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11. 发明专利

JP2013120839A Dicing sheet with protective film forming layer and method for fabricating semiconductor chip 有权
标题翻译：具有保护膜形成层的表和用于制造半导体芯片的方法
公开(公告)号：JP2013120839A
公开(公告)日：2013-06-17
申请号：JP2011267990
申请日：2011-12-07
申请人： Lintec Corp , リンテック株式会社
发明人： SHINODA TOMONORI , KOYAKATA MASAHIRO , TAKANO TAKESHI
IPC分类号： H01L21/301 , C09J7/02
摘要： PROBLEM TO BE SOLVED: To provide a dicing sheet with a protective film forming layer which has high uniformity in thickness, can easily produce a semiconductor chip having a protective film with good print accuracy, and has a heat resistance property.SOLUTION: A dicing sheet comprises a protective film forming layer 4 on an adhesive layer of an adhesive sheet 3 consisting of a base film 1 and the adhesive layer 2, the protective film forming layer is formed on an inner perimeter of the adhesive sheet, and the adhesive layer is exposed to an outer perimeter of the adhesive sheet. The melting point of the base film exceeds 130°C or the base film does not have the melting point, and the thermal shrinkage of the base film heated at 130°C and for 2 hours, is -1 to +1%.
摘要翻译：要解决的问题：为了提供具有高均匀度的保护膜形成层的切割片，可以容易地制造具有良好打印精度的保护膜的半导体芯片，并且具有耐热性。解决方案：切割片在由基膜1和粘合剂层2组成的粘合片3的粘合剂层上包括保护膜形成层4，保护膜形成层形成在粘合剂的内周上并且粘合剂层暴露于粘合片的外周。基膜的熔点超过130℃，或者基膜不具有熔点，在130℃加热2小时的基膜的热收缩率为-1〜+ 1％。版权所有（C）2013，JPO＆INPIT

12. 发明专利

JP2010189485A Adhesive composition, adhesive sheet, and method for producing semiconductor device 审中-公开
标题翻译：粘合剂组合物，粘合片和用于制造半导体器件的方法
公开(公告)号：JP2010189485A
公开(公告)日：2010-09-02
申请号：JP2009033055
申请日：2009-02-16
申请人： Lintec Corp , リンテック株式会社
发明人： KARASAWA YASUNORI , SHINODA TOMONORI
IPC分类号： C09J201/00 , C09J5/00 , C09J7/02 , C09J11/00 , H01L21/301 , H01L21/52 , H01L21/60
摘要： PROBLEM TO BE SOLVED: To provide an adhesive composition hardly causing separation of adhesive interface and package crack even when being exposed to a severe reflow conditions, and achieving high package reliability in the package having a semiconductor chip mounted thereon.
SOLUTION: The adhesive composition includes an energy ray-curable adhesive component, a photopolymerization initiator, and a thermally curable adhesive component, and characterized in a weight loss of the photopolymerization initiator at 160°C of ≤7.0%.
COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：即使在暴露于严格的回流条件下，也提供几乎不引起粘合界面和包装裂纹分离的粘合剂组合物，并且在其上安装有半导体芯片的封装中实现高封装可靠性。粘合剂组合物包括能量射线固化性粘合剂组分，光聚合引发剂和热固化性粘合剂组分，特征在于光聚合引发剂在160℃下的重量损失≤7.0％。版权所有（C）2010，JPO＆INPIT

13. 发明专利

JP2009260047A Sheet for die sort 有权
标题翻译：表格排版
公开(公告)号：JP2009260047A
公开(公告)日：2009-11-05
申请号：JP2008107480
申请日：2008-04-17
申请人： Lintec Corp , リンテック株式会社
发明人： KOYAKATA MASAHIRO , SHINODA TOMONORI
IPC分类号： H01L21/683 , C09J7/02
摘要： PROBLEM TO BE SOLVED: To provide a sheet for die sort capable of stably holding a chip with tack, and easily picking up the chip with the tack. SOLUTION: A sheet 1 for die sort comprises a disc-like base material film 2, and an annular adhesive sheet 3 stacked on the periphery of the base material film 2. The central portion of the surface of the base material film 2 is a chip temporary fitting part 20, and the surface roughness Ra of the chip temporary fitting part 20 is 0.01-0.4 μm. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供一种能够稳定地保持具有粘性的芯片的模具分类的片材，并且容易地用该粘性物质拾取芯片。解决方案：用于模具分类的片材1包括盘状基材膜2和层叠在基材膜2的周边上的环状粘合片3.基材膜2的表面的中心部分是芯片临时嵌合部20，芯片临时嵌合部20的表面粗糙度Ra为0.01-0.4μm。版权所有（C）2010，JPO＆INPIT

