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11. 发明授权

US07867673B2 Substrate-processing apparatus, substrate-processing method, substrate-processing program, and computer-readable recording medium recorded with such program 有权
标题翻译：基板处理装置，基板处理方法，基板处理程序和记录有该程序的计算机可读记录介质
公开(公告)号：US07867673B2
公开(公告)日：2011-01-11
申请号：US12065782
申请日：2006-09-13
申请人： Kunie Ogata , Hiroshi Tomita , Michio Tanaka , Ryoichi Uemura
发明人： Kunie Ogata , Hiroshi Tomita , Michio Tanaka , Ryoichi Uemura
IPC分类号： G03C5/00 , G03F1/00 , H01L21/00
CPC分类号： H01L21/67225 , G03F7/168 , G03F7/3071 , G03F7/40 , H01L22/12 , H01L22/20 , H01L2924/0002 , H01L2924/00
摘要： A pattern forming system 1 includes a checking apparatus 400, a storage device 502, and a control section 500. The checking apparatus 400 is configured to measure and check a state of a resist pattern formed on a substrate W after a developing process and output a first check result thus obtained, and to measure and check a state of a pattern formed on the substrate after an etching process and output a second check result thus obtained. The storage device 502 stores a correlation formula obtained from the first check result and the second check result. The control section 500 is configured to use the correlation formula to obtain a target value of the state of the pattern after the developing process from a target value of the state of the pattern after the etching process, and to use a difference between the target value of the state of the pattern after the developing process and the first check result to set a condition for the first heat process and/or the second heat process.
摘要翻译：图案形成系统1包括检查装置400，存储装置502和控制部500.检查装置400被配置为测量并检查在显影处理之后形成在基板W上的抗蚀剂图案的状态，并输出第一检查结果，并且在蚀刻处理之后测量和检查在基板上形成的图案的状态，并输出由此获得的第二检查结果。存储装置502存储从第一检查结果和第二检查结果获得的相关公式。控制部500被配置为使用相关公式从蚀刻处理之后的图案的状态的目标值获得显影处理之后的图案的状态的目标值，并且使用目标值的显影过程之后的图案状态和第一检查结果来设定第一加热处理和/或第二加热处理的条件。

12. 发明授权

US07862966B2 Substrate-processing apparatus, substrate-processing method, substrate-processing program, and computer-readable recording medium recorded with such program 有权
标题翻译：基板处理装置，基板处理方法，基板处理程序和记录有该程序的计算机可读记录介质
公开(公告)号：US07862966B2
公开(公告)日：2011-01-04
申请号：US12065809
申请日：2006-09-13
申请人： Kunie Ogata , Hiroshi Tomita , Michio Tanaka , Ryoichi Uemura
发明人： Kunie Ogata , Hiroshi Tomita , Michio Tanaka , Ryoichi Uemura
IPC分类号： G03C5/00 , G03F1/00 , H01L21/00
CPC分类号： G03F7/40
摘要： A pattern forming system 1 is configured to execute a series of processes, which includes a first heat process for performing a heat process on a substrate W after a resist liquid coating process, a light exposure process for performing light exposure on a resist film in accordance with a predetermined pattern, a second heat process for promoting a chemical reaction in the resist film after the light exposure, a developing process for developing the resist film after the light exposure, and an etching process for etching an oxide film by use of a resist pattern formed by the developing process as a mask. The system includes a checking apparatus 400 configured to measure and check a state of a pattern formed after the etching process, and a control section 500 configured to use a check result to set a condition for the first heat process and/or the second heat process so as to cause the state of the pattern to be uniform on a surface of the substrate W after the etching process.
摘要翻译：图案形成系统1被配置为执行一系列处理，其包括在抗蚀剂液体涂覆处理之后在衬底W上执行热处理的第一热处理，用于在抗蚀剂膜上进行曝光的曝光工艺具有预定图案，用于促进曝光后的抗蚀剂膜中的化学反应的第二热处理，曝光后的抗蚀剂膜显影的显影处理以及通过使用抗蚀剂蚀刻氧化膜的蚀刻工艺由显影过程形成的图案作为掩模。该系统包括：检查装置400，被配置为测量和检查在蚀刻处理之后形成的图案的状态;以及控制部分500，被配置为使用检查结果来设置用于第一加热处理和/或第二加热处理的条件从而在蚀刻处理之后使图案的状态在基板W的表面上均匀。

