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11. 发明授权

US07012939B2 Wavelength stabilization module having light-receiving element array and method of manufacturing the same 失效
标题翻译：具有光接收元件阵列的波长稳定模块及其制造方法
公开(公告)号：US07012939B2
公开(公告)日：2006-03-14
申请号：US10648238
申请日：2003-08-27
申请人： Kwang Seong Choi , Heung Woo Park , Ho Gyeong Yun , Byung Seok Choi , Yong Sung Eom , Jong Hyun Lee , Jong Tae Moon
发明人： Kwang Seong Choi , Heung Woo Park , Ho Gyeong Yun , Byung Seok Choi , Yong Sung Eom , Jong Hyun Lee , Jong Tae Moon
IPC分类号： H01S3/13 , G01B9/02
CPC分类号： H04B10/572
摘要： A wavelength stabilization module having a light-receiving element array and a method of manufacturing the same are disclosed. The wavelength stabilization module having a laser diode which irradiates a laser beam at the front side and the rear side thereof comprises a collimator for paralleling the laser beam irradiated at the rear side; a beam splitter for splitting the laser beam passed through the collimator into the two directional laser beams; a light-receiving element for receiving one of the split laser beams; a filter for transmitting a specific wavelength of the other of the split laser beams; a light-receiving element array for receiving the laser beam passed through the filter; and a controller for controlling the output wavelength of the laser diode by using the signals output from the light-receiving element and the light-receiving element array, and the filter and the light-receiving element array are tilted at a predetermined angle with respect to the laser beam and lock the wavelength by using an incident angle dependency of the laser beam passed through the filter.
摘要翻译：公开了具有光接收元件阵列的波长稳定模块及其制造方法。具有在其前侧和后侧照射激光束的激光二极管的波长稳定模块包括用于与在后侧照射的激光束并联的准直器; 用于将穿过准直器的激光束分成两个定向激光束的分束器; 用于接收所述分离激光束中的一个的光接收元件; 用于传输另一个分离激光束的特定波长的滤波器; 用于接收通过过滤器的激光束的光接收元件阵列; 以及控制器，用于通过使用从光接收元件和光接收元件阵列输出的信号来控制激光二极管的输出波长，并且滤光器和光接收元件阵列相对于激光束并通过使用通过过滤器的激光束的入射角依赖性来锁定波长。

12. 发明申请

US20120288983A1 METHOD FOR MANUFACTURING DYE SENSITIZED SOLAR CELL MODULE 审中-公开
标题翻译：用于制造染料敏化太阳能电池模块的方法
公开(公告)号：US20120288983A1
公开(公告)日：2012-11-15
申请号：US13459560
申请日：2012-04-30
申请人： Moo Jung Chu , Ju Mi Kim , Yong Sung Eom , Ah Ram Jeon , Jong Tae Moon
发明人： Moo Jung Chu , Ju Mi Kim , Yong Sung Eom , Ah Ram Jeon , Jong Tae Moon
IPC分类号： H01L31/18
CPC分类号： H01G9/2081 , Y02E10/542 , Y02P70/521
摘要： Disclosed is a method for manufacturing a dye sensitized solar cell module. The method includes putting at least one or more heating-wires on an upper portion of an electrode of each solar cell sub-module; applying a metal paste on the upper portion of the electrode including at least one or more heating-wires; and heating and curing the metal paste by after overlapping the electrodes of a plurality of solar cell sub-modules each other, allowing a current to flow to at least one or more heating-wires.
摘要翻译：公开了一种染料敏化太阳能电池模块的制造方法。该方法包括在每个太阳能电池子模块的电极的上部放置至少一根或多根加热线; 在包括至少一个或多个加热丝的电极的上部上施加金属膏; 并且通过在多个太阳能电池子模块的电极彼此重叠之后加热和固化金属浆料，允许电流流向至少一个或多个加热线。

