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11. 发明授权

US08382527B2 Connector enabling increased density of contacts 有权
公开(公告)号：US08382527B2
公开(公告)日：2013-02-26
申请号：US12924123
申请日：2010-09-21
申请人： Masafumi Okada , Hiroshi Akimoto
发明人： Masafumi Okada , Hiroshi Akimoto
IPC分类号： H01R24/00
CPC分类号： B29C45/00 , B29L2031/3406 , H01R12/57 , H01R12/737
摘要： A plurality of contacts are arranged in a first direction along a side wall of a housing. The housing has a plurality of ribs projecting in a second direction from the side wall and interposed between the contacts, respectively. Each rib has a tapered portion adjacent to the side wall.

12. 发明申请

US20120177776A1 MOLD FOR INJECTION MOLDING, AND INJECTION MOLDING METHOD, INJECTION-MOLDED ARTICLE, AND INJECTION MOLDING MACHINE USING THE MOLD FOR INJECTION MOLDING 有权
标题翻译：注塑成型用模具，注塑成型方法，注塑件，注塑成型机，模具注塑成型
公开(公告)号：US20120177776A1
公开(公告)日：2012-07-12
申请号：US13280958
申请日：2011-10-25
申请人： Yohei KIMITA , Masafumi Okada , Hiroshi Akimoto
发明人： Yohei KIMITA , Masafumi Okada , Hiroshi Akimoto
IPC分类号： B29C45/14 , B29C45/64 , B29C45/00
CPC分类号： B29C33/44 , B29C33/10
摘要： The pin mounting hole used to insert and mount the pin member having a pin-like shape is formed on, among the inner wall surfaces of the cavity, the second side-wall surface that is an inner wall surface other than the inner wall surfaces perpendicular to the mold-removal direction of the injection-molded article. On the second side-wall surface, the protruding portion protruding from the second side-wall surface is formed in the surface area located on the opposite side in the mold-removal direction with respect to the pin mounting hole.
摘要翻译：用于插入和安装具有销状形状的销构件的销安装孔形成在空腔的内壁表面之中的作为内壁表面的第二侧壁表面，内壁表面不是垂直于内壁表面到注塑制品的脱模方向。在第二侧壁面上，从与第二侧壁面突出的突出部相对于销安装孔形成在脱模方向相反一侧的表面区域。

13. 发明授权

US06343867B1 Spread illuminating apparatus 失效
标题翻译：展示照明装置
公开(公告)号：US06343867B1
公开(公告)日：2002-02-05
申请号：US09502785
申请日：2000-02-11
申请人： Shingo Suzuki , Masafumi Okada , Koichi Toyoda
发明人： Shingo Suzuki , Masafumi Okada , Koichi Toyoda
IPC分类号： F21V700
CPC分类号： G02B6/0036 , G02B6/0028 , G02B6/0038 , G02B6/0043
摘要： At one end of the spread body 1, two light conductive members 2A, 2B on one part of which optical path conversion means 4 are formed are disposed in line with the spread body 1 and each optical path conversion means 4 of the light conductive members 2A, 2B is, when seeing perpendicularly to the spread body 1, disposed alternately with each other. Since each optical path conversion means 4 of the light conductive members 2A, 2B is not impeded with other optical path conversion means 4, illumination is carried out effectively.
摘要翻译：在展开体1的一端，形成有一部分光路转换装置4的两个导光构件2A，2B与扩散体1和导光构件2A的每个光路转换装置4成一直线 2B当垂直于展开体1观察时彼此交替设置。由于导光部件2A，2B的每个光路转换装置4不被其它光路转换装置4阻挡，所以有效地进行照明。

14. 发明授权

US06293683B1 Spread illuminating apparatus 失效
标题翻译：展示照明装置
公开(公告)号：US06293683B1
公开(公告)日：2001-09-25
申请号：US09459896
申请日：1999-12-14
申请人： Masafumi Okada
发明人： Masafumi Okada
IPC分类号： F21V700
CPC分类号： G02B6/0028 , F21V7/00 , F21Y2115/10 , G02B6/0038
摘要： In a spread illuminating apparatus wherein on one end of a transparent substrate, a light conductive member 3 on one portion of which a prism shape portion 3a is provided, light emitted from the light conductive member 3 enters the transparent substrate, the length of the light conductive member is set larger than the width dimension of the transparent substrate 2 with which the light conductive member 3 is disposed parallel each other, the end of the light conductive member to which the light emitting diode is positioned is projected from the width end of the transparent substrate 2.
摘要翻译：在透明基板的一端的扩散照明装置中，在其一部分上设置有棱镜形状部分3a的导光部件3，从导光部件3射出的光进入透明基板，光的长度导电部件被设定为大于透光基板2的宽度尺寸，导光部件3通过该宽度尺寸彼此平行配置，发光二极管所在的导光部件的端部从宽度端部突出透明基板2。

