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11. 发明授权

US4872787A Method of drilling printed circuit board 失效
标题翻译：印刷电路板钻孔方法
公开(公告)号：US4872787A
公开(公告)日：1989-10-10
申请号：US106439
申请日：1987-10-09
申请人： Kunio Arai , Hiromi Nishiyama , Hiroshi Aoyama , Yasuhiko Kanaya
发明人： Kunio Arai , Hiromi Nishiyama , Hiroshi Aoyama , Yasuhiko Kanaya
IPC分类号： B23B47/18 , B23B35/00 , B23B41/00 , B23B47/22 , B26F1/16 , H05K3/00
CPC分类号： B23B35/005 , H05K3/0047 , G05B2219/45129 , G05B2219/49047 , H05K2203/1536 , Y10T408/03 , Y10T408/23 , Y10T408/5623
摘要： In a method of drilling a printed circuit board according to the present invention, an entry feed rate at which a drill is fed into the printed circuit boards during the initial stage of drilling is made slightly smaller than a drilling feed rate at which the drill is fed while it is drilling a hole through the printed circuit boards, so as to enhance the accuracy at which holes are located. One drilling operation includes a plurality of drilling feeds of the drill, and pulled-out positions of the drill which are reached by the drill between adjacent drilling feed rate are set within a range in which the pressure of a pressure foot is effective. This can prevent the stacked printed circuit boards from shifting and increase the accuracy at which the holes are located.
摘要翻译：在根据本发明的钻孔印刷电路板的方法中，钻头在初始阶段期间将钻头送入印刷电路板的入料速率略小于钻头的钻孔进给速率在通过印刷电路板钻孔时进给，以提高孔所在的精度。一次钻孔操作包括钻头的多个钻孔进给，并且由钻头在相邻的钻井进给速率之间达到的钻头的拉出位置设定在压脚的压力有效的范围内。这可以防止堆叠的印刷电路板移动并增加孔所在的精度。

12. 发明授权

US07335296B2 System and device for processing supercritical and subcritical fluid 失效
标题翻译：用于处理超临界和亚临界流体的系统和装置
公开(公告)号：US07335296B2
公开(公告)日：2008-02-26
申请号：US10486907
申请日：2002-10-09
申请人： Kunio Arai , Hiroshi Inomata , Richard Lee Smith, Jr.
发明人： Kunio Arai , Hiroshi Inomata , Richard Lee Smith, Jr.
IPC分类号： B01D17/12
CPC分类号： B01J3/008 , B01J3/006 , B01J19/004 , B01J2219/00038 , B01J2219/00162 , B01J2219/00171 , Y02P20/544
摘要： A system for processing supercritical and subcritical fluid capable of bringing the inside of at least one processing container (1) formed in a flow passage into a supercritical or subcritical high pressure field, wherein thermal operation is applied to process fluid to apply thermal expansion to the fluid to produce a pressure difference between the processing container (1) and the outside, whereby a specified temperature and the high pressure field suitable for the processing of the supercritical or subcritical fluid can be provided in the processing container (1).
摘要翻译：一种用于处理超临界和亚临界流体的系统，其能够使形成在流动通道中的至少一个处理容器（1）的内部进入超临界或亚临界高压场，其中施加热操作以处理流体以将热膨胀施加到流体以在处理容器（1）和外部之间产生压力差，从而可以在处理容器（1）中提供适合于处理超临界或亚临界流体的特定温度和高压场。

13. 发明申请

US20070075059A1 Laser machining method and laser machining apparatus 有权
标题翻译：激光加工方法和激光加工设备
公开(公告)号：US20070075059A1
公开(公告)日：2007-04-05
申请号：US11525154
申请日：2006-09-22
申请人： Kunio Arai
发明人： Kunio Arai
IPC分类号： B23K26/38 , B23K26/06
CPC分类号： B23K26/067 , B23K26/389
摘要： There is provided a laser machining method and a laser machining apparatus whose machining accuracy and quality excel without lowering machining efficiency. One hole is machined by a split beam that is a first pulsed laser beam and another split beam that is a second pulsed laser beam whose irradiation position is determined based on irradiation position of the first laser beam. In this case, the machining quality may be improved by machining the circular hole by equalizing circling directions and angular velocity of the split beams. A beam splitter splits a laser beam outputted out of one laser oscillator into the split beams and AOMs can time-share them.
摘要翻译：提供了一种激光加工方法和激光加工装置，其加工精度和质量优异，而不降低加工效率。一个孔由作为第一脉冲激光束的分束和另一个分割光束加工，该分束是第二脉冲激光束，其照射位置是基于第一激光束的照射位置确定的。在这种情况下，通过使分割光束的旋转方向和角速度相等来加工圆形孔，可以提高加工质量。分束器将从一个激光振荡器输出的激光束分成分束，并且AOM可以分时分配。

