料或材料的硼硅酸铅型玻璃料包括PbO，B 2 O 3，SiO 2和至少一种选自氧化钴，氧化镁，氧化钇，氧化锑，氧化锰，氧化碲，氧化镧，氧化铈，氧化镨，氧化钕，氧化钐，氧化铕，氧化钆，氧化铽，氧化镝，氧化钬，氧化铒，氧化oxide，氧化镱和氧化镥。

17. 发明授权

US4989460A Magnetostriction type torque sensor with temperature dependent error compensation 失效
标题翻译：具有温度相关误差补偿的磁致伸缩式扭矩传感器
公开(公告)号：US4989460A
公开(公告)日：1991-02-05
申请号：US288824
申请日：1988-12-23
申请人： Masashi Mizuno , Katsuhiro Kojima , Yoji Ozawa , Takanobu Saito , Munekatsu Shimada , Masaaki Katsumata , Hiroyuki Aoki
发明人： Masashi Mizuno , Katsuhiro Kojima , Yoji Ozawa , Takanobu Saito , Munekatsu Shimada , Masaaki Katsumata , Hiroyuki Aoki
IPC分类号： G01L3/10
CPC分类号： G01L3/102 , G01L3/105
摘要： A magnetostriction type torque sensor employs a plurality of detector coils arranged in axial arrangement along an objective rotary body. The detector coils are so designed and arranged as to compensate influence of temperature, particularly the error caused due to axial temperature gradient caused in the objective rotary body.
摘要翻译：磁致伸缩式扭矩传感器使用沿物镜旋转体轴向布置的多个检测器线圈。检测器线圈被设计和布置为补偿温度的影响，特别是由于在物镜旋转体中引起的轴向温度梯度引起的误差。

18. 发明授权

US4072945A Radar-operated collision avoidance system for roadway vehicles using stored information for determination of valid objects 失效
标题翻译：使用存储信息确定有效物体的道路车辆雷达操作防撞系统
公开(公告)号：US4072945A
公开(公告)日：1978-02-07
申请号：US746742
申请日：1976-12-02
申请人： Masaaki Katsumata , Norio Fujiki
发明人： Masaaki Katsumata , Norio Fujiki
IPC分类号： B60R21/00 , G01P15/00 , G01S1/16 , G01S13/02 , G01S13/91 , G01S13/93 , G08B25/00 , G08B25/04 , G01S9/02 , B60T17/18
CPC分类号： G01S13/02 , G01S1/16 , G01S13/91 , G01S13/931 , B60T2201/022 , G01S2013/9346 , G01S2013/9353 , G01S2013/9357
摘要： A radar-operated collision avoidance system for a roadway vehicle comprises a radar device for sensing the vehicle speed relative to an object and its distance thereto to decide whether the vehicle is approaching the object at a dangerously high speed. A minimum allowable distance represented by a digital code is stored in a memory location within an array of rows and columns and read out in response to a sensed vehicle speed relative to the roadway and to a sensed magnitude of steering movement. The minimum allowable distance is compared with the distance sensed by the radar to determine that the decision is valid only when the latter is smaller than the former.
摘要翻译：用于道路车辆的雷达操作的碰撞避免系统包括用于感测相对于物体的车速及其距离的雷达装置，以确定车辆是否以危险的高速接近物体。由数字代码表示的最小可允许距离存储在行和列阵列内的存储器位置中，并响应于相对于道路的感测车速以及感测到的转向运动的大小而读出。将最小允许距离与雷达感测到的距离进行比较，以确定仅当后者小于前者时，该决定才有效。

19. 发明授权

US08561294B2 Method of manufacturing circuit board 失效
标题翻译：电路板制造方法
公开(公告)号：US08561294B2
公开(公告)日：2013-10-22
申请号：US13807223
申请日：2012-04-19
申请人： Tsuyoshi Himori , Masaaki Katsumata , Toshikazu Kondou
发明人： Tsuyoshi Himori , Masaaki Katsumata , Toshikazu Kondou
IPC分类号： H01K3/10
CPC分类号： H01B1/02 , H01B1/12 , H05K1/092 , H05K3/4069 , H05K3/4084 , H05K3/4652 , H05K2203/178 , Y02P70/611 , Y02P70/613 , Y10T29/49126 , Y10T29/49155 , Y10T29/49165 , Y10T29/49167
摘要： A method of manufacturing a circuit board includes the steps of preparing a fiber piece housing paste, fabricating a filtered recovery paste, fabricating a reuse paste, sticking a protective film, forming a hole, and filling the hole with the reuse paste. Furthermore, the method includes the steps of forming a protruded portion constituted of the reuse paste, disposing a metallic foil on both sides of a second prepreg to carry out pressurization, heating the second prepreg to cure the second prepreg and the reuse paste, and processing the metallic foil into a wiring pattern.
摘要翻译：制造电路板的方法包括以下步骤：制备纤维片外壳糊，制备过滤的回收膏，制备再利用膏，粘贴保护膜，形成孔，并用再利用膏填充孔。此外，该方法包括以下步骤：形成由再利用糊料构成的突出部分，在第二预浸料坯的两侧设置金属箔以进行加压，加热第二预浸料以固化第二预浸料和再利用浆料，以及加工金属箔成为布线图案。

20. 发明申请

US20130153138A1 METHOD OF MANUFACTURING REUSE PASTE, REUSE PASTE AND METHOD OF MANUFACTURING CIRCUIT BOARD USING REUSE PASTE 审中-公开
标题翻译：制造再利用膏药，再利用膏药的方法及使用再利用膏药制造电路板的方法
公开(公告)号：US20130153138A1
公开(公告)日：2013-06-20
申请号：US13817733
申请日：2012-07-24
申请人： Tsuyoshi Himori , Masaaki Katsumata , Toshikazu Kondou
发明人： Tsuyoshi Himori , Masaaki Katsumata , Toshikazu Kondou
IPC分类号： H01B1/20 , H05K3/00
CPC分类号： H05K3/0094 , H01B1/20 , H01B1/22 , H05K1/092 , H05K3/4069 , H05K3/4652 , H05K2203/178 , Y02P70/611 , Y02P70/613
摘要： A method of manufacturing a reuse paste includes preparing a fiber piece housing paste, producing a filtered recovery paste, and producing a reuse paste. In the preparing of the fiber piece housing paste, a conductive paste including a conductive particle, resin and a latent curing agent, and a fiber piece housing paste including a fiber piece dropping off from a prepreg used for manufacturing a circuit board are prepared. In the producing of the filtered recovery paste, the filtered recovery paste is produced by filtering the fiber piece housing paste, which remains in a paste state, by using a filter. In the production of the reuse paste, the reuse paste is produced by adding at least one of a solvent, resin, and a paste having a different composition from that of the filtered recovery paste into the filtered recovery paste.
摘要翻译：制备再利用糊剂的方法包括制备纤维片外壳糊，产生经过过滤的回收膏，并制备再利用浆料。在制备纤维片外壳膏时，制备包含导电颗粒，树脂和潜在性固化剂的导电糊，以及包含从用于制造电路板的预浸料脱落的纤维片的纤维片外壳膏。在过滤的回收浆料的生产中，通过使用过滤器过滤保持糊状状态的纤维片外壳糊来制造过滤的回收膏。在再生浆料的生产中，通过将具有不同组成的溶剂，树脂和糊料中的至少一种与经过滤的回收浆料的组合物中的至少一种加入到过滤的回收浆料中来制备再利用糊料。

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