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11. 发明申请

US20060169999A1 LED package frame and LED package having the same 有权
标题翻译： LED封装框架和LED封装相同
公开(公告)号：US20060169999A1
公开(公告)日：2006-08-03
申请号：US11319101
申请日：2005-12-28
申请人： Young Park , Seung Lee , Hun Hahm , Hyung Kim , Bum Kim , Young Jeong , Ho Ahn , Jung Park
发明人： Young Park , Seung Lee , Hun Hahm , Hyung Kim , Bum Kim , Young Jeong , Ho Ahn , Jung Park
IPC分类号： H01L33/00
CPC分类号： H01L33/62 , H01L33/60 , H01L33/642 , H01L33/647 , H01L2224/48091 , H01L2224/48247 , H01L2924/01079 , H01L2924/12041 , H01L2924/00014
摘要： The invention relates to an LED package frame and an LED package incorporating the same. The LED package frame comprises an LED chip; and a heat conductive member made of a lump of high heat conductivity material. The heat conductive member has a receiving part at a lateral portion, and is mounted with the LED chip. A lead is inserted at one end into the receiving part of the heat conductive member, and electrically connected to the LED chip. An electrically insulating layer is placed in tight contact between the lead and the receiving part of the heat conductive member to separate the lead from the receiving part. With the lead inserted into the heat conductive member, it is possible to reduce size while maintaining high heat conductivity and stability. Also, it is possible to provide an LED package frame and a high power LED package by fixing the lead fixed to the heat conductive member without a jig.
摘要翻译：本发明涉及一种LED封装框架和一个包含该LED封装框架的LED封装件。 LED封装框架包括LED芯片; 以及由高导热性材料块制成的导热构件。导热构件在侧部具有接收部，并且安装有LED芯片。引线一端插入导热部件的接收部分，并与LED芯片电连接。电绝缘层被放置在引导件和导热构件的接收部分之间的紧密接触中以将引线与接收部分分离。通过将导线插入导热构件，可以在保持高导热性和稳定性的同时减小尺寸。此外，通过将固定在导热构件上的引线固定而不用夹具，可以提供LED封装框架和大功率LED封装。

12. 发明申请

US20060034082A1 Multi-lens light emitting diode 有权
标题翻译：多镜头发光二极管
公开(公告)号：US20060034082A1
公开(公告)日：2006-02-16
申请号：US10957650
申请日：2004-10-05
申请人： Jung Park , Young Park , Hun Hahm , Young Jeong , Hyung Kim
发明人： Jung Park , Young Park , Hun Hahm , Young Jeong , Hyung Kim
IPC分类号： F21V13/04
CPC分类号： H01L33/58 , G02F1/133603 , H01L33/54 , Y10S362/80
摘要： The present invention relates to a multi-lens LED. The LED has multiple lenses and an intermediate layer interposed between the multiple lenses in order to radiate light emitted from an LED chip in a desired direction and/or beam angle without using a complicated lens configuration. The first lens is centered behind the LED chip when seen in the propagation direction of light, the second lens has a concave structure and surrounds the first lens, and the intermediate layer is interposed between the first and second lenses, so that light emitted from the LED chip can be radiated in a wide beam angle. When provided in the form of a hemisphere, the multi-lens LED can be attached to a wall or a ceiling in use for interior lighting. On the other hand, when provided in the form of a cylinder, the multi-lens LED of the invention can be applied in arrays to be used as a light source of an LCD backlight apparatus.
摘要翻译：本发明涉及一种多透镜LED。 LED具有多个透镜和介于多个透镜之间的中间层，以便在不需要复杂透镜配置的情况下以期望的方向和/或光束角辐射从LED芯片发射的光。当在光的传播方向上观察时，第一透镜位于LED芯片的后面，第二透镜具有凹形结构并且围绕第一透镜，并且中间层插入在第一透镜和第二透镜之间，使得从 LED芯片可以以较宽的光束角度辐射。当以半球的形式提供时，多透镜LED可以附着在用于室内照明的墙壁或天花板上。另一方面，当以圆筒形式提供时，本发明的多透镜LED可以应用于阵列以用作LCD背光装置的光源。

