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11. 发明授权

US4166312A Apparatus for re-forming an axial lead of an electronic component into U-shape and affixing said component to elongated support tape 失效
标题翻译：用于将电子部件的轴向引线重新形成U形并将所述部件固定到细长支撑带的装置
公开(公告)号：US4166312A
公开(公告)日：1979-09-04
申请号：US833945
申请日：1977-09-16
申请人： Kotaro Harigane , Akihiro Kato , Kenji Fujita
发明人： Kotaro Harigane , Akihiro Kato , Kenji Fujita
IPC分类号： H05K13/00 , H05K13/02 , B23P23/04 , B21D1/00 , B21D1/04
CPC分类号： H05K13/003 , H05K13/023 , Y10T29/513 , Y10T29/5137 , Y10T29/5145 , Y10T29/5148 , Y10T83/4473
摘要： An apparatus re-forms the axial lead of an axial-lead type electronic component into the shape of a U and affixes the electronic components with U-shaped leads to a support tape so as to form a continuous web-carrier carrying a series of electronic components each with a U-shaped lead. The apparatus feeds the electronic component one-by-one to a transfer assembly which transfers the components to a re-forming position and an affixing position in sequence. Means for forming a kink in a lead of each component and for removing excess lead wire are also provided.
摘要翻译：一种装置将轴向引线型电子元件的轴向引线重新形成为U形，并将电子元件与U形导线固定在支撑带上，以便形成一个连续的载具一系列电子组件各有一个U形铅。该装置将电子部件一个一个地馈送到传送组件，该传送组件将部件依次传送到重新形成位置和固定位置。还提供了用于在每个部件的引线中形成扭结并用于移除多余引线的装置。

12. 发明授权

US4593462A Apparatus for automatically mounting chip-type circuit elements on substrate 失效
标题翻译：用于将芯片型电路元件自动安装在基板上的装置
公开(公告)号：US4593462A
公开(公告)日：1986-06-10
申请号：US751034
申请日：1985-07-01
申请人： Hiroshi Yagi , Hisashi Fujita , Kotaro Harigane
发明人： Hiroshi Yagi , Hisashi Fujita , Kotaro Harigane
IPC分类号： H01L21/683 , H05K13/04 , H05K3/00 , H05K1/00 , H05K3/30
CPC分类号： H05K13/0413 , H01L21/6838 , H05K13/0417 , Y10T29/49004 , Y10T29/4913 , Y10T29/53178 , Y10T29/53183
摘要： An apparatus for automatically mounting chip-type circuit elements on a substrate for a printed circuit board is disclosed which is capable of overcoming the problem of suction failure and wrong posture of a circuit element to efficiently carry out the mounting operation of the elements on a substrate. The automatic mounting apparatus includes a detecting device for detecting a defect such as a failure in suction of a circuit element by a mounting head and/or the wrong posture of a circuit element sucked up and a rotating disk controllably actuated to allow a mounting head other than that relating to the defect to suck up a circuit element of the same kind from tape feeders and mount it on the substrate after the detecting device detects the defect.
摘要翻译：公开了一种用于将芯片型电路元件自动安装在用于印刷电路板的基板上的装置，其能够克服电路元件的抽吸故障和错误姿态的问题，以有效地执行元件在基板上的安装操作。该自动安装装置包括检测装置，用于检测由安装头引起的电路元件的吸入不良和/或被吸入的电路元件的错误姿势以及可控地致动的旋转盘等缺陷，从而允许其他安装头比与从带式进料器吸出同一种类的电路元件的缺陷有关，并且在检测装置检测到缺陷之后将其安装在基板上。

