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11. 发明申请

US20070164410A1 Wafer level packaging cap and fabrication method thereof 有权
标题翻译：晶圆级封装盖及其制造方法
公开(公告)号：US20070164410A1
公开(公告)日：2007-07-19
申请号：US11491086
申请日：2006-07-24
申请人： Yong-sung Kim , Woon-Bae Kim , Kyu-dong Jung , Chang-seung Lee
发明人： Yong-sung Kim , Woon-Bae Kim , Kyu-dong Jung , Chang-seung Lee
IPC分类号： H01L23/02
CPC分类号： B81C1/00301 , B81B2207/095 , B81C2203/0118 , H01L23/04 , H01L2924/01079 , H01L2924/16235
摘要： A fabrication method of a wafer level packaging cap for covering a device wafer provided with a device thereon, includes forming an insulating layer on a wafer; removing a predetermined part of the insulating layer and exposing an upper surface of the wafer; forming a cap pad extending from an upper surface and the exposed surface of the wafer; forming a cavity on a lower surface of the wafer corresponding to the cap pad; etching a bottom surface of the cavity and exposing the cap pad which is connected to the wafer through the cavity; and forming metal lines extending from the lower surface of the wafer and the cavity, to electrically connect the cap pad which is exposed through the cavity.
摘要翻译：一种用于覆盖其上具有器件的器件晶片的晶片级封装帽的制造方法，包括在晶片上形成绝缘层; 去除所述绝缘层的预定部分并暴露所述晶片的上表面; 形成从所述晶片的上表面和所述暴露表面延伸的盖焊盘; 在与所述盖垫对应的所述晶片的下表面上形成空腔; 蚀刻空腔的底表面并暴露通过空腔连接到晶片的盖垫; 以及形成从所述晶片的下表面和所述腔延伸的金属线，以电连接通过所述空腔暴露的所述盖垫。

12. 发明授权

US09629552B2 Numerical aperture (NA) controlling unit, variable optical probe including the NA controlling unit, and depth scanning method using the NA controlling unit 有权
公开(公告)号：US09629552B2
公开(公告)日：2017-04-25
申请号：US13615048
申请日：2012-09-13
申请人： Min-seog Choi , Seung-wan Lee , Woon-bae Kim , Eun-sung Lee , Kyu-dong Jung , Jong-hyeon Chang
发明人： Min-seog Choi , Seung-wan Lee , Woon-bae Kim , Eun-sung Lee , Kyu-dong Jung , Jong-hyeon Chang
IPC分类号： A61B5/05 , A61B5/00 , G01B9/02 , G02B5/00 , G02B21/00 , G02B26/00 , G02B26/10 , G01B11/22 , G02B3/14
CPC分类号： A61B5/0066 , A61B5/444 , G01B9/02063 , G01B9/02091 , G01B11/22 , G02B3/14 , G02B5/005 , G02B21/006 , G02B26/005 , G02B26/101
摘要： A numerical aperture (NA) controlling unit and a variable optical probe including the same are provided. The NA controlling unit includes: an aperture adjustment unit which controls an aperture through which light is transmitted; and a focus control unit that is disposed in a predetermined position with respect to the aperture adjustment unit, that focuses light transmitted through the aperture, and that has an adjustable focal length. The variable optical probe includes: a light transmission unit; a collimator that collimates light transmitted through the light transmission unit into parallel light; an NA controlling unit that focuses light on a sample to be inspected; and a scanner that varies a path of light transmitted through the light transmission unit such that a predetermined region of the sample is scanned by light that passes through the NA controlling unit.

13. 发明申请

US20060255443A1 Multi stack packaging chip and method of manufacturing the same 有权
标题翻译：多堆叠封装芯片及其制造方法相同
公开(公告)号：US20060255443A1
公开(公告)日：2006-11-16
申请号：US11391211
申请日：2006-03-29
申请人： Jun-sik Hwang , Woon-bae Kim , Chang-youl Moon , Moon-chul Lee , Kyu-dong Jung
发明人： Jun-sik Hwang , Woon-bae Kim , Chang-youl Moon , Moon-chul Lee , Kyu-dong Jung
IPC分类号： H01L23/02
CPC分类号： B81C1/0023 , B81B7/007 , B81C2203/0118 , H01L23/04 , H01L23/49816 , H01L24/48 , H01L25/0657 , H01L25/50 , H01L2224/48463 , H01L2225/06513 , H01L2225/06541 , H01L2225/06586 , H01L2924/00014 , H01L2924/01029 , H01L2924/01078 , H01L2924/01079 , H01L2924/01322 , H01L2924/16235 , H01L2924/19041 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A multi stack packaging chip and a method of manufacturing the chip are provided. The method includes forming at least one second circuit element on a first wafer; forming a second wafer having a cavity and a one third circuit element formed opposite to the cavity; forming a solder on the second wafer; and combining the second wafer with the first wafer so that the second circuit element and the cavity correspond. The chip includes a flip-chip packaged chip in which a first circuit element is packaged using a first wafer; a second circuit element formed on the first wafer; a second wafer having a cavity and combined with the first wafer so that the cavity and the second circuit element correspond; a third circuit element formed on the second wafer; and a solder formed on the second wafer, the solder electrically coupling the second wafer to a packaging substrate.
摘要翻译：提供了一种多层封装芯片及其制造方法。该方法包括在第一晶片上形成至少一个第二电路元件; 形成具有空腔的第二晶片和与所述腔相对形成的一个第三电路元件; 在第二晶片上形成焊料; 以及将所述第二晶片与所述第一晶片组合以使得所述第二电路元件和所述空腔对应。芯片包括倒装芯片封装芯片，其中使用第一晶片封装第一电路元件; 形成在第一晶片上的第二电路元件; 第二晶片，其具有空腔并与所述第一晶片组合，使得所述空腔和所述第二电路元件对应; 形成在第二晶片上的第三电路元件; 以及形成在所述第二晶片上的焊料，所述焊料将所述第二晶片电耦合到封装衬底。