14. 发明授权

US07182861B2 System for separating electrophotographic carrier compositions and recycling the compositions 有权
标题翻译：用于分离电子照相载体组合物并再循环组合物的系统
公开(公告)号：US07182861B2
公开(公告)日：2007-02-27
申请号：US10197274
申请日：2002-07-16
申请人： Kunitoshi Sugiyama , Yoshihiko Itoh , Hideyuki Santoh , Kunio Arai , Tadafumi Ajiri
发明人： Kunitoshi Sugiyama , Yoshihiko Itoh , Hideyuki Santoh , Kunio Arai , Tadafumi Ajiri
IPC分类号： B08B7/04 , B01J19/00 , B01J19/02
CPC分类号： B08B7/0021 , G03G9/113 , G03G9/1131
摘要： A method for use in two-components electrostatic image developers is disclosed, in which secure separation of a carrier coating resinous materials from a core magnetic material is achieved without affecting the properties of the core materials through process steps benign to the environment in super- or sub-critical water compositions under the conditions of a temperature of 300° C. or more and a pressure of 20 MPa. The core magnetic material is subsequently recycled for forming carrier. This method may also be useful for processing waste including magnetic materials with silicone resin coating.
摘要翻译：公开了一种用于双组分静电图像显影剂的方法，其中，通过在超级或超纯度静电图像显影剂的环境中良好的处理步骤，可以在不影响芯材料的性能的情况下实现载体涂覆树脂材料与芯磁性材料的固定分离亚临界水组合物在温度为300℃以上，压力为20MPa的条件下进行。核心磁性材料随后被再循环用于形成载体。该方法也可用于处理包括具有硅树脂涂层的磁性材料的废物。

15. 发明申请

US20050244621A1 Printed circuit board and method for processing printed circuit board 审中-公开
标题翻译：印刷电路板和印刷电路板的处理方法
公开(公告)号：US20050244621A1
公开(公告)日：2005-11-03
申请号：US11117505
申请日：2005-04-29
申请人： Kunio Arai , Haruo Akahoshi
发明人： Kunio Arai , Haruo Akahoshi
IPC分类号： B32B3/00 , H05K1/02 , H05K3/00 , H05K3/06 , H05K3/42 , H05K3/46
CPC分类号： H05K3/4679 , H05K1/0269 , H05K3/0008 , H05K3/0035 , H05K3/0038 , H05K3/06 , H05K3/062 , H05K3/421 , H05K3/427 , H05K3/429 , H05K3/4652 , H05K2201/0112 , H05K2201/09845 , H05K2201/09918 , H05K2203/0315 , H05K2203/0346 , H05K2203/0554 , Y10T428/24917
摘要： The invention is to provide a printed circuit board in which advance of packaging density of the printed circuit board and reduction in production cost can be attained while processing quality can be made uniform, a method for processing the printed circuit board and a method for producing the printed circuit board. There is provided a printed circuit board including an alternate laminate of electric conductor layers and electrically insulating layers, wherein a coating layer capable of absorbing laser light but insoluble in an etching solution dissolving the electric conductor layers is provided on a front surface of a first one of the electric conductor layers. In this case, the coating layer may be provided on a front surface of a rear one of the electric conductor layers. Each of the electric conductor layers may contain Cu as a main component while the coating layer may contain CuO as a main component. The coating layer may have a thickness not thinner than 0.6 μm.
摘要翻译：本发明提供一种印刷电路板，其中能够使加工质量均匀的印刷电路板的封装密度的提高和生产成本的降低，印刷电路板的处理方法和制造方法印刷电路板。提供了一种印刷电路板，其包括导电层和电绝缘层的交替叠层，其中在第一个的前表面上设置有能够吸收激光但不溶于溶解导电层的蚀刻溶液的涂层的导电层。在这种情况下，涂层可以设置在后导体层的前表面上。每个导电体层可以包含Cu作为主要成分，而涂层可以包含CuO作为主要成分。涂层可以具有不小于0.6μm的厚度。

