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11. 发明授权

US5959351A Liquid-cooled electronic device 失效
标题翻译：液冷电子设备
公开(公告)号：US5959351A
公开(公告)日：1999-09-28
申请号：US103227
申请日：1993-08-09
申请人： Shigeyuki Sasaki , Tadakatsu Nakajima , Noriyuki Ashiwake , Yasuo Ohsone , Toshio Hatada , Toshiki Iino , Akio Idei , Kenichi Kasai
发明人： Shigeyuki Sasaki , Tadakatsu Nakajima , Noriyuki Ashiwake , Yasuo Ohsone , Toshio Hatada , Toshiki Iino , Akio Idei , Kenichi Kasai
IPC分类号： H01L23/44 , F15D1/08 , H01L23/427 , H01L23/473 , H01L23/34
CPC分类号： F15D1/08 , H01L23/473 , F28F13/02 , H01L2924/0002
摘要： There is disclosed a liquid-cooled electronic device. Semiconductor devices are mounted on a substrate of a semiconductor module immersed in a cooling liquid. A wire-like member is provided in the vicinity of a cooling medium ejection port of each cooling medium supply member which cools a respective one of the semiconductor devices by a jet of the cooling liquid. With this arrangement, the flow of the cooling liquid downstream of the wire-like member is disturbed to promote the boiling over the entire surface of the semiconductor device, and when the semiconductor device is to be cooled, a transient temperature rise is reduced at the time of starting the energization of the semiconductor device, thereby stabilizing the temperature of the semiconductor device.
摘要翻译：公开了一种液冷电子装置。半导体器件安装在浸没在冷却液中的半导体模块的衬底上。在各冷却介质供给部件的冷却介质喷出口附近设置有线状部件，冷却介质供给部件通过冷却液喷射冷却各个半导体器件。通过这种布置，线状构件下游的冷却液的流动受到干扰，促使半导体装置的整个表面沸腾，并且当半导体装置被冷却时，瞬态温度上升在开始半导体器件通电的时间，从而稳定半导体器件的温度。

12. 发明授权

US5844311A Multichip module with heat sink and attachment means 失效
标题翻译：具有散热器和连接装置的多芯片模块
公开(公告)号：US5844311A
公开(公告)日：1998-12-01
申请号：US972034
申请日：1997-11-17
申请人： Hideki Watanabe , Kenichi Kasai , Tositada Netsu , Hiroyuki Hidaka , Osamu Yamada , Mitsunori Tamura
发明人： Hideki Watanabe , Kenichi Kasai , Tositada Netsu , Hiroyuki Hidaka , Osamu Yamada , Mitsunori Tamura
IPC分类号： H01L23/36 , H01L23/433 , H01L23/473 , H01L23/34
CPC分类号： H01L23/433 , H01L23/4338 , H01L2224/16 , H01L2224/73253 , H01L2924/09701 , H01L2924/15312
摘要： There is disclosed a multichip module having a sealing-cooling structure which achieves a high packaging density, high sealing-connection reliability, a low manufacturing cost and a high cooling ability. A frame 15, conforming in thermal expansion coefficient to a substrate 11, is soldered at one surface thereof to that surface of the substrate 11 on which semiconductor devices 12 are mounted. The frame 15 is fastened or fixedly secured at the other surface thereof to a lid member 17 by bolts 10 or means without any heat treatment of the whole of the module.
摘要翻译：公开了一种具有密封冷却结构的多芯片组件，其具有高封装密度，高密封连接可靠性，低制造成本和高冷却能力。在基板11的一个表面上焊接符合热膨胀系数的基板11的框架15，在其上安装有半导体器件12的基板11的表面上。框架15通过螺栓10或装置固定或固定在其另一表面到盖构件17，而不对整个模块进行任何热处理。