15. 发明授权

US07273488B2 High-rigidity forceps tip assembly for active forceps and active forceps equipped with the same 失效
标题翻译：用于活动镊子的高刚性镊子头组件和配备有活镊子的活动镊子
公开(公告)号：US07273488B2
公开(公告)日：2007-09-25
申请号：US10455355
申请日：2003-06-06
申请人： Yoshihiko Nakamura , Masafumi Okada , Shingo Chiyoda
发明人： Yoshihiko Nakamura , Masafumi Okada , Shingo Chiyoda
IPC分类号： B25J17/02 , A61B17/28
CPC分类号： A61B34/70 , A61B2017/2927 , A61B2034/304 , Y10T74/20329 , Y10T74/20335
摘要： Provided is a forceps tip assembly capable of supporting a forceps tip with high rigidity in order to realize a laparoscopic surgery requiring a significant power with the forceps tip, such as an organ removal surgery which has been heretofore difficult to be performed by a robot for medical use. The forceps tip assembly includes: a forceps tip supporting member which has a supporting part for supporting a forceps tip and three leg parts which are disposed at even intervals in a circumferential direction around a central axis line C1 and fixed to the supporting part so as to protrude backward from the supporting part; and three back-and-forth moving members which are disposed at even intervals in a circumferential direction around a predetermined central axis line C2 extending in a front-to-rear direction, which have their front end portions coupled with the three leg pads swingably and slidably in a direction orthogonal to the predetermined central axis line C2 and which are mutually coupled together as relatively movable in the extending direction of central axis line C2.
摘要翻译：提供了能够以高刚性支撑镊子尖端的钳子尖端组件，以便实现需要镊子尖端的显着功率的腹腔镜手术，例如迄今为止难以由机器人进行医疗的器官移除手术使用。镊子尖端组件包括：钳子尖端支撑构件，其具有用于支撑钳子尖端的支撑部分和三个腿部部件，其围绕中心轴线C 1在圆周方向上以均匀间隔设置并固定到支撑部分，以便从支撑部向后方突出; 以及三个前后移动构件，其围绕围绕前后方向延伸的预定中心轴线C 2沿圆周方向以均匀间隔设置，其前端部与三个脚垫可摆动地连接并且在与预定的中心轴线C 2正交的方向上可滑动地相互耦合在一起，可在中心轴线C 2的延伸方向上相对移动。

16. 发明申请

US20060292354A1 Wiring substrate 失效
标题翻译：接线基板
公开(公告)号：US20060292354A1
公开(公告)日：2006-12-28
申请号：US11454412
申请日：2006-06-16
申请人： Takuya Miyashita , Masafumi Okada , Kenji Matsumoto
发明人： Takuya Miyashita , Masafumi Okada , Kenji Matsumoto
IPC分类号： B32B3/00
CPC分类号： H05K3/282 , H05K3/325 , H05K2201/0162 , H05K2201/0179 , Y10T428/24917 , Y10T428/31681
摘要： In a wiring substrate having a metal wiring pattern that is formed on a substrate and includes a contact portion for providing connection to an external element, an organic thin film containing silane is formed to cover the metal wiring pattern and the contact portion is electrically connected to the external element through the organic thing film. Unlike conventional wiring substrates in which a contact portion is uncovered by ripping open or cutting away a protective resin film formed on the contact portion, the wiring substrate can be electrically connected with an external element having a low contact pressure, for example.
摘要翻译：在具有形成在基板上并且包括用于提供与外部元件的连接的接触部分的金属布线图案的布线基板中，形成含有硅烷的有机薄膜以覆盖金属布线图案，并且该接触部分电连接到外部元素通过有机物膜。与通过撕开或切除形成在接触部分上的保护树脂膜不接触接触部分的传统布线基板不同，布线基板可以例如与具有低接触压力的外部元件电连接。