13. 发明申请

US20090047586A1 SUBSTRATE-PROCESSING APPARATUS, SUBSTRATE-PROCESSING METHOD, SUBSTRATE-PROCESSING PROGRAM, AND COMPUTER-READABLE RECORDING MEDIUM RECORDED WITH SUCH PROGRAM 有权
标题翻译：基板处理设备，基板处理方法，基板处理程序以及使用此程序记录的计算机可读记录介质
公开(公告)号：US20090047586A1
公开(公告)日：2009-02-19
申请号：US12065809
申请日：2006-09-13
申请人： Kunie Ogata , Hiroshi Tomita , Michio Tanaka , Ryoichi Uemura
发明人： Kunie Ogata , Hiroshi Tomita , Michio Tanaka , Ryoichi Uemura
IPC分类号： G03F7/20 , G03B27/32
CPC分类号： G03F7/40
摘要： A pattern forming system 1 is configured to execute a series of processes, which includes a first heat process for performing a heat process on a substrate W after a resist liquid coating process, a light exposure process for performing light exposure on a resist film in accordance with a predetermined pattern, a second heat process for promoting a chemical reaction in the resist film after the light exposure, a developing process for developing the resist film after the light exposure, and an etching process for etching an oxide film by use of a resist pattern formed by the developing process as a mask. The system includes a checking apparatus 400 configured to measure and check a state of a pattern formed after the etching process, and a control section 500 configured to use a check result to set a condition for the first heat process and/or the second heat process so as to cause the state of the pattern to be uniform on a surface of the substrate W after the etching process.
摘要翻译：图案形成系统1被配置为执行一系列处理，其包括在抗蚀剂液体涂覆处理之后在衬底W上执行热处理的第一热处理，用于在抗蚀剂膜上进行曝光的曝光工艺具有预定图案，用于促进曝光后的抗蚀剂膜中的化学反应的第二热处理，曝光后的抗蚀剂膜显影的显影处理以及通过使用抗蚀剂蚀刻氧化膜的蚀刻工艺由显影过程形成的图案作为掩模。该系统包括：检查装置400，被配置为测量和检查在蚀刻处理之后形成的图案的状态;以及控制部分500，被配置为使用检查结果来设置用于第一加热处理和/或第二加热处理的条件从而在蚀刻处理之后使图案的状态在基板W的表面上均匀。

14. 发明授权

US06281962B1 Processing apparatus for coating substrate with resist and developing exposed resist including inspection equipment for inspecting substrate and processing method thereof 有权
标题翻译：用抗蚀剂涂布基材的处理装置和显影曝光抗蚀剂，包括用于检查基板的检查设备及其加工方法
公开(公告)号：US06281962B1
公开(公告)日：2001-08-28
申请号：US09465681
申请日：1999-12-17
申请人： Kunie Ogata , Koki Nishimuko
发明人： Kunie Ogata , Koki Nishimuko
IPC分类号： G03B2732
CPC分类号： H01L21/67178 , G03F7/7065 , G03F7/7075 , H01L21/6715 , H01L21/67271
摘要： Inspection equipment for detecting defects in a wafer is provided in a coating and developing system including a plurality of kinds of processing units for performing processing necessary for coating a wafer with a resist and processing necessary for developing the resist on the wafer. The transfer of the wafer between the processing units and the inspection equipment is performed by means of a main transfer device. The inspection equipment sends an inspection result as a detection signal to a controller, and the controller which receives the detection signal controls exposure conditions for an aligner according to the presence or absence of defects and adjusts a frequency regulating mechanism to control inspection frequency. The wafer is transferred between the processing units and the inspection equipment by the main transfer device, whereby the wafer is not artificially contaminated.
摘要翻译：用于检测晶片缺陷的检查设备设置在涂覆和显影系统中，该涂覆和显影系统包括用于进行用抗蚀剂涂覆晶片所需的处理的多种处理单元和在晶片上显影抗蚀剂所需的处理。在处理单元和检查设备之间的晶片传送通过主传送装置进行。检查设备将检测结果作为检测信号发送给控制器，接收检测信号的控制器根据有无缺陷来控制对准器的曝光条件，并调整频率调节机构以控制检查频率。晶片通过主转印装置在处理单元和检查设备之间转移，由此晶片不被人为地污染。