13. 发明申请

US20060006406A1 Light emitting diode package and light source comprising the same 失效
标题翻译：发光二极管封装和包含该发光二极管封装的光源
公开(公告)号：US20060006406A1
公开(公告)日：2006-01-12
申请号：US10967212
申请日：2004-10-19
申请人： Hyung Kim , Young Park , Hun Hahm , Jung Park , Young Jeong
发明人： Hyung Kim , Young Park , Hun Hahm , Jung Park , Young Jeong
IPC分类号： H01L29/24
CPC分类号： H01L25/0753 , H01L2924/0002 , H01L2924/00
摘要： An LED package comprises a substrate, one or three terminals formed on a first side of the substrate, three terminals formed on a second side opposite to the first side, and two or three LEDs disposed on the substrate, one of the LEDS being electrically connected to one of the terminals formed on the first side while being electrically connected to one of the terminals formed on the second side, and other LEDS being electrically connected to two terminals formed on the first side or to two terminals formed on the second side. A light source comprises the LED packages having the structure as described above. Without being arranged in a line, the LEDs emitting the same color are differently arranged in every LED package, thereby solving the problem of non-uniform combination of the colors according to the positions of the LEDs on an LED package-mounting substrate.
摘要翻译： LED封装包括基板，形成在基板的第一侧上的一个或三个端子，形成在与第一侧相对的第二侧上的三个端子和设置在基板上的两个或三个LED，其中一个LED电连接连接到形成在第一侧上的端子中的一个端子，同时电连接到形成在第二侧上的端子之一，并且其它LEDS电连接到形成在第一侧上的两个端子或形成在第二侧上的两个端子。光源包括具有如上所述结构的LED封装。不排列成一行，发光相同颜色的LED在每个LED封装中被不同地排列，从而解决了根据LED封装安装基板上LED的位置的颜色不均匀组合的问题。

14. 发明申请

US20060001034A1 RGB light emitting diode package with improved color mixing properties 有权
标题翻译： RGB发光二极管封装，具有改进的混色性能
公开(公告)号：US20060001034A1
公开(公告)日：2006-01-05
申请号：US10959154
申请日：2004-10-07
申请人： Young Park , Hun Hahm , Hyung Kim , Jung Park , Young Jeong
发明人： Young Park , Hun Hahm , Hyung Kim , Jung Park , Young Jeong
IPC分类号： H01L33/00
CPC分类号： H01L25/0753 , H01L33/56 , H01L2924/0002 , H01L2933/0091 , H01L2924/00
摘要： Disclosed is an RGB light emitting diode package with improved color mixing properties. The RGB light emitting diode package includes red, green, and blue light emitting diode chips provided on a reflector, on which elements are to be installed or mounted. A photomixing material and a filler resin scatters rays so as to uniformly mix the rays emitted from the light emitting diode chips. The photomixing material and filler resin are applied onto upper sides of the light emitting diode chips while being mixed with each other, and the photomixing material is uniformly dispersed in the filler resin. The RGB light emitting diode package according to the present invention is advantageous in that since it has excellent color mixing properties in a relatively small area, it is possible to achieve slimness of the package, while it is difficult to design a slim package using a conventional process in which there is a limit that an area large enough to mix colors must be provided.
摘要翻译：公开了具有改进的混色特性的RGB发光二极管封装。 RGB发光二极管封装包括设置在要安装或安装元件的反射器上的红色，绿色和蓝色发光二极管芯片。光混合材料和填充树脂散射射线，以均匀混合从发光二极管芯片发出的光线。将光混合材料和填料树脂彼此混合地施加到发光二极管芯片的上侧，并且光混合材料均匀地分散在填充树脂中。根据本发明的RGB发光二极管封装的优点在于，由于它在相对较小的区域中具有优异的混色特性，所以可以实现封装的薄型化，同时难以使用常规的方法来设计纤薄封装必须提供足够大的混合颜色的区域的限制。

15. 发明申请

US20050276066A1 Backlight unit of liquid crystal display 失效
标题翻译：背光单元液晶显示
公开(公告)号：US20050276066A1
公开(公告)日：2005-12-15
申请号：US10916480
申请日：2004-08-12
申请人： Hyung Kim , Young Park , Hun Hahm , Jung Park , Young Jeong
发明人： Hyung Kim , Young Park , Hun Hahm , Jung Park , Young Jeong
IPC分类号： G02F1/1335 , G02F1/13357
CPC分类号： G02F1/133603 , G02F1/133605 , Y10S362/80
摘要： Disclosed herein is a backlight unit of a liquid crystal display. The backlight unit comprises a plurality of light emitting diode packages arranged in a matrix while being spaced a uniform distance apart from each other, each light emitting diode package including one or more light emitting diode chips and structured such that light generated from the light emitting chips is emitted in the horizontal direction, and a reflector consisting of a plurality of reflection cells connected to each other in a matrix. Each of the reflection cells of a unit size has each of the light generating packages positioned at the center thereof, and reflects the light, emitted from the light emitting diode at the center thereof in the horizontal direction, to the perpendicular direction.
摘要翻译：这里公开了液晶显示器的背光单元。背光单元包括以矩阵形式布置的多个发光二极管封装，同时隔开彼此间隔均匀的距离，每个发光二极管封装包括一个或多个发光二极管芯片，并被构造为使得从发光芯片产生的光在水平方向上发射，并且由多个反射单元组成的反射器以矩阵形式彼此连接。单位尺寸的每个反射单元具有位于其中心的每个发光组件，并且将从发光二极管的沿水平方向的中心发射的光反射到垂直方向。