13. 发明授权

US5751062A Cooling device of multi-chip module 失效
标题翻译：多芯片模块冷却装置
公开(公告)号：US5751062A
公开(公告)日：1998-05-12
申请号：US571711
申请日：1995-12-13
申请人： Takahiro Daikoku , Fumiyuki Kobayashi , Noriyuki Ashiwake , Kenichi Kasai , Keizou Kawamura , Akio Idei
发明人： Takahiro Daikoku , Fumiyuki Kobayashi , Noriyuki Ashiwake , Kenichi Kasai , Keizou Kawamura , Akio Idei
IPC分类号： H01L23/36 , H01L23/433 , H01L23/367
CPC分类号： H01L23/4338 , H01L2224/73253
摘要： A cooling device of a multi-chip module has micropackages that are independent of thermal deformation and easy to assembly and disassembly. The multi-chip module includes a multi-layer substrate on which the micropackages, each encasing an LSI chip, are mounted, and a housing formed integrally with a cooler. Each of the micropackages includes a first heat conduction member, having a cap portion for receiving the LSI chip and a first fin made of the same material as the cap portion to be integral therewith, and a substrate fixed to the cap portion of the first heat conduction member, the LSI chip being mounted on the substrate which is securely fixed to the cap portion of the heat conduction member while being fixedly joined at the back surface thereof to an inner surface of the cap portion of the first heat conduction member. Second heat conduction members, each including a base portion and a second fin, are disposed to engage with the first fins and be pressed against the cooler by a spring, respectively.
摘要翻译：多芯片模块的冷却装置具有独立于热变形和易于组装和拆卸的微封装。多芯片模块包括多层基板，其上安装有每个包装LSI芯片的微封装以及与冷却器一体形成的壳体。每个微封装包括第一导热构件，具有用于容纳LSI芯片的盖部分和与其一体形成的与盖部分相同的材料制成的第一鳍片，以及固定到第一热量帽盖部分的基板所述LSI芯片被安装在所述基板上，所述基板被牢固地固定到所述导热部件的盖部，同时在其背面牢固地接合到所述第一导热部件的盖部的内表面。每个包括基部和第二翅片的第二热传导构件设置成与第一翅片接合并且分别通过弹簧压靠在冷却器上。

14. 发明授权

US5743009A Method of making multi-pin connector 失效
标题翻译：制造多针连接器的方法
公开(公告)号：US5743009A
公开(公告)日：1998-04-28
申请号：US627459
申请日：1996-04-04
申请人： Kiyoshi Matsui , Takayuki Ono , Kenichi Kasai , Tsutomu Imai , Morio Suzuki , Hideyuki Fukasawa , Mitugu Shirai , Toshitaka Murakawa , Takeji Siokawa , Takeshi Kuroda
发明人： Kiyoshi Matsui , Takayuki Ono , Kenichi Kasai , Tsutomu Imai , Morio Suzuki , Hideyuki Fukasawa , Mitugu Shirai , Toshitaka Murakawa , Takeji Siokawa , Takeshi Kuroda
IPC分类号： H01R12/04 , H01R43/02 , H05K3/30 , H05K7/10 , H01R9/06
CPC分类号： H05K3/303 , H01R43/0256 , H05K7/1084 , H05K2201/09472 , H05K2201/10704 , H05K2203/0195 , H05K2203/167 , Y02P70/613 , Y10T29/49126 , Y10T29/49149
摘要： Ends of contact pins are inserted into bottomed connection holes which are in desired positions on a printed board, so that the contact pins are arrayed in the desired form. By effecting solder reflow in this state, the contact pins are fixedly soldered to the connection holes. A multi-pin connector is thus provided, which can be manufactured with ease in a short period of time and which can have any pitch, any number of pins and any shape.
摘要翻译：接触针的端部插入到印刷电路板上所需位置的有底连接孔中，使得接触针以期望的形式排列。通过在该状态下进行焊料回流，接触销固定地焊接到连接孔。因此提供了一种多针连接器，其可以在短时间内容易地制造，并且可以具有任何间距，任意数量的销和任何形状。