13. 发明授权

US4569550A Apparatus for automatically mounting electronic circuit element on printed circuit board 失效
标题翻译：电子电路元件自动安装在印刷电路板上的装置
公开(公告)号：US4569550A
公开(公告)日：1986-02-11
申请号：US621532
申请日：1984-06-18
申请人： Kotaro Harigane , Tomokazu Takahashi
发明人： Kotaro Harigane , Tomokazu Takahashi
IPC分类号： H05K13/04
CPC分类号： H05K13/0404 , Y10T29/53183
摘要： An apparatus for automatically mounting an electronic circuit element on a printed circuit board which is capable of dealing with an electronic circuit element having two lead wires of the large interval, that having two lead wires of the small interval, and that having three lead wires. The apparatus includes a mechanism for holding and transferring an electronic circuit element to a printed circuit board which comprises a fixed pawl formed with a central recess and a pair of side steps, and a pair of movable pawls openable with respect to the fixed pawl wherein the movable pawls are adapted to be in cooperation with the fixed pawl to securely interpose lead wires of an electronic circuit element positioned in the central recess and one of the side steps between one of the movable pawls and the fixed pawl. The apparatus also includes a mechanism for guiding an electronic circuit element to a printed circuit board which comprises a central guide member formed with a central recess and a pair of side recesses, a pair of outer support member openable with respect to the central guide member and an inner support member openable with respect to the central guide member.
摘要翻译：一种用于将电子电路元件自动安装在印刷电路板上的装置，该印刷电路板能够处理具有两个间隔大的引线的具有两个小间隔的引线的电子电路元件，并具有三根引线。该装置包括用于将电子电路元件保持和传送到印刷电路板的机构，该印刷电路板包括形成有中心凹部和一对侧台阶的固定棘爪以及可相对于固定棘爪打开的一对可动爪，可动棘爪适于与固定棘爪配合，以牢固地插入定位在中央凹部中的电子电路元件的引线和一个可动爪与固定爪之间的一个侧台。该装置还包括用于将电子电路元件引导到印刷电路板的机构，该印刷电路板包括形成有中心凹部和一对侧凹部的中央引导构件，一对相对于中心引导构件可开启的外部支撑构件，以及相对于所述中心引导构件可打开的内部支撑构件。

14. 发明授权

US4520557A Apparatus for mounting chip type circuit elements on printed circuit boards 失效
标题翻译：芯片型电路元件安装在印刷电路板上的装置
公开(公告)号：US4520557A
公开(公告)日：1985-06-04
申请号：US409184
申请日：1982-08-18
申请人： Kotaro Harigane , Shuichi Tando , Kenichi Takahashi , Hirokazu Shudo
发明人： Kotaro Harigane , Shuichi Tando , Kenichi Takahashi , Hirokazu Shudo
IPC分类号： H05K13/04 , H05K3/30
CPC分类号： H05K13/0404 , H05K13/0452 , Y10T29/49144 , Y10T29/53178 , Y10T29/53261
摘要： Apparatus for mounting chip type circuit elements on printed circuit boards in one-by-one fashion with increased speed and precision includes a supply unit adapted to supply chip type circuit elements, a plurality of pallets conveyed in an intermittent fashion, a first shifting member adapted to shift the chip type circuit elements from the supply unit onto the pallet, an X-Y table adapted to support a printed circuit board, a mounting mechanism having mounting heads associated therewith for mounting the chip type circuit elements on the printed circuit board supported by the X-Y table and a second shifting member adapted to shift the chip type circuit elements from the pallet to the mounting heads where they are received and positively gripped for subsequent mounting onto the printed circuit board.
摘要翻译：用于以增加的速度和精度以一个一个方式将芯片型电路元件安装在印刷电路板上的装置包括适于提供芯片型电路元件的供应单元，以间歇方式输送的多个托盘，适于将芯片型电路元件从供电单元移动到托盘上，XY台适于支撑印刷电路板，安装机构具有与其相关的安装头，用于将芯片型电路元件安装在由XY支撑的印刷电路板上工作台和第二移动构件，其适于将芯片型电路元件从托盘移动到安装头，在那里它们被接收并被牢固地夹持以便随后安装到印刷电路板上。

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