13. 发明申请

US20090261481A1 WAFER LEVEL PACKAGE AND METHOD OF FABRICATING THE SAME 有权
标题翻译： WAFER LEVEL PACKAGE及其制作方法
公开(公告)号：US20090261481A1
公开(公告)日：2009-10-22
申请号：US12208512
申请日：2008-09-11
申请人： Jong Tae MOON , Yong Sung Eom , Min Ji Lee , Hyun Kyu Yu
发明人： Jong Tae MOON , Yong Sung Eom , Min Ji Lee , Hyun Kyu Yu
IPC分类号： H01L23/52 , H01L21/66 , H01L21/00
CPC分类号： H01L23/10 , B81B7/007 , B81C2203/0118 , H01L24/45 , H01L24/48 , H01L24/94 , H01L2224/16145 , H01L2224/45015 , H01L2224/45144 , H01L2224/48091 , H01L2924/00014 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/1461 , H01L2924/16235 , H01L2924/00 , H01L2924/2076 , H01L2224/05599
摘要： Provided are a wafer level package in which a communication line can be readily formed between an internal device and the outside of the package, and a method of fabricating the wafer level package. The wafer level package includes a first substrate having a cavity in which a first internal device is disposed, an Input/Output (I/O) pad formed on the first substrate and electrically connected with the first internal device, a second substrate disposed over the first substrate and from which a part corresponding to the I/O pad is removed, and a solder bonding the first and second substrates. According to the wafer level package and the method of fabricating the same, upper and lower substrates are sawed to different cutting widths, or a hole is formed in the upper substrate, such that a communication line of an internal device can be readily formed without a via process which penetrates a substrate. Therefore, in comparison with a conventional wafer level package fabricated using the via process, it is possible to simplify a fabrication process and reduce production cost.
摘要翻译：提供了一种晶片级封装，其中可以容易地在内部器件和封装外部之间形成通信线，以及制造晶片级封装的方法。晶片级封装包括具有第一内部器件的空腔的第一衬底，形成在第一衬底上并与第一内部器件电连接的输入/输出（I / O）焊盘，设置在第一衬底上的第二衬底第一衬底并且从其中除去对应于I / O焊盘的部分，以及焊接第一和第二衬底的焊料。根据晶片级封装及其制造方法，上下基板被切割成不同的切割宽度，或者在上基板上形成孔，使得可以容易地形成内部装置的连通线，而不需要穿过基底的过程。因此，与使用通孔工艺制造的常规晶片级封装相比，可以简化制造工艺并降低生产成本。

14. 发明授权

US08420722B2 Composition and methods of forming solder bump and flip chip using the same 有权
公开(公告)号：US08420722B2
公开(公告)日：2013-04-16
申请号：US12476925
申请日：2009-06-02
申请人： Yong Sung Eom , Jong Tae Moon , Sangwon Oh , Keonsoo Jang
发明人： Yong Sung Eom , Jong Tae Moon , Sangwon Oh , Keonsoo Jang
IPC分类号： B60C1/00
CPC分类号： H05K13/0465 , B23K3/0623 , B23K35/24 , B23K35/34 , B23K35/3601 , B23K35/3613 , B23K2101/36 , B82Y10/00 , H01L24/29 , H01L24/30 , H01L24/83 , H01L2224/1141 , H01L2224/1152 , H01L2224/1184 , H01L2224/16238 , H01L2224/27416 , H01L2224/2784 , H01L2224/3003 , H01L2224/73104 , H01L2224/73204 , H01L2224/81355 , H01L2224/83886 , H05K3/323 , H05K3/3436 , H05K3/3484 , H05K3/46 , H05K2201/026 , H05K2201/10977 , Y10T29/49117 , Y10T29/49126
摘要： Provided are a composition for an anisotropic conductive adhesive, a method of forming a solder bump and a method of forming a flip chip using the same. The composition for an anisotropic conductive adhesive includes a low melting point solder particle and a thermo-curable polymer resin. The anisotropic conductive adhesive includes forming a mixture by mixing a polymer resin and a curing agent, and mixing a deforming agent, a catalyst or a reductant with the mixture.