16. 发明申请

US20060038190A1 Fabrication method of light emitting diode incorporating substrate surface treatment by laser and light emitting diode fabricated thereby 有权
标题翻译：掺合了由其制造的激光和发光二极管的基板表面处理的发光二极管的制造方法
公开(公告)号：US20060038190A1
公开(公告)日：2006-02-23
申请号：US10953815
申请日：2004-09-30
申请人： Young Park , Hun Hahm , Kun Ko , Hyo Cho
发明人： Young Park , Hun Hahm , Kun Ko , Hyo Cho
IPC分类号： H01L33/00
CPC分类号： H01L33/22 , H01L21/02378 , H01L21/02403 , H01L21/0242 , H01L21/0243 , H01L21/02458 , H01L21/0254 , H01L33/007 , Y10S438/964
摘要： The present invention relates to a fabrication method of LEDs incorporating a step of surface-treating a substrate by a laser and an LED fabricated by such a fabrication method. The present invention can use a laser in order to implement finer surface treatment to an LED substrate over the prior art. As a result, the invention can improve the light extraction efficiency of an LED while protecting the substrate from chronic problems of the prior art such as stress or defects induced from chemical etching and/or physical polishing.
摘要翻译：本发明涉及一种LED的制造方法，其包括通过激光对基板进行表面处理的步骤以及通过这种制造方法制造的LED。与现有技术相比，本发明可以使用激光器来实现对LED基板的更精细的表面处理。结果，本发明可以提高LED的光提取效率，同时保护衬底免受现有技术的慢性问题，例如由化学蚀刻和/或物理抛光引起的应力或缺陷。

17. 发明申请

US20050265042A1 Vertical light emitting type backlight module 失效
标题翻译：垂直发光型背光模组
公开(公告)号：US20050265042A1
公开(公告)日：2005-12-01
申请号：US10917383
申请日：2004-08-13
申请人： Hyung Kim , Young Park , Hun Hahm , Jung Park , Young Jeong
发明人： Hyung Kim , Young Park , Hun Hahm , Jung Park , Young Jeong
IPC分类号： F21K99/00 , F21V7/04 , G02F1/13357
CPC分类号： G02F1/133603 , F21K9/00 , F21Y2105/10 , F21Y2115/10
摘要： Disclosed herein is a vertical light emitting type backlight module, for irradiating white light to the rear side of a liquid crystal display in the perpendicular direction. The vertical light emitting type backlight module comprises a) one or more LED array modules, each comprising a substrate having conductive patterns printed on upper and lower surfaces of the substrate, respectively, a plurality of LED devices mounted on the upper and lower surfaces of the substrate, respectively, for emitting light toward the front of respective surfaces of the substrate with the LED devices mounted thereon, and a plurality of lenses formed to surround the LED devices, respectively, for directing the light emitted from the LED devices in a direction perpendicular to the LED while being within a predetermined angle from an axis parallel to a plane of the backlight module, the substrate being mounted perpendicular to the plane of the backlight module such that the light emitted from the LED devices is emitted in a direction approximately parallel to the plane of the backlight module, and b) a reflection plate for each of the LED array modules for reflecting the light spread in the horizontal direction to change path of the light to the perpendicular direction.
摘要翻译：本文公开了一种用于在垂直方向上将白光照射到液晶显示器的后侧的垂直发光型背光模块。垂直发光型背光模块包括：a）一个或多个LED阵列模块，每个LED阵列模块分别包括印刷在基板的上表面和下表面上的导电图案的基板，安装在基板的上表面和下表面上的多个LED装置基板，分别用于在安装有LED器件的基板的各个表面的前面发射光，以及分别形成为围绕LED器件的多个透镜，用于将LED器件发出的光沿垂直方向引导在与来自平行于背光模块的平面的轴线处于预定角度内的LED上，所述基板垂直于所述背光模块的平面安装，使得从所述LED装置发射的光在大致平行于背光模块的平面，以及b）用于反射光sp的每个LED阵列模块的反射板在水平方向读取，以将光线的路径改变为垂直方向。