14. 发明授权

US08508824B2 Scanning lens apparatus adopting bimorph actuator 有权
标题翻译：采用双压电晶片致动器的扫描透镜设备
公开(公告)号：US08508824B2
公开(公告)日：2013-08-13
申请号：US13189641
申请日：2011-07-25
申请人： Woon-bae Kim , Eun-sung Lee , Kyu-dong Jung
发明人： Woon-bae Kim , Eun-sung Lee , Kyu-dong Jung
IPC分类号： G02B26/08
CPC分类号： G02B23/243 , G02B26/101
摘要： A scanning lens apparatus with a bimorph actuator is provided. The scanning lens apparatus includes: a housing having a hollow cylindrical shape; a first suspension and a second suspension which are parallel to each other, and a first end of each of the first suspension and the second suspension is fixed on an inner surface of the housing; first bimorphs disposed on first surfaces of the first and second suspensions and second bimorphs disposed on second surfaces facing the first surfaces of the first and second suspensions; a first lens which is fixed between a second end of the first suspension and a second end of the second suspension; a second lens fixed parallel to the first lens between the first and second suspensions; and an object lens disposed on an end of the housing to face the second lens with respect to the first lens.
摘要翻译：提供具有双压电晶片致动器的扫描透镜装置。扫描透镜装置包括：具有中空圆柱形状的壳体; 彼此平行的第一悬架和第二悬架，并且所述第一悬架和所述第二悬架中的每一个的第一端固定在所述壳体的内表面上; 设置在第一和第二悬架的第一表面上的第一双压电晶片和设置在面向第一和第二悬架的第一表面的第二表面上的第二双晶片; 固定在所述第一悬架的第二端和所述第二悬架的第二端之间的第一透镜; 在第一和第二悬架之间平行于第一透镜固定的第二透镜; 以及设置在所述壳体的与所述第一透镜相对的第二透镜的端部上的物镜。

15. 发明授权

US08149512B2 Micro-shutter device and method of manufacturing the same 有权
标题翻译：微快门装置及其制造方法
公开(公告)号：US08149512B2
公开(公告)日：2012-04-03
申请号：US12557118
申请日：2009-09-10
申请人： Woon-bae Kim , Kyu-dong Jung , Seung-wan Lee
发明人： Woon-bae Kim , Kyu-dong Jung , Seung-wan Lee
IPC分类号： G02B1/06 , G02B26/02 , G02F1/07
CPC分类号： B29D11/0074 , G02B3/14 , G02B5/005 , G02B26/004
摘要： Micro-shutter device applicable to display devices including a flexible display device and method of manufacturing same are provided. Micro-shutter device includes membrane. Frame including receiving hole in its center portion is bonded to membrane. Transparent substrate is bonded to frame to encapsulate optical fluid received in receiving hole. Actuator varies refractive power produced by change in curvature of fluid lens formed in the center portion of the receiving hole due to bending of a periphery of the fluid lens. A reflector is disposed to correspond to the fluid lens and be spaced apart from the membrane, such that light intensity transferred to a user is adjusted depending on the refractive power produced by a change in curvature of the fluid lens. Therefore, the device has improved optical efficiency compared to using liquid crystal and a polarizing film, and can have a flexible structure for application to a flexible display device.
摘要翻译：提供了适用于包括柔性显示装置的显示装置及其制造方法的微快门装置。微快门装置包括膜。在其中心部分包括接收孔的框架粘合到膜上。透明基板粘合到框架上以封装容纳在接收孔中的光学流体。致动器改变由于流体透镜的周边弯曲而在接收孔的中心部分形成的流体透镜的曲率变化产生的屈光力。反射器设置成对应于流体透镜并且与膜间隔开，使得根据由流体透镜的曲率变化产生的屈光力来调节传递给使用者的光强度。因此，与使用液晶和偏振膜相比，该装置具有改善的光学效率，并且可以具有用于柔性显示装置的柔性结构。