15. 发明授权

US07985697B2 Wafer level package and method of fabricating the same 有权
标题翻译：晶圆级封装及其制造方法
公开(公告)号：US07985697B2
公开(公告)日：2011-07-26
申请号：US12208512
申请日：2008-09-11
申请人： Jong Tae Moon , Yong Sung Eom , Min Ji Lee , Hyun Kyu Yu
发明人： Jong Tae Moon , Yong Sung Eom , Min Ji Lee , Hyun Kyu Yu
IPC分类号： H01L21/31
CPC分类号： H01L23/10 , B81B7/007 , B81C2203/0118 , H01L24/45 , H01L24/48 , H01L24/94 , H01L2224/16145 , H01L2224/45015 , H01L2224/45144 , H01L2224/48091 , H01L2924/00014 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/1461 , H01L2924/16235 , H01L2924/00 , H01L2924/2076 , H01L2224/05599
摘要： Provided are a wafer level package in which a communication line can be readily formed between an internal device and the outside of the package, and a method of fabricating the wafer level package. The wafer level package includes a first substrate having a cavity in which a first internal device is disposed, an Input/Output (I/O) pad formed on the first substrate and electrically connected with the first internal device, a second substrate disposed over the first substrate and from which a part corresponding to the I/O pad is removed, and a solder bonding the first and second substrates. According to the wafer level package and the method of fabricating the same, upper and lower substrates are sawed to different cutting widths, or a hole is formed in the upper substrate, such that a communication line of an internal device can be readily formed without a via process which penetrates a substrate. Therefore, in comparison with a conventional wafer level package fabricated using the via process, it is possible to simplify a fabrication process and reduce production cost.
摘要翻译：提供了一种晶片级封装，其中可以容易地在内部器件和封装外部之间形成通信线，以及制造晶片级封装的方法。晶片级封装包括具有第一内部器件的空腔的第一衬底，形成在第一衬底上并与第一内部器件电连接的输入/输出（I / O）焊盘，设置在第一衬底上的第二衬底第一衬底并且从其中除去对应于I / O焊盘的部分，以及焊接第一和第二衬底的焊料。根据晶片级封装及其制造方法，上下基板被切割成不同的切割宽度，或者在上基板上形成孔，使得可以容易地形成内部装置的连通线，而不需要穿过基底的过程。因此，与使用通孔工艺制造的常规晶片级封装相比，可以简化制造工艺并降低生产成本。

16. 发明授权

US08547278B2 Sensing device having multi beam antenna array 有权
标题翻译：具有多光束天线阵列的感测装置
公开(公告)号：US08547278B2
公开(公告)日：2013-10-01
申请号：US12771538
申请日：2010-04-30
申请人： Dong Suk Jun , Yong Sung Eom , Hyun Seo Kang , Moo Jung Chu , Soo Young Oh
发明人： Dong Suk Jun , Yong Sung Eom , Hyun Seo Kang , Moo Jung Chu , Soo Young Oh
IPC分类号： H01Q3/22 , H01Q3/00 , H01L21/30
CPC分类号： H01Q3/22 , H01Q3/26 , H01Q3/30 , H01Q3/40 , H01Q25/008
摘要： A sensing device may include an antenna. The antenna may include a top wafer and a bottom wafer coupled to the top wafer. The antenna may further include an air cavity between the top wafer and the bottom wafer. The sensing device may further include a substrate and an interposer disposed between the antenna and the substrate.
摘要翻译：感测装置可以包括天线。天线可以包括联接到顶部晶片的顶部晶片和底部晶片。天线还可以包括在顶部晶片和底部晶片之间的空气腔。感测装置还可以包括衬底和布置在天线和衬底之间的插入器。

17. 发明授权

US07244923B2 Surface emitting laser device including optical sensor and optical waveguide device employing the same 有权
标题翻译：表面发射激光器件包括光学传感器和采用该传感器的光波导器件
公开(公告)号：US07244923B2
公开(公告)日：2007-07-17
申请号：US11232661
申请日：2005-09-21
申请人： Hyun Woo Song , Jong Hee Kim , Yong Sung Eom
发明人： Hyun Woo Song , Jong Hee Kim , Yong Sung Eom
IPC分类号： H01L31/00
CPC分类号： H01S5/18341 , H01S5/0262 , H01S5/0264 , H01S5/18305 , H01S5/18369 , H01S5/423
摘要： Provided are a surface emitting laser device having an optical sensor, and an optical waveguide device employing the same. The surface emitting laser device having an optical sensor includes a surface emitting laser formed on a substrate and generating a laser beam to output it to outside, and an optical sensor formed adjacent to the surface emitting laser on the substrate and receiving external light. In the surface emitting laser device having the optical sensor, and the optical waveguide device employing the same, the surface emitting laser and the optical sensor are simultaneously integrated, however, the performance of the surface emitting laser is unaffected by the optical sensor and the optical sensor operates separately, exhibits high performance, and can respond within a wide wavelength band.
摘要翻译：提供一种具有光学传感器的表面发射激光器件和使用该传感器的光波导器件。具有光学传感器的表面发射激光器件包括形成在衬底上的表面发射激光器，并产生激光束以将其输出到外部;以及光学传感器，其形成在衬底上与表面发射激光相邻并接收外部光。在具有光学传感器的表面发射激光器件和采用该光学传感器的光波导器件中，表面发射激光器和光学传感器被同时集成，然而，表面发射激光器的性能不受光学传感器和光学器件的影响传感器分开操作，表现出高性能，并可在宽波段范围内作出响应。

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