14. 发明专利

JP2009203337A Pressure-sensitive adhesive composition, pressure-sensitive adhesive sheet, and method for manufacturing semiconductor device 审中-公开
标题翻译：压敏粘合剂组合物，压敏粘合片和制造半导体器件的方法
公开(公告)号：JP2009203337A
公开(公告)日：2009-09-10
申请号：JP2008046591
申请日：2008-02-27
申请人： Lintec Corp , リンテック株式会社
发明人： SHIZUHATA HIRONORI , SHINODA TOMONORI , KOYAKATA MASAHIRO
IPC分类号： C09J133/00 , C09J7/02 , C09J11/04 , C09J11/06 , C09J11/08 , C09J163/00 , H01L21/301 , H01L21/52
摘要： PROBLEM TO BE SOLVED: To achieve high package reliability even if a package, to which a semiconductor chip is mounted, is exposed to high temperature and high humidity or exposed to high temperature and high humidity under voltage application. SOLUTION: The pressure-sensitive adhesive composition comprises an acrylic polymer (A), an epoxy resin (B) having an epoxy equivalent of 180 g/eq or less, a curing agent (C), and an ion scavenger (D). The content of the ion scavenger (D) is 1-20 pts.wt. for 100 pts.wt. of all the resin components. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：即使安装了半导体芯片的封装暴露于高温高湿或暴露于高温高湿的电压施加下，也可实现高封装可靠性。解决方案：压敏粘合剂组合物包含丙烯酸类聚合物（A），环氧当量为180g / eq以下的环氧树脂（B），固化剂（C）和离子清除剂（D ）。离子清除剂（D）的含量为1-20重量份 100磅重的所有树脂组分。版权所有（C）2009，JPO＆INPIT

15. 发明专利

JP2007142248A Manufacturing method of resin-sealing semiconductor device 有权
标题翻译：树脂密封半导体器件的制造方法
公开(公告)号：JP2007142248A
公开(公告)日：2007-06-07
申请号：JP2005335634
申请日：2005-11-21
申请人： Lintec Corp , リンテック株式会社
发明人： HAMAZAKI AKIE , IZUMI TADASHI , SHINODA TOMONORI
IPC分类号： H01L21/56
CPC分类号： H01L24/97 , H01L24/73 , H01L2224/32245 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/49171 , H01L2224/73265 , H01L2224/97 , H01L2924/181 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： PROBLEM TO BE SOLVED: To provide a method that has high universality in a resin sheet for sealing a semiconductor element, does not spend much labor for aligning a base material tape to a circuit board, and can make the shape of the end face of a semiconductor device constant. SOLUTION: The method includes a process, where a circuit board 10 made of a metal frame where a plurality of semiconductor chips 14 are mounted is prepared, masking members 20, 20' are applied so that the semiconductor chips are in island shapes each, a resin sheet 30 for sealing comprising a support sheet 32 and a thermosetting sealing resin layer 34 is prepared, the resin sheet for sealing is applied onto the circuit board where a masking member is applied, the masking member is peeled with a partial sealing resin layer overlapping onto the masking member, and hence the semiconductor chips in the circuit board are sealed by resin in island shapes; a process for cutting the circuit board for each island-shaped semiconductor chip; and a process for thermosetting the sealing resin layer before peeling the masking member and/or after peeling the masking member. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：为了提供在用于密封半导体元件的树脂片中具有高普遍性的方法，不会花费太多的劳动力将基材带对准电路板，并且可以使端部的形状半导体器件的面常数。解决方案：该方法包括一个工艺，其中准备了由金属框架制成的电路板10，其中安装有多个半导体芯片14，掩模构件20,20'被施加，使得半导体芯片处于岛形状分别制备包括支撑片32和热固性密封树脂层34的用于密封的树脂片30，将用于密封的树脂片施加到施加掩蔽部件的电路板上，将掩蔽部件以部分密封树脂层与掩模构件重叠，因此电路板中的半导体芯片被树脂密封成岛状; 用于切割每个岛状半导体芯片的电路板的工艺; 以及在剥离掩模构件之前和/或在剥离掩蔽构件之后使密封树脂层热固的方法。版权所有（C）2007，JPO＆INPIT