15. 发明授权

US08140129B2 Mobile phone terminal and communication system 有权
标题翻译：手机终端和通信系统
公开(公告)号：US08140129B2
公开(公告)日：2012-03-20
申请号：US12262625
申请日：2008-10-31
申请人： Katsuya Suzuki , Kuniharu Suzuki , Akira Ikeuchi , Yoshihide Majima , Hirotsugu Iijima , Kenichi Kasai , Takatoshi Itagaki
发明人： Katsuya Suzuki , Kuniharu Suzuki , Akira Ikeuchi , Yoshihide Majima , Hirotsugu Iijima , Kenichi Kasai , Takatoshi Itagaki
IPC分类号： H04B1/38
CPC分类号： H04W52/0283 , G01R31/3648 , H04M1/0262 , H04M1/72527 , H04W52/0261 , Y02D70/00
摘要： Disclosed is a mobile phone terminal with a battery pack containing a retraceable battery as power supply, and transmitting and receiving radio-signals to and from a mobile phone system base transceiver station. The mobile phone terminal includes a data communication terminal communicating data with the battery pack, an intermittent receiving processor periodically carrying out intermittent receiving processing via the base transceiver station when the mobile phone terminal is in a standby operation, and a battery status determining unit transmitting, while the intermittent receiving processor is carrying out intermittent receiving processing, an activating signal to the battery pack via the data communication terminal and reading battery status data from the activated battery pack.
摘要翻译：公开了具有电池组的移动电话终端，该电池组包含作为电源的可追溯电池，并且向移动电话系统基地收发台发送和接收无线电信号。移动电话终端包括与电池组通信数据的数据通信终端，当移动电话终端处于待机操作时，间歇接收处理器经由基站收发器周期性地执行间歇接收处理，以及电池状态确定单元，而间歇接收处理器正在进行间歇接收处理，经由数据通信终端向电池组发送激活信号，并从活化的电池组读取电池状态数据。

16. 发明授权

US08036717B2 Mobile phone terminal and charging system 有权
标题翻译：手机终端和充电系统
公开(公告)号：US08036717B2
公开(公告)日：2011-10-11
申请号：US12262727
申请日：2008-10-31
申请人： Katsuya Suzuki , Kuniharu Suzuki , Akira Ikeuchi , Yoshihide Majima , Hirotsugu Iijima , Kenichi Kasai , Takatoshi Itagaki
发明人： Katsuya Suzuki , Kuniharu Suzuki , Akira Ikeuchi , Yoshihide Majima , Hirotsugu Iijima , Kenichi Kasai , Takatoshi Itagaki
IPC分类号： H04M1/38
CPC分类号： H02J7/0091 , H02J2007/0096 , H02J2007/0098
摘要： Disclosed is a mobile terminal incorporating a battery pack utilized as power supply. The mobile terminal includes a positive terminal connected to a battery pack positive electrode, a negative terminal connected to a battery pack negative electrode, a data communication terminal communicating with a circuit in the battery pack, a charge control unit controlling charging of the battery pack via the positive terminal, and a reference voltage output unit outputting reference voltage. The terminal further includes a dividing resistor and a thermistor connected in series between the reference voltage output unit and the negative terminal, a temperature detector detecting temperature, and stopping charging of the battery pack based on the detected temperature, and a switching device controlling the voltage at the predetermined portion. The terminal still further includes a control unit communicating with the circuit in the battery pack via the data communication terminal, and changing the voltage at the predetermined portion when notified abnormality from the battery pack.
摘要翻译：公开了一种包含用作电源的电池组的移动终端。移动终端包括连接到电池组正极的正端子，连接到电池组负极的负端子，与电池组中的电路通信的数据通信终端，充电控制单元，控制电池组的充电，经由正极端子和输出参考电压的基准电压输出单元。端子还包括分压电阻和串联连接在基准电压输出单元和负端子之间的热敏电阻，温度检测器检测温度，以及基于检测到的温度停止对电池组的充电;以及控制电压的开关装置在预定部分。终端还包括控制单元，其经由数据通信终端与电池组中的电路通信，并且在从电池组通知异常时改变预定部分处的电压。