16. 发明申请

US20090115875A1 IMAGE SENSOR MODULE AND FABRICATION METHOD THEREOF 有权
标题翻译：图像传感器模块及其制造方法
公开(公告)号：US20090115875A1
公开(公告)日：2009-05-07
申请号：US12119611
申请日：2008-05-13
申请人： Min-seog CHOI , Seung-wan Lee , Woon-bae Kim , Eun-sung Lee , Kyu-dong Jung , Che-heung Kim
发明人： Min-seog CHOI , Seung-wan Lee , Woon-bae Kim , Eun-sung Lee , Kyu-dong Jung , Che-heung Kim
IPC分类号： H04N5/335 , H01L31/0232
CPC分类号： H04N5/335 , H01L24/97 , H01L27/14618 , H01L27/14683 , H01L2224/16 , H01L2924/15788 , H01L2924/3511 , H04N5/2253 , H04N5/2257 , H04N5/3696 , H01L2924/00
摘要： An image sensor module having a sensor chip closely adhered on a concave surface and a fabrication method thereof are disclosed. The image sensor module includes at least one sensor chip, at least one sensor chip-mounting structure comprising a substrate and a polymer layer formed on the substrate, the polymer layer having an concave surface formed on an upper part thereof by a polymer molding method, so that the sensor chip is bent and bonded on the concave surface, and at least one lens fixed on the at least one sensor chip-mounting structure above the sensor chip.
摘要翻译：公开了一种具有密封在凹面上的传感器芯片的图像传感器模块及其制造方法。图像传感器模块包括至少一个传感器芯片，至少一个传感器芯片安装结构，包括基板和形成在基板上的聚合物层，所述聚合物层通过聚合物模塑法在其上部形成有凹形表面，使得传感器芯片弯曲并接合在凹面上，以及固定在传感器芯片上方的至少一个传感器芯片安装结构上的至少一个透镜。

17. 发明申请

US20060175707A1 Wafer level packaging cap and fabrication method thereof 有权
公开(公告)号：US20060175707A1
公开(公告)日：2006-08-10
申请号：US11339500
申请日：2006-01-26
申请人： Moon-chul Lee , Woon-bae Kim , Kae-dong Back , Qian Wang , Jun-sik Hwang , Kyu-dong Jung
发明人： Moon-chul Lee , Woon-bae Kim , Kae-dong Back , Qian Wang , Jun-sik Hwang , Kyu-dong Jung
IPC分类号： H01L23/52
CPC分类号： B81C1/00301 , B81B2207/095 , H01L21/76898 , H01L23/04 , H01L23/10 , H01L23/481 , H01L2924/0002 , H01L2924/00
摘要： A wafer level packaging cap and method thereof for a wafer level packaging are provided. The wafer level packaging cap covering a device wafer with a device thereon, includes a cap wafer having on a bottom surface a cavity providing a space for receiving the device, and integrally combined with the device wafer, a plurality of metal lines formed on the bottom surface of the cap wafer to correspond to a plurality of device pads formed on the device wafer to be electrically connected to the device, a plurality of buffer portions connected to the plurality of metal lines and comprising a buffer wafer with a plurality of grooves and a metal filled in the plurality of grooves, a plurality of connection rods electrically connected to the plurality of buffer portions and penetrating the cap wafer from a top portion of the buffer portion, and a plurality of cap pads formed on a top surface of the cap wafer and electrically connected to a plurality of connection rods.

18. 发明授权

US08482860B2 Varifocal lens structure and method of manufacturing the same 有权
标题翻译：变焦透镜结构及其制造方法
公开(公告)号：US08482860B2
公开(公告)日：2013-07-09
申请号：US13161651
申请日：2011-06-16
申请人： Seung-wan Lee , Woon-bae Kim , Kyu-dong Jung , Jeong-yub Lee
发明人： Seung-wan Lee , Woon-bae Kim , Kyu-dong Jung , Jeong-yub Lee
IPC分类号： G02B1/06 , G02B3/12
CPC分类号： C08L83/04 , C08G77/04 , G02B3/14 , G02B7/028
摘要： A varifocal lens structure and a method of manufacturing the same, the varifocal lens structure including: a frame having a fluid chamber filled with an optical fluid and formed of polymethylsiloxane (PDMS) containing a predetermined fluid; a transparent cover disposed on a top surface of the frame so as to cover the fluid chamber; a transparent elastic membrane disposed on a bottom surface of the frame so as to form a lower wall of the fluid chamber; and an actuator disposed on the elastic membrane.
摘要翻译：一种变焦透镜结构及其制造方法，所述变焦透镜结构包括：具有填充有光学流体并由含有预定流体的聚甲基硅氧烷（PDMS）形成的流体室的框架; 透明盖，其设置在所述框架的上表面上以覆盖所述流体室; 透明弹性膜，其设置在所述框架的底面上，以形成所述流体室的下壁; 以及设置在弹性膜上的致动器。