16. 发明专利

JP2007053240A Sheet shared by dicing and die bonding, and manufacturing method of semiconductor device using the same 有权
标题翻译：通过定位和DIE结合共享的薄片以及使用其的半导体器件的制造方法
公开(公告)号：JP2007053240A
公开(公告)日：2007-03-01
申请号：JP2005237411
申请日：2005-08-18
申请人： Lintec Corp , リンテック株式会社
发明人： YAMAZAKI OSAMU , SHINODA TOMONORI , KOYAKATA MASAHIRO
IPC分类号： H01L21/301 , C09J7/02 , C09J201/00 , H01L21/52 , H01L25/065 , H01L25/07 , H01L25/18
CPC分类号： H01L24/27 , H01L24/73 , H01L2224/32145 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/10253 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： PROBLEM TO BE SOLVED: To provide a sheet shared by dicing and die bonding which is easily pasted to a semiconductor wafer and reducing damage of a bonding wire, as well as reducing variation in height of a semiconductor device which is caused by poor precision in thickness of an adhesive layer for bonding semiconductor chips together, variation in height from a substrate to the surface of a semiconductor chip in the top layer, inclination of the semiconductor chip in the top layer, and the like. SOLUTION: A sheet 10 shared by dicing and die bonding consists of: a base material 11; a wire embedded layer 12 which is stacked on the base material for peeling; and an insulating layer 13 stacked on the wire embedded layer. The wire embedded layer 12 has a storage modulus of 1×10 4 Pa or less at 120°C. The insulating layer 13 has such adhesion as can be pasted to an object 2 at 60°C or less. The elasticity ratio (insulating layer/wire embedded layer) between the insulating layer 13 and the wire embedded layer 12 at 120°C is 10 or higher. A voluminal resistivity of the wire embedded layer 12 and the insulating layer 13 is 1×10 13 Ωcm or higher, respectively. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：为了提供易于粘贴到半导体晶片的切割和芯片接合共享的薄片，并减少接合线的损伤，以及减少由于差的导致的半导体器件的高度变化用于将半导体芯片接合在一起的粘合剂层的厚度精度，顶层中的衬底到半导体芯片的表面的高度变化，顶层中的半导体芯片的倾斜度等。解决方案：通过切割和芯片粘合共享的薄片10由以下部件组成：基材11; 层叠在基材上以进行剥离的导线埋入层12; 以及堆叠在导线嵌入层上的绝缘层13。电线埋入层12在120℃下的储能模量为1×10 4 SP / Pa以下。绝缘层13具有可以在60℃以下粘贴到物体2上的粘合性。在120℃下绝缘层13和导线埋入层12之间的弹性率（绝缘层/导线嵌入层）为10以上。导线埋入层12和绝缘层13的体积电阻率分别为1×10 13Ω/ cm以上。版权所有（C）2007，JPO＆INPIT

17. 发明专利

JP2005109300A Method for manufacturing resin sealed electronic device 有权
标题翻译：制造密封电子设备的方法
公开(公告)号：JP2005109300A
公开(公告)日：2005-04-21
申请号：JP2003342932
申请日：2003-10-01
申请人： Lintec Corp , リンテック株式会社
发明人： SUGINO TAKASHI , SHINODA TOMONORI
IPC分类号： H01L21/56 , H01L23/24
CPC分类号： H01L23/24 , H01L24/48 , H01L24/97 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/97 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01075 , H01L2924/01082 , H01L2924/14 , H01L2924/15787 , H01L2924/181 , H01L2224/85 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： PROBLEM TO BE SOLVED: To provide a method which does not require complicated processes or time for forming a dam frame, in a method of producing a resin sealed electronic device with which the dam frame is formed on a substrate with electronic elements packaged thereon to surround the electronic elements and a sealing resin is made flow into the dam frame so as to be heated and cured. SOLUTION: When forming the dam frame by sticking an adhesive sheet on a substrate with electronic elements packaged thereon to surround the electronic elements and when forming the dam frame at edges of the substrate with a plurality of electronic elements packaged thereon to surround all the plurality of electronic elements, the dam is formed by sticking the adhesive sheet thereto. COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：为了提供一种不需要复杂的流程或时间来形成坝框架的方法，在制造树脂密封电子设备的方法中，其中在具有电子元件封装的基板上形成有坝框架在其上围绕电子元件，并且使密封树脂流入坝框架以便被加热和固化。解决方案：当通过在其上封装有电子元件的基板上粘贴粘合片来围绕电子元件并且当在其上封装有多个电子元件以围绕所有电子元件的边缘处形成阻挡框架多个电子元件通过将粘合片粘贴在其上而形成。版权所有（C）2005，JPO＆NCIPI