17. 发明申请

US20100175968A1 VIBRATING FEEDER, CARRYING DEVICE AND INSPECTION DEVICE 有权
标题翻译：振动给料器，携带装置和检查装置
公开(公告)号：US20100175968A1
公开(公告)日：2010-07-15
申请号：US12602304
申请日：2008-04-25
申请人： Motohiro Yagyu , Kenichi Kasai , Ken Sato , Jusuke Yasui , Akira Nagao , Tetsuhisa Ishida
发明人： Motohiro Yagyu , Kenichi Kasai , Ken Sato , Jusuke Yasui , Akira Nagao , Tetsuhisa Ishida
IPC分类号： B65G27/00
CPC分类号： G01N21/9508 , B65G27/02 , B65G47/1421 , G01N2021/845
摘要： A vibrating feeder provided with a feeder ball 14a having a circular bottom wall and a conveyance path formed along the periphery of the bottom wall 141a; a feeder body 16a supporting the feeder ball 14a so as to apply torsional vibration and conveying substance supplied on the bottom wall 141a along the conveyance path; and a main body supporting member for supporting the feeder body; the conveyance path comprising an ascending rail and descending rail disposed in the downstream of the ascending rail in the conveyance direction; the main body 18a supporting member supporting the feeder body 16a on a horizontal floor so that a torsion axis C, which becomes the center of the torsional vibration, is inclined relative to the vertical direction; the ascending rail and descending rail conveying the conveyed objects upwardly or downwardly relative to the horizontal direction while the feeder body being supported by the horizontal floor via the main body supporting member.
摘要翻译：一种振动给料机，具有一个具有圆形底壁和沿着底壁141a的周边形成的输送路径的进给球14a; 供给体16a，其支撑供给球14a，以沿着输送路径施加扭转振动和输送供给在底壁141a上的物质; 以及用于支撑给料器本体的主体支撑构件; 所述输送路径包括沿所述输送方向设置在所述上升轨道的下游的上升轨道和下降轨道; 主体18a支撑构件在水平地板上支撑进给器本体16a，使得成为扭转振动的中心的扭转轴线C相对于垂直方向倾斜; 上升轨道和下行轨道相对于水平方向向上或向下传送输送的物体，同时馈送器主体经由主体支撑构件由水平地板支撑。

18. 发明申请

US20090153103A1 Portable Device and Battery Pack for the Same 有权
标题翻译：便携式设备和相同的电池组
公开(公告)号：US20090153103A1
公开(公告)日：2009-06-18
申请号：US12334596
申请日：2008-12-15
申请人： Akira Ikeuchi , Itsuki Nakano , Kenichi Kasai , Katsuya Suzuki , Kuniharu Suzuki
发明人： Akira Ikeuchi , Itsuki Nakano , Kenichi Kasai , Katsuya Suzuki , Kuniharu Suzuki
IPC分类号： H02J7/04
CPC分类号： H02J7/0091
摘要： A portable device is disclosed that includes a charge control circuit configured to control charging of a secondary battery included in a battery pack, the secondary battery being configured to supply power to the portable device; a temperature detection terminal at which the temperature of the secondary battery is detected from a temperature detection part of the battery pack; positive and negative power terminals to be connected to the battery pack; a control circuit configured to control the operation of the portable device; and an interface circuit connected between the temperature detection terminal and each of an input terminal of the charge control circuit and an input terminal of the control circuit, in which a signal detected at the temperature detection terminal is fed to each of the charge control circuit and the control circuit through the interface circuit.
摘要翻译：公开了一种便携式装置，其包括充电控制电路，其被配置为控制包括在电池组中的二次电池的充电，所述二次电池被配置为向便携式设备供电; 从电池组的温度检测部检测出二次电池的温度的温度检测端子; 正电源端子和负电源端子连接到电池组; 配置为控制便携式设备的操作的控制电路; 以及连接在温度检测端子与充电控制电路的输入端子和控制电路的输入端子的温度检测端子之间的接口电路，其中在温度检测端子处检测到的信号被馈送到每个充电控制电路，以及控制电路通过接口电路。