18. 发明申请

US20050221526A1 Process for producing nitride semiconductor light-emitting device 失效
标题翻译：氮化物半导体发光元件的制造方法
公开(公告)号：US20050221526A1
公开(公告)日：2005-10-06
申请号：US10893924
申请日：2004-07-20
申请人： Dong Cho , Masayoshi Koike , Hun Hahm
发明人： Dong Cho , Masayoshi Koike , Hun Hahm
IPC分类号： H01L21/00 , H01L21/20 , H01L21/205 , H01L21/28 , H01L21/3205 , H01L29/22 , H01L29/24 , H01L33/00
CPC分类号： H01L33/007 , H01L21/0237 , H01L21/0242 , H01L21/02458 , H01L21/0254 , H01L21/02579 , H01L21/0262
摘要： A process for producing a nitride semiconductor light-emitting device includes the steps of preparing a substrate, growing a p-type nitride semiconductor layer on the substrate by the MOCVD process using hydrazine-based gas as a nitrogen precursor and N2 gas as a carrier gas, forming an active layer on the p-type nitride semiconductor layer, forming an n-type conductive nitride semiconductor layer on the active layer, and forming p- and n-electrodes in electrical connection with the p- and n-type nitride semiconductors, respectively.
摘要翻译：制造氮化物半导体发光器件的方法包括以下步骤：制备衬底，通过使用肼系气体作为氮前驱体的MOCVD法在衬底上生长p型氮化物半导体层，气体作为载气，在p型氮化物半导体层上形成有源层，在有源层上形成n型导电氮化物半导体层，形成与p电极电连接的p型和n型电极和n型氮化物半导体。

19. 发明申请

US20050214965A1 Vertical GaN light emitting diode and method for manufacturing the same 有权
公开(公告)号：US20050214965A1
公开(公告)日：2005-09-29
申请号：US11115237
申请日：2005-04-27
申请人： Young Park , Hun Hahm , Jeong Na , Seung Yoo
发明人： Young Park , Hun Hahm , Jeong Na , Seung Yoo
IPC分类号： H01L21/00 , H01L29/06 , H01L33/10 , H01L33/32 , H01L33/34
CPC分类号： H01L33/0079 , H01L33/0095 , H01L33/32 , H01L2221/68363
摘要： Disclosed are a vertical GaN light emitting diode and a method for manufacturing the same. The vertical GaN light emitting diode comprises a first conductive GaN clad layer with an upper surface provided with a first contact formed thereon, an active layer formed on a lower surface of the first conductive GaN clad layer, a second conductive GaN clad layer formed on a lower surface of the active layer, a conductive adhesive layer formed on the second conductive GaN clad layer, and a conductive substrate, with a lower surface provided with a second contact formed thereon, formed on a lower surface of the conductive adhesive layer. The method for manufacturing the vertical GaN light emitting diodes comprises the step of removing the sapphire substrate from the light emitting structure so as to prevent the damages on a GaN single crystal plane of the structure.

20. 发明申请

US20050173692A1 Vertical GaN light emitting diode and method for manufacturing the same 有权
标题翻译：垂直GaN发光二极管及其制造方法
公开(公告)号：US20050173692A1
公开(公告)日：2005-08-11
申请号：US10601597
申请日：2003-06-24
申请人： Young Park , Hun Hahm , Jeong Na , Seung Yoo
发明人： Young Park , Hun Hahm , Jeong Na , Seung Yoo
IPC分类号： H01L21/00 , H01L29/06 , H01L33/10 , H01L33/32 , H01L33/34
CPC分类号： H01L33/0079 , H01L33/0095 , H01L33/32 , H01L2221/68363
摘要： Disclosed are a vertical GaN light emitting diode and a method for manufacturing the same. The vertical GaN light emitting diode comprises a first conductive GaN clad layer with an upper surface provided with a first contact formed thereon, an active layer formed on a lower surface of the first conductive GaN clad layer, a second conductive GaN clad layer formed on a lower surface of the active layer, a conductive adhesive layer formed on the second conductive GaN clad layer, and a conductive substrate, with a lower surface provided with a second contact formed thereon, formed on a lower surface of the conductive adhesive layer. The method for manufacturing the vertical GaN light emitting diodes comprises the step of removing the sapphire substrate from the light emitting structure so as to prevent the damages on a GaN single crystal plane of the structure.
摘要翻译：公开了一种垂直GaN发光二极管及其制造方法。垂直GaN发光二极管包括具有形成在其上的第一接触面的上表面的第一导电GaN包覆层，形成在第一导电GaN包层的下表面上的有源层，形成在第一导电GaN包覆层上的第二导电GaN包覆层有源层的下表面，形成在第二导电GaN包覆层上的导电粘合剂层和形成在导电粘合剂层的下表面上的形成有第二接触的下表面的导电基板。用于制造垂直GaN发光二极管的方法包括从发光结构去除蓝宝石衬底的步骤，以防止对结构的GaN单晶面的损坏。

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