18. 发明专利

JP2004230776A Sticking sheet for cleaning 审中-公开
标题翻译：清洁用纸
公开(公告)号：JP2004230776A
公开(公告)日：2004-08-19
申请号：JP2003023533
申请日：2003-01-31
申请人： Lintec Corp , リンテック株式会社
发明人： SUMI TAKAJI , SHINODA TOMONORI , MUROI KOJI , UTAGAWA TETSUYUKI
IPC分类号： B41F35/00 , B41N3/06 , C09J7/02 , C09J175/04 , C09J201/00
摘要： PROBLEM TO BE SOLVED: To provide a sticking sheet for cleaning which enables an effective removal of dregs of ink paste sticking to the rear side of a screen printing plate, without a slackening of the plate, in screen printing in a manufacturing process of a precision electronic component/optical component.
SOLUTION: This sticking sheet for cleaning is designed for removing the dregs of the ink paste sticking to a surface of the screen printing plate on the side brought into contact with the precision electronic component/optical component in the screen printing in the manufacturing process of the component. The sheet has on one side of a sheetlike base a sticking agent layer of which the storage elastic modulus at 20°C and 1 Hz is 1.00×10
4 to 3.00×10
7 Pa and the ball tack value is 4 or below.
COPYRIGHT: (C)2004,JPO&NCIPI
摘要翻译：要解决的问题：提供一种用于清洁的粘贴片，其能够在制造过程中丝网印刷中有效地除去粘附在丝网印刷版的后侧的油墨糊料，而不会使板松弛的精密电子部件/光学部件。解决方案：这种用于清洁的粘贴片设计用于去除在制造中的丝网印刷中粘附在丝网印刷版的与精密电子部件/光学部件接触的一侧的表面上的墨水糊的渣组件的过程。该片材在片状基底的一侧具有粘着剂层，其20℃和1Hz下的储能弹性模量为1.00×10 4 至3.00×10 7 Pa，球粘度值为4以下。版权所有（C）2004，JPO＆NCIPI

19. 发明专利

JP2013048284A Manufacturing method of resin sealing type semiconductor device 有权
标题翻译：树脂密封型半导体器件的制造方法
公开(公告)号：JP2013048284A
公开(公告)日：2013-03-07
申请号：JP2012241705
申请日：2012-11-01
申请人： Lintec Corp , リンテック株式会社
发明人： HAMAZAKI AKIE , IZUMI TADASHI , SHINODA TOMONORI
IPC分类号： H01L21/56
摘要： PROBLEM TO BE SOLVED: To provide a method which achieves high versatility of a resin sheet, enables a uniform shape of obtained package end surfaces, and downsizes a semiconductor device in a sealing method of the semiconductor device which uses the resin sheet for reducing the costs and improving the quality.SOLUTION: A manufacturing method of a semiconductor device includes the steps of: preparing a circuit board 10 on which multiple semiconductor chips 11 are mounted; burying a sealing resin layer 3 of a resin sheet for semiconductor sealing into irregularities and gaps of a semiconductor chip mounting surface of the circuit board 10 with the resin sheet for the semiconductor sealing 1 stretched on a frame body 4 having an opening slightly larger than a planar shape of the circuit board, and thereby causing a sealing resin layer surface to contact with a circuit board surface; and cutting the circuit board with the sealing resin layer for each semiconductor chip. The manufacturing method includes a step where the sealing resin layer is subject to thermal hardening after the step where the sealing resin layer surface is placed in contact with the circuit board surface.
摘要翻译：要解决的问题：为了提供一种实现树脂片的高通用性的方法，能够获得所获得的封装端面的均匀形状，并且使用该树脂片的半导体器件的密封方法来缩小半导体器件的尺寸降低成本，提高质量。解决方案：半导体器件的制造方法包括以下步骤：制备其上安装有多个半导体芯片11的电路板10; 将用于半导体密封的树脂片的密封树脂层3埋在电路板10的半导体芯片安装表面的不规则部分和间隙中，并将半导体密封用树脂片1拉伸在具有稍大于电路板的平面形状，从而使密封树脂层表面与电路板表面接触; 并用每个半导体芯片的密封树脂层切割电路板。制造方法包括在密封树脂层表面与电路板表面接触的步骤之后，密封树脂层经受热硬化的步骤。版权所有（C）2013，JPO＆INPIT

20. 发明专利

JP2012216625A Protective film forming sheet and method for fabricating semiconductor chip 有权
标题翻译：保护膜成型片和制造半导体芯片的方法
公开(公告)号：JP2012216625A
公开(公告)日：2012-11-08
申请号：JP2011079945
申请日：2011-03-31
申请人： Lintec Corp , リンテック株式会社
发明人： SHINODA TOMONORI , TAKANO TAKESHI
IPC分类号： H01L21/304 , C09J7/02 , C09J201/00
摘要： PROBLEM TO BE SOLVED: To provide a protective film forming sheet which has a circuit formed on the surface and can form a protective film in a rear surface inner peripheral part (a region surrounded by an annular-shaped convex part) of a semiconductor wafer having the annular convex part in a rear surface outer peripheral part.SOLUTION: A protective film forming sheet has a protective film formation layer which is formed so as to be releasable on a convex part of a laminate film having a circular convex part.

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