15. 发明授权

US07031792B2 Processing apparatus and information storage apparatus and method 有权
公开(公告)号：US07031792B2
公开(公告)日：2006-04-18
申请号：US10114248
申请日：2002-04-03
申请人： Yuji Yoshimoto , Ryouichi Uemura , Kunie Ogata , Yoichi Deguchi
发明人： Yuji Yoshimoto , Ryouichi Uemura , Kunie Ogata , Yoichi Deguchi
IPC分类号： G06F19/00 , H01L21/30
CPC分类号： G11C29/006
摘要： A processing apparatus comprises a process apparatus body equipped with a plurality of process sections for applying a predetermined processing to a target object and a transfer device for transferring the target object among the process sections, a first control section for controlling the entire process apparatus body including the transfer device, a second control section for controlling the plural process sections, an information storage section receiving the signal exchanged between the first control section and the second control section and storing a plurality of information including the information corresponding to the received signal, and an information storage selecting mechanism for selecting the storing frequency of the information to the information storage section in accordance with the kind of the information.

16. 发明授权

US06990380B2 Substrate processing apparatus and information storage apparatus and method 失效
公开(公告)号：US06990380B2
公开(公告)日：2006-01-24
申请号：US10023898
申请日：2001-12-21
申请人： Yuji Yoshimoto , Ryouichi Uemura , Kunie Ogata , Yoichi Deguchi
发明人： Yuji Yoshimoto , Ryouichi Uemura , Kunie Ogata , Yoichi Deguchi
IPC分类号： G05B11/01
CPC分类号： H01L21/67276 , G05B23/0264 , G05B2219/45031
摘要： An object of the present invention is to grasp easily a process history of a target object such as a semiconductor wafer. The processing apparatus of the present invention includes: a processing apparatus body which includes a plurality of process units for executing a prescribed process to a target object, and transport mechanism for transporting said target object between the process units; a first controller for controlling the processing apparatus as a whole; a second controller for controlling the process units; an information storage section for taking in a signal transmitted and received between the first and second controllers; and a host computer for monitoring operation states of the process units. The present invention is extended to a processing system including a plurality of the processing apparatuses connected with a host computer which is further connected with a monitor computer through a communication network.

17. 发明授权

US06457882B2 Substrate processing method and substrate processing apparatus 失效
标题翻译：基板处理方法和基板处理装置
公开(公告)号：US06457882B2
公开(公告)日：2002-10-01
申请号：US09803966
申请日：2001-03-13
申请人： Kunie Ogata , Ryouichi Uemura , Masanori Tateyama , Yoshiyuki Nakajima
发明人： Kunie Ogata , Ryouichi Uemura , Masanori Tateyama , Yoshiyuki Nakajima
IPC分类号： G03D500
CPC分类号： G03F7/168 , G03F7/162
摘要： A substrate processing method for forming a resist film on a wafer with a base film being formed, and performing an exposure processing and a developing processing for the resist film to thereby form a desired resist pattern, has a base reflected light analyzing step of radiating a light of the same wavelength as an exposure light radiated during the exposure processing to the base film and analyzing a reflected light, before forming the resist film, and a processing condition control step of controlling at least one of a resist film forming condition and an exposure processing condition, based on the analysis of the reflected light. The method makes it possible to control a line width of a resist pattern with high precision.
摘要翻译：一种用于在形成基膜的晶片上形成抗蚀剂膜的基板处理方法，并且对抗蚀剂膜进行曝光处理和显影处理从而形成所需的抗蚀剂图案，具有基底反射光分析步骤，在形成抗蚀剂膜之前，将与曝光处理期间所辐照的曝光光相同的波长的光和形成抗蚀剂膜的反射光进行分析，以及处理条件控制步骤，其控制抗蚀剂膜形成条件和曝光中的至少一种处理条件，基于反射光的分析。该方法可以高精度地控制抗蚀剂图案的线宽。