17. 发明授权

US06375336B1 Spread illumination apparatus 失效
标题翻译：传播照明设备
公开(公告)号：US06375336B1
公开(公告)日：2002-04-23
申请号：US09450779
申请日：1999-11-30
申请人： Shingo Suzuki , Masafumi Okada , Koichi Toyoda
发明人： Shingo Suzuki , Masafumi Okada , Koichi Toyoda
IPC分类号： F21V704
CPC分类号： G02B6/0038
摘要： The invention describes a light reflection pattern to spread the volume of the emitted light from a bar-like light source with a plurality of grooves provided along a transparent substrate and plane portions adjacent to the grooves. By setting the inclined angle of the grooves along the transparent substrate the light is introduced with a high efficiency to a liquid crystal display device in the direction perpendicular to the substrate. By restricting the ratio of the width of the grooves to the pitch that is the occupied area in the range of 0.01-0.15 (preferably 0.01-0.1) the ratio becomes one in which the duplicate image component is not recognized by the naked eyes while image brightness is maintained.
摘要翻译：本发明描述了一种光反射图案，用于将具有沿着透明基板设置的多个凹槽和与凹槽相邻的平面部分的棒状光源的发射光的体积扩展。通过沿着透明基板设置凹槽的倾斜角度，在与基板垂直的方向上将液体高效率地引入液晶显示装置。通过将凹槽的宽度与占据面积的间距限制在0.01-0.15（优选为0.01-0.1）的范围内，该比率成为其中双重图像分量不能被肉眼识别的比例，而图像保持亮度。

18. 发明申请

US20110092110A1 Connector enabling increased density of contacts 有权
标题翻译：连接器可以提高触点密度
公开(公告)号：US20110092110A1
公开(公告)日：2011-04-21
申请号：US12924123
申请日：2010-09-21
申请人： Masafumi Okada , Hiroshi Akimoto
发明人： Masafumi Okada , Hiroshi Akimoto
IPC分类号： H01R24/00
CPC分类号： B29C45/00 , B29L2031/3406 , H01R12/57 , H01R12/737
摘要： A plurality of contacts are arranged in a first direction along a side wall of a housing. The housing has a plurality of ribs projecting in a second direction from the side wall and interposed between the contacts, respectively. Each rib has a tapered portion adjacent to the side wall.
摘要翻译：沿着壳体的侧壁沿第一方向布置多个触点。壳体具有从侧壁沿第二方向突出并分别插入在触头之间的多个肋。每个肋具有与侧壁相邻的锥形部分。

19. 发明申请

US20080196798A1 Surface modification method for conductive metal material 审中-公开
标题翻译：导电金属材料表面改性方法
公开(公告)号：US20080196798A1
公开(公告)日：2008-08-21
申请号：US12148345
申请日：2008-04-17
申请人： Ryoji Kaku , Masafumi Okada
发明人： Ryoji Kaku , Masafumi Okada
IPC分类号： C22C45/00
CPC分类号： C21D7/00 , B24B39/006 , C21D7/06 , Y10T29/479 , Y10T428/12993
摘要： Spherical particles having curvatures larger than those of irregularities, crystal grain boundaries, lattice defects or the like (referred to collectively as irregularities, hereinafter) on the surface of a conductive metal material are ejected at high speeds to make the particles collide against the surface of the conductive metal material, thereby repeatedly causing rapid melting and cooling at the minute points of impact of the particles, thereby changing the surface into amorphous. Then, spherical particles having curvatures smaller than those of irregularities on the surface subjected to the treatment described above collide against the surface, thereby changing the surface into amorphous and planarizing the surface.
摘要翻译：导电性金属材料表面上的曲率大于不规则性，晶界，晶格缺陷等（以下统称为凹凸）的球状颗粒以高速喷射，使颗粒与导电金属材料，从而在颗粒的微小碰撞点反复引起快速熔化和冷却，从而将表面变为无定形。然后，具有小于经过上述处理的表面上的凹凸的曲率的球形颗粒与表面碰撞，从而将表面变为非晶体并使表面平坦化。

20. 发明授权

US07396591B2 Wiring substrate 失效
标题翻译：接线基板
公开(公告)号：US07396591B2
公开(公告)日：2008-07-08
申请号：US11454412
申请日：2006-06-16
申请人： Takuya Miyashita , Masafumi Okada , Kenji Matsumoto
发明人： Takuya Miyashita , Masafumi Okada , Kenji Matsumoto
IPC分类号： B32B3/00
CPC分类号： H05K3/282 , H05K3/325 , H05K2201/0162 , H05K2201/0179 , Y10T428/24917 , Y10T428/31681
摘要： In a wiring substrate having a metal wiring pattern that is formed on a substrate and includes a contact portion for providing connection to an external element, an organic thin film containing silane is formed to cover the metal wiring pattern and the contact portion is electrically connected to the external element through the organic thing film. Unlike conventional wiring substrates in which a contact portion is uncovered by ripping open or cutting away a protective resin film formed on the contact portion, the wiring substrate can be electrically connected with an external element having a low contact pressure, for example.
摘要翻译：在具有形成在基板上并且包括用于提供与外部元件的连接的接触部分的金属布线图案的布线基板中，形成含有硅烷的有机薄膜以覆盖金属布线图案，并且该接触部分电连接到外部元素通过有机物膜。与通过撕开或切除形成在接触部分上的保护树脂膜不接触接触部分的传统布线基板不同，布线基板可以例如与具有低接触压力的外部元件电连接。

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