19. 发明申请

US20100118413A1 MICRO-SHUTTER DEVICE AND METHOD OF MANUFACTURING THE SAME 有权
标题翻译：微型开关装置及其制造方法
公开(公告)号：US20100118413A1
公开(公告)日：2010-05-13
申请号：US12557118
申请日：2009-09-10
申请人： Woon-bae Kim , Kyu-dong Jung , Seung-wan Lee
发明人： Woon-bae Kim , Kyu-dong Jung , Seung-wan Lee
IPC分类号： G02B3/14 , B29D11/00
CPC分类号： B29D11/0074 , G02B3/14 , G02B5/005 , G02B26/004
摘要： Micro-shutter device applicable to display devices including a flexible display device and method of manufacturing same are provided. Micro-shutter device includes membrane. Frame including receiving hole in its center portion is bonded to membrane. Transparent substrate is bonded to frame to encapsulate optical fluid received in receiving hole. Actuator varies refractive power produced by change in curvature of fluid lens formed in the center portion of the receiving hole due to bending of a periphery of the fluid lens. A reflector is disposed to correspond to the fluid lens and be spaced apart from the membrane, such that light intensity transferred to a user is adjusted depending on the refractive power produced by a change in curvature of the fluid lens. Therefore, the device has improved optical efficiency compared to using liquid crystal and a polarizing film, and can have a flexible structure for application to a flexible display device.
摘要翻译：提供了适用于包括柔性显示装置的显示装置及其制造方法的微快门装置。微快门装置包括膜。在其中心部分包括接收孔的框架粘合到膜上。透明基板粘合到框架上以封装容纳在接收孔中的光学流体。致动器改变由于流体透镜的周边弯曲而在接收孔的中心部分形成的流体透镜的曲率变化产生的屈光力。反射器设置成对应于流体透镜并且与膜间隔开，使得根据由流体透镜的曲率变化产生的屈光力来调节传递给使用者的光强度。因此，与使用液晶和偏振膜相比，该装置具有改善的光学效率，并且可以具有用于柔性显示装置的柔性结构。

20. 发明授权

US07579685B2 Wafer level packaging cap and fabrication method thereof 有权
标题翻译：晶圆级封装盖及其制造方法
公开(公告)号：US07579685B2
公开(公告)日：2009-08-25
申请号：US11339500
申请日：2006-01-26
申请人： Moon-chul Lee , Woon-bae Kim , Kae-dong Back , Qian Wang , Jun-sik Hwang , Kyu-dong Jung
发明人： Moon-chul Lee , Woon-bae Kim , Kae-dong Back , Qian Wang , Jun-sik Hwang , Kyu-dong Jung
IPC分类号： H01L23/12 , H01L23/043
CPC分类号： B81C1/00301 , B81B2207/095 , H01L21/76898 , H01L23/04 , H01L23/10 , H01L23/481 , H01L2924/0002 , H01L2924/00
摘要： A wafer level packaging cap and method thereof for a wafer level packaging are provided. The wafer level packaging cap covering a device wafer with a device thereon, includes a cap wafer having on a bottom surface a cavity providing a space for receiving the device, and integrally combined with the device wafer, a plurality of metal lines formed on the bottom surface of the cap wafer to correspond to a plurality of device pads formed on the device wafer to be electrically connected to the device, a plurality of buffer portions connected to the plurality of metal lines and comprising a buffer wafer with a plurality of grooves and a metal filled in the plurality of grooves, a plurality of connection rods electrically connected to the plurality of buffer portions and penetrating the cap wafer from a top portion of the buffer portion, and a plurality of cap pads formed on a top surface of the cap wafer and electrically connected to a plurality of connection rods.
摘要翻译：提供了一种用于晶片级封装的晶片级封装盖及其方法。覆盖其上具有器件的器件晶片的晶片级封装盖包括盖晶片，其在底表面上具有提供用于接收器件的空间并与器件晶片整体结合的空腔，形成在底部的多个金属线盖片晶片的表面对应于形成在器件晶片上以电连接到器件的多个器件焊盘，多个缓冲部分连接到多个金属线并且包括具有多个沟槽的缓冲晶片和填充在所述多个槽中的金属，多个连接杆，电连接到所述多个缓冲部分，并且从所述缓冲部分的顶部穿透所述盖片;以及形成在所述盖片的顶表面上的多个帽垫并且电连接到多个连接杆。

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