19. 发明申请

US20090124298A1 MOBILE PHONE TERMINAL AND COMMUNICATION SYSTEM 有权
标题翻译：移动电话终端和通信系统
公开(公告)号：US20090124298A1
公开(公告)日：2009-05-14
申请号：US12262625
申请日：2008-10-31
申请人： Katsuya Suzuki , Kuniharu Suzuki , Akira Ikeuchi , Yoshihide Majima , Hirotsugu Iijima , Kenichi Kasai , Takatoshi Itagaki
发明人： Katsuya Suzuki , Kuniharu Suzuki , Akira Ikeuchi , Yoshihide Majima , Hirotsugu Iijima , Kenichi Kasai , Takatoshi Itagaki
IPC分类号： H04M1/00
CPC分类号： H04W52/0283 , G01R31/3648 , H04M1/0262 , H04M1/72527 , H04W52/0261 , Y02D70/00
摘要： Disclosed is a mobile phone terminal with a battery pack containing a retraceable battery as power supply, and transmitting and receiving radio-signals to and from a mobile phone system base transceiver station. The mobile phone terminal includes a data communication terminal communicating data with the battery pack, an intermittent receiving processor periodically carrying out intermittent receiving processing via the base transceiver station when the mobile phone terminal is in a standby operation, and a battery status determining unit transmitting, while the intermittent receiving processor is carrying out intermittent receiving processing, an activating signal to the battery pack via the data communication terminal and reading battery status data from the activated battery pack.
摘要翻译：公开了具有电池组的移动电话终端，该电池组包含作为电源的可追溯电池，并且向移动电话系统基地收发台发送和接收无线电信号。移动电话终端包括与电池组通信数据的数据通信终端，当移动电话终端处于待机操作时，间歇接收处理器经由基站收发器周期性地执行间歇接收处理，以及电池状态确定单元，而间歇接收处理器正在进行间歇接收处理，经由数据通信终端向电池组发送激活信号，并从活化的电池组读取电池状态数据。

20. 发明授权

US06528878B1 Device for sealing and cooling multi-chip modules 失效
标题翻译：密封和冷却多芯片模块的装置
公开(公告)号：US06528878B1
公开(公告)日：2003-03-04
申请号：US09631889
申请日：2000-08-04
申请人： Takahiro Daikoku , Kenichi Kasai , Toshitada Netsu , Koichi Koyano , Takayuki Uda
发明人： Takahiro Daikoku , Kenichi Kasai , Toshitada Netsu , Koichi Koyano , Takayuki Uda
IPC分类号： H01L2334
CPC分类号： H01L23/10 , H01L23/473 , H01L2224/16 , H01L2224/73253 , H01L2924/01322 , H01L2924/09701 , H01L2924/15311 , H01L2924/15312 , H01L2924/16152 , H01L2924/16195 , H01L2924/1626
摘要： According to the invention, a sealing top plate in a multi-chip module is formed from a ceramic with high thermal conductivity having a thermal expansion coefficient consistent with that of a multi-layer circuit substrate. A cooling flow path cover covering the entirety of cooling flow path grooves is formed as a separate metallic member. The back surface of the sealing top plate, on which are formed the cooling flow path grooves, is bonded directly to the back surface of a semiconductor device using solder. A thermal-conductive jacket with low thermal resistance is provided. A multi-chip module sealing frame is soldered to the edge of the sealing top plate. Furthermore, a sealing material such as an O-ring is simply interposed between the edge of the sealing top plate and the cooling water path cover, and tightening means is used to tighten the metallic cooling flow path cover and the multi-chip module sealing frame to each other.
摘要翻译：根据本发明，多芯片模块中的密封顶板由具有与多层电路基板的热膨胀系数一致的高导热性的陶瓷形成。覆盖整个冷却流路槽的冷却流路盖形成为单独的金属部件。密封顶板的形成冷却流路槽的背面使用焊料直接接合在半导体装置的背面。提供具有低热阻的导热护套。多芯片模块密封框架焊接到密封顶板的边缘。此外，诸如O形圈的密封材料简单地介于密封顶板的边缘和冷却水通道盖之间，并且紧固装置用于紧固金属冷却流路盖和多芯片模块密封框架对彼此。

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