16. 发明授权

US5332341A Pressure foot of printed circuit board drilling apparatus 失效
标题翻译：印刷电路板钻孔装置的压脚
公开(公告)号：US5332341A
公开(公告)日：1994-07-26
申请号：US966192
申请日：1993-01-29
申请人： Kunio Arai , Yasuhiko Kanaya , Kazunori Hamada
发明人： Kunio Arai , Yasuhiko Kanaya , Kazunori Hamada
IPC分类号： B23Q3/06 , B23Q11/00 , H05K3/00 , B23B47/00
CPC分类号： B23Q3/002 , B23Q11/006 , H05K3/0044 , Y02P70/171 , Y10T408/46 , Y10T408/50 , Y10T408/5623
摘要： A pressure foot (7) of a printed circuit board drilling apparatus is supported on a spindle (2) of the printed circuit board drilling apparatus slidably in the axial direction, and includes a pressing face (13) which presses a printed circuit board (5) at the time of drilling operation, a discharge port (11) formed in a side wall (8) so as to discharge chips produced by drilling operation, the discharge port (11) being connected to a suction device, and a compressed air supply conduit (20A) formed in a side wall so as to eject the compressed air toward a drill bit (4) of the printed circuit board drilling apparatus. A cooling fluid supply device (21) is connected to the compressed air supply conduit (20A). In place of the compressed air supply conduit (20A), a fluid supply conduit (14) for ejecting a cooling fluid toward the drill bit (4) of the printed circuit board drilling apparatus may be formed. In this case, at least one groove (18) extending in a tangential direction of the drill bit is formed in the pressing face (13) so as to allow the air to be drawn into an inside (10) of the pressure foot. Thus, cooling efficiency of the drill bit at the time of drilling operation can be enhanced.
摘要翻译： PCT No.PCT / JP92 / 00690 Sec。 371日期：1993年1月29日 102（e）日期1993年1月29日PCT提交1992年5月28日PCT公布。 WO92 / 21481 PCT公开号日本1992年12月10日。印刷电路板钻孔装置的压脚（7）沿轴向方向可滑动地支撑在印刷电路板钻孔装置的主轴（2）上，并包括按压面（13）在钻孔操作时压印印刷电路板（5），形成在侧壁（8）中的排出口（11）以排出由钻孔操作产生的碎屑，排出口（11）连接到抽吸装置和形成在侧壁中的压缩空气供应导管（20A），以朝向印刷电路板钻孔装置的钻头（4）喷射压缩空气。冷却液供给装置（21）与压缩空气供给管道（20A）连接。可以形成用于朝向印刷电路板钻孔装置的钻头（4）喷射冷却流体的流体供给管道（14）来代替压缩空气供给管道（20A）。在这种情况下，在按压面（13）上形成沿钻头的切线方向延伸的至少一个凹槽（18），以便将空气拉入压脚的内部（10）。因此，能够提高钻孔时的钻头的冷却效率。

17. 发明授权

US5108236A Low mass spindle and Z-axis unit 失效
标题翻译：低质量主轴和Z轴单元
公开(公告)号：US5108236A
公开(公告)日：1992-04-28
申请号：US602690
申请日：1990-10-24
申请人： Kunio Arai , Yasuhiko Kanaya
发明人： Kunio Arai , Yasuhiko Kanaya
IPC分类号： B23B31/20 , B23B31/26 , B23B47/08 , B23Q1/48 , B23Q1/70 , H05K3/00
CPC分类号： B23Q1/4828 , B23B31/207 , B23B31/265 , B23Q1/70 , B23B2260/136 , H05K3/0044 , Y10T408/56253 , Y10T409/305544
摘要： A spindle and Z-axis unit comprises a spindle housing and a hollow rotor shaft rotatable and axially movable with respect to the spindle housing. The rotor shaft carries a collet at its lower end for chucking a machine tool such as a drill bit. The tool is changed in the collet by pneumatic actuation of a diaphragm which actuates a push rod within the rotor shaft to move the collet axially against a spring bias to clamp and unclamp the tool. The shaft is moved in the Z-direction along with a thrust bearing assembly by a screw nut which actuates a road to move the rotor shaft in the Z-direction to drill a workpiece after a pressure foot has first been moved to clamp the workpiece with respect to the spindle. Thus, the moving weight or mass previously attributable to parts such as a spindle saddle and spindle housing can be eliminated without impairing the reliability and chucking force of the collet mechanism.
摘要翻译：主轴和Z轴单元包括主轴壳体和可相对于主轴壳体可旋转并可轴向移动的中空转子轴。转子轴在其下端带有夹头，用于夹紧诸如钻头的机床。该工具通过气动致动隔膜而改变，所述膜片致动转子轴内的推杆，以便使夹头沿轴向抵抗弹簧偏压以夹紧和松开工具。轴与推力轴承组件一起通过螺母移动，推力轴承组件通过螺杆螺母移动，该螺母在压力脚首先移动以夹紧工件之后致动道路以使转子轴在Z方向上移动以钻出工件，相对于主轴。因此，可以消除以前归因于诸如主轴鞍座和主轴壳体的部件的移动重量或质量，而不损害夹头机构的可靠性和夹紧力。