18. 发明授权

US07968825B2 Temperature setting method of thermal processing plate, computer-readable recording medium recording program thereon, and temperature setting apparatus for thermal processing plate 有权
标题翻译：热处理板的温度设定方法，其上的计算机可读记录介质记录程序和用于热处理板的温度设定装置
公开(公告)号：US07968825B2
公开(公告)日：2011-06-28
申请号：US11926808
申请日：2007-10-29
申请人： Megumi Jyousaka , Shinichi Shinozuka , Kunie Ogata
发明人： Megumi Jyousaka , Shinichi Shinozuka , Kunie Ogata
IPC分类号： H05B3/68 , G03D5/00
CPC分类号： H01L21/67248
摘要： A thermal plate of a heating unit is divided into a plurality of thermal plate regions, and a temperature can be set for each of the thermal plate regions. A temperature correction value for adjusting a temperature within the thermal plate can be set for each of the thermal plate regions of the thermal plate. The line widths within the substrate which has been subjected to a photolithography process are measured, and an in-plane tendency of the measured line widths is decomposed into a plurality of in-plane tendency components using a Zernike polynomial. From the calculated plurality of in-plane tendency components, in-plane tendency components improvable by changing the temperature correction values are extracted and added together to calculate an improvable in-plane tendency of the measured line widths within the substrate. The change of setting of the temperature correction value for each of the thermal plate regions of the thermal plate is performed only when the magnitude of the improvable in-plane tendency exceeds a threshold value set in advance.
摘要翻译：加热单元的热板被分成多个热板区域，并且可以为每个热板区域设定温度。可以对热板的每个热板区域设定用于调节热板内的温度的温度校正值。测量经过光刻处理的衬底内的线宽，并且使用Zernike多项式将所测量的线宽的面内趋势分解成多个面内趋势分量。从计算出的多个面内趋势分量中，提取通过改变温度校正值而改善的面内趋势分量并将其相加在一起，以计算衬底内测量的线宽的可改进的面内趋势。只有当可提升的平面内趋势的大小超过预先设定的阈值时，才进行热板的每个热板区域的温度校正值的设定的变化。

19. 发明授权

US06713120B2 Substrate processing system and substrate processing method 有权
标题翻译：基板加工系统和基板加工方法
公开(公告)号：US06713120B2
公开(公告)日：2004-03-30
申请号：US10186678
申请日：2002-07-02
申请人： Yuji Fukuda , Kunie Ogata
发明人： Yuji Fukuda , Kunie Ogata
IPC分类号： B05D300
CPC分类号： H01L21/67253 , G03F7/162 , H01L21/6715 , H01L21/681
摘要： A coating unit for coating a substrate with a treatment solution and a peripheral aligner, which has a mounting table rotatable and movable in at least one direction and irradiates the peripheral portion of the substrate on the mounting table with light from an irradiating portion to expose a coating film on the substrate, are provided in a substrate processing system. The peripheral aligner has film thickness measuring means provided with a sensor member for measuring a film thickness of the coating film. It is not necessary to separately provide a unit for measuring the film thickness outside of the system, thus preventing the substrate from being contaminated or dropped to be damaged when the film thickness is measured.
摘要翻译：一种涂布单元，用于用处理溶液和周边对准器涂覆基板，其具有可旋转并可在至少一个方向上移动的安装台，并且利用来自照射部分的光将基板的周边部分照射到安装台上以暴露在基板处理系统中设置涂布膜。外围校准器具有设置有用于测量涂膜的膜厚度的传感器构件的膜厚测量装置。不必单独提供用于测量系统外部的膜厚度的单元，从而防止当测量膜厚度时基板被污染或掉落而损坏。

20. 发明授权

US06394670B2 Parts maintenance managing system 有权
标题翻译：零件维修管理系统
公开(公告)号：US06394670B2
公开(公告)日：2002-05-28
申请号：US09853748
申请日：2001-05-14
申请人： Kunie Ogata , Takashi Aiuchi , Masanori Tateyama
发明人： Kunie Ogata , Takashi Aiuchi , Masanori Tateyama
IPC分类号： G03D500
CPC分类号： G03F7/70525 , G03F7/70975
摘要： A system comprises a first maintenance interval storage for storing a first maintenance interval of each component which is not related to an actual utilization of an apparatus, a second maintenance interval storage storing a second maintenance interval of each component which is related to the actual utilization of the apparatus, a maintenance demander for demanding maintenance of some component based on the passing of the first maintenance interval of this component; and a maintenance interval prolonger for judging the second maintenance interval has passed or not based on the passing of the first maintenance interval, and when the second maintenance interval has not yet passed, suspending the demand for maintenance by the maintenance demander and prolonging the first maintenance interval. Consequently, it becomes possible to manage a maintenance timing of each component and give notice thereof on the side of the apparatus composed of a plurality of components.
摘要翻译：一种系统，包括：第一维护间隔存储器，用于存储与设备的实际利用无关的每个组件的第一维护间隔;存储与每个组件的实际使用相关的每个组件的第二维护间隔的第二维护间隔存储该装置是基于该部件的第一维护间隔的通过而要求维护一些部件的维护需求者; 并且用于判断第二维护间隔的维护间隔延长器是否已经通过了第一维护间隔的通过，并且当第二维护间隔还没有通过时，暂停维护需求者的维护需求并延长了第一维护间隔间隔。因此，可以管理每个部件的维护定时，并且在由多个部件组成的装置的侧面通知它。

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