18. 发明授权

US5066171A Method for drilling a printed circuit board 失效
标题翻译：钻孔印刷电路板的方法
公开(公告)号：US5066171A
公开(公告)日：1991-11-19
申请号：US324769
申请日：1989-03-17
申请人： Kunio Arai , Hiromi Nishiyama , Hiroshi Aoyama , Yasuhiko Kanaya
发明人： Kunio Arai , Hiromi Nishiyama , Hiroshi Aoyama , Yasuhiko Kanaya
IPC分类号： B23B47/18 , B23B35/00 , B23B41/00 , B23B47/22 , B26F1/16 , H05K3/00
CPC分类号： B23B35/005 , H05K3/0047 , G05B2219/45129 , G05B2219/49047 , H05K2203/1536 , Y10T408/03 , Y10T408/23 , Y10T408/5623
摘要： In a method of and an apparatus for drilling a hole in a workpiece, a pressure foot associated with a drill is moved into contact with the workpiece, and a drill bit associated with the drill is moved from a drill-starting position into the workpiece, toward the drill-starting position and again into the workpiece while maintaining the pressure foot in constant contact with the workpiece. The drill is reciprocally fed by a plurality of times under the pressure of the pressure foot acting upon the printed circuit board. In either of the method and the apparatus, a hole with a high aspect ratio can be formed in a workpiece made from a thin, flexible material.

19. 发明授权

US4997319A Apparatus for drilling a hole in a printed circuit board 失效
标题翻译：用于在印刷电路板中钻孔的装置
公开(公告)号：US4997319A
公开(公告)日：1991-03-05
申请号：US394659
申请日：1989-08-16
申请人： Kunio Arai , Hiromi Nishiyama , Hiroshi Aoyama , Yasuhiko Kanaya
发明人： Kunio Arai , Hiromi Nishiyama , Hiroshi Aoyama , Yasuhiko Kanaya
IPC分类号： B23B47/18 , B23B35/00 , B23B41/00 , B23B47/22 , B26F1/16 , H05K3/00
CPC分类号： B23B35/005 , H05K3/0047 , G05B2219/45129 , G05B2219/49047 , H05K2203/1536 , Y10T408/03 , Y10T408/23 , Y10T408/5623
摘要： An apparatus for drilling a hole in a workpiece such as, for example, a printed circuit board wherein a pressure foot, associated with a drill, is moved into a position to exert a pressure on the workpiece. A drill bit associated with the drill is moved with respect to the workpiece, and an arrangement is provided for controlling the operations of the pressure foot and the drill bit in such a manner so as to move the drill bit from a drill starting position into the workpiece, then toward the drill starting position and again into the workpiece while maintaining the pressure exerted on the workpiece by the pressure foot.

20. 发明授权

US08075788B2 Fabrication method of printed circuit board and printed circuit board machining apparatus 有权
标题翻译：印刷电路板和印刷电路板加工设备的制造方法
公开(公告)号：US08075788B2
公开(公告)日：2011-12-13
申请号：US11987980
申请日：2007-12-06
申请人： Kunio Arai , Hiroshi Aoyama , Yasuhiko Kanaya
发明人： Kunio Arai , Hiroshi Aoyama , Yasuhiko Kanaya
IPC分类号： H05K3/06
CPC分类号： H05K3/465 , B23K26/0604 , B23K26/0661 , B23K26/0738 , B23K26/082 , B23K26/382 , B23K26/40 , B23K2101/35 , B23K2101/42 , B23K2103/16 , B23K2103/42 , B23K2103/50 , H05K3/0032 , H05K3/0035 , H05K3/045 , H05K3/107 , H05K3/16 , H05K3/4661 , H05K2201/0166 , H05K2201/09563 , H05K2203/0557 , H05K2203/108 , Y10T29/49155
摘要： A printed circuit board fabrication method allows a fabrication time and a fabrication cost to be reduced. The fabrication method of the printed circuit board includes steps of forming a resist layer on a surface of the printed circuit board whose surface is made of an insulator, of forming a hole that is connected from the surface of the resist layer to a conductor pattern of an inner layer and a hole and grooves having a depth not connected with the conductor layer of the inner layer by irradiating lasers, of filling a conductive material into the holes and the grooves to form a conductor pattern and of removing the resist layer to project a portion of the conductor pattern out of the surface of the insulating layer.
摘要翻译：印刷电路板制造方法可以减少制造时间和制造成本。印刷电路板的制造方法包括以下步骤：在表面由绝缘体制成的印刷电路板的表面上形成抗蚀剂层，形成从抗蚀剂层的表面连接到孔的导体图案内层和孔以及通过照射激光而不与内层的导体层连接的深度的凹槽，将导电材料填充到孔和凹槽中以形成导体图案并且去除抗蚀剂层以投射导体图案的部分从绝缘层的表面出来。

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