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    • 12. 发明授权
    • Apparatus for heat processing a substrate
    • 用于热处理衬底的装置
    • US5405446A
    • 1995-04-11
    • US272486
    • 1994-07-11
    • Toshihiro NakajimaTakatoshi ChibaKiyofumi NishiiToru Sato
    • Toshihiro NakajimaTakatoshi ChibaKiyofumi NishiiToru Sato
    • H01L21/26C23C16/44C23C16/455C30B25/14C30B31/16H01L21/00H01L21/205H01L21/22H01L21/31H01L21/324C23C16/00
    • C23C16/45504C23C16/45512C23C16/4558C30B25/14C30B31/16H01L21/67109
    • An apparatus for heat processing a substrate includes a heat processing furnace, which has a flat inner space for accommodating the substrate, and a gas introduction unit which introduces gas supplied via a piping into the inner space of the heat processing furnace via a gas supply inlet of the heat processing furnace. The apparatus effects the heat processing on the substrate placed within a gas flow formed in the inner space. The gas introduction unit includes a first gas introduction chamber, which receives the gas supplied via the piping for reducing a flow velocity of the gas, and a second gas introduction chamber, which is in communication with the first gas introduction chamber, is formed over at least one of outer surfaces of the top furnace wall and the bottom furnace wall at the one end of the heat processing furnace, and extends in a belt-like form through an entire width of the heat processing furnace. A portion of the top furnace wall and/or bottom furnace wall, over which the second gas introduction chamber is formed, has a nozzle opening, which covers the entire width of the heat processing furnace for flowing the gas from the second gas introduction chamber into the inner space in a direction perpendicular to the top furnace wall and/or bottom furnace wall. The gas supply port and the first gas introduction chamber are preferably separated from each other by a partition which forms a portion of a cylindrical or spherical surface and has a plurality of through-holes.
    • 一种用于加热基板的设备包括:热处理炉,其具有用于容纳基板的平坦内部空间;以及气体引入单元,其经由管道供给的气体经由气体供给入口引入到热处理炉的内部空间 的热处理炉。 该装置对放置在内部空间中形成的气流内的基板进行热处理。 气体引入单元包括:第一气体导入室,其接收经由管道供给的气体,用于降低气体的流速;以及与第一气体导入室连通的第二气体导入室,形成在 在热处理炉的一端的顶炉壁和底炉壁的至少一个外表面,并且以带状形式延伸通过热处理炉的整个宽度。 顶部炉壁和/或底部炉壁的形成有第二气体导入室的部分具有喷嘴开口,该喷嘴开口覆盖用于使气体从第二气体导入室流出的热处理炉的整个宽度进入 在垂直于顶部炉壁和/或底部炉壁的方向上的内部空间。 气体供给口和第一气体导入室优选通过形成圆筒状或球面的一部分并具有多个通孔的隔壁相互分离。
    • 13. 发明授权
    • Method of controlling heat treatment apparatus for substrate
    • 控制基板热处理装置的方法
    • US4924073A
    • 1990-05-08
    • US308094
    • 1989-02-08
    • Takatoshi Chiba
    • Takatoshi Chiba
    • H01L21/26C30B31/12C30B31/18F27B17/00G05D23/00G05D23/19H01L21/205H01L21/22H01L21/31
    • C30B31/18C30B31/12F27B17/0025
    • A semiconductor wafer (1) is thermally treated in a prescribed heating cycle while it is introduced into a furnace casing (4) of a furnace (4) and discharged therefrom. A temperature of a monitor chip (11) is measured by a radiation thermometer (16) immediately before introduction of the semiconductor wafer and memorized as an idling temperature. Then, while the furnace is heated up in order to make a measured temperature of the monitor chip agree with the idling temperature without the semiconductor wafer introduced, a temperature of the furnace casing is measured by a radiation thermometer (8) and memorized as a warm-up temperature. The furnace is controlled on the basis of the warm-up temperature or the idling temperature prior to sequential heat treatment of a number of semiconductor wafers.
    • 半导体晶片(1)在被引入炉(4)的炉壳(4)中并在其中排出时,在规定的加热循环中进行热处理。 监测芯片(11)的温度是在半导体晶片引入之前立即由辐射温度计(16)测量的,并作为怠速温度存储。 然后,为了使监测芯片的测量温度与引入半导体晶片的空转温度一致,炉子被加热,炉壳的温度通过辐射温度计(8)测量并记忆为温度 升温 在多个半导体晶片的连续热处理之前,基于预热温度或空转温度来控制炉。
    • 15. 发明授权
    • Substrate heat treatment apparatus
    • 基板热处理装置
    • US5611685A
    • 1997-03-18
    • US450758
    • 1995-05-25
    • Toshihiro NakajimaTakatoshi ChibaKiyofumi NishiiToru Sato
    • Toshihiro NakajimaTakatoshi ChibaKiyofumi NishiiToru Sato
    • C23C16/44C23C16/455C30B25/10C30B25/12C30B25/14H01L21/00H01L21/205H01L21/26H01L21/324F27B5/04
    • H01L21/67109C23C16/4401C23C16/4412C30B25/10C30B25/12C30B25/14
    • A substrate heat treatment apparatus includes a heat treatment furnace of a flat configuration, and having a cavity in which a substrate is accommodated. The heat treatment furnace includes a gas supply unit at one side end face, an opening for communication between the cavity and the outside world, and a gas discharge unit in the vicinity of the opening for discharging gas from the cavity at the other side end face. The heat treatment furnace further includes a cover for shutting the opening allowing opening/closing thereof. In the gas exhaust unit, an exhaust chamber is formed on the other side end face along the opening with a partition wall between the opening and the exhaust chamber. An exhaust portion is formed in communication with the outside world in the exhaust chamber. The partition wall is formed so that the edge of the partition wall is displaced away from the inside surface of the cover, whereby a slit-like vent passage extending in the direction of the width of the cavity is formed between the cover and the edge of the partition wall when the opening is shut. The gas flow is uniform in the vicinity of the vent passage when a substrate is loaded/unloaded into and/from the heat treatment furnace, and also during heat treatment. The outside air will not enter the furnace, and no stagnation of the process gas occurs in the furnace.
    • 基板热处理装置包括平坦构造的热处理炉,并且具有容纳基板的空腔。 所述热处理炉包括在一侧端面处的气体供给单元,所述空腔与所述外界之间连通的开口以及所述开口附近的气体排出单元,用于从所述另一侧端面处的所述空腔排出气体 。 热处理炉还包括用于关闭允许其打开/关闭的开口的盖。 在排气单元中,在开口与排气室之间具有分隔壁的沿着开口的另一侧端面形成有排气室。 在排气室中形成与外界连通的排气部。 分隔壁形成为使得隔壁的边缘远离盖的内表面移开,从而在盖和盖的边缘之间形成沿空腔宽度方向延伸的狭缝状通气通道 打开关闭时的隔墙。 当将基板装载/卸载到热处理炉中时,以及在热处理期间,气流在通气通道附近均匀。 外部空气不会进入炉内,炉内不会发生停滞。
    • 16. 发明授权
    • Apparatus for measuring the temperature of a substrate
    • 用于测量衬底温度的装置
    • US5539855A
    • 1996-07-23
    • US197784
    • 1994-02-16
    • Mitsukazu TakahashiTakatoshi ChibaKatsuichi Akiyoshi
    • Mitsukazu TakahashiTakatoshi ChibaKatsuichi Akiyoshi
    • G01K7/00G01K1/16H01L21/324H01L21/66H05B3/00A21B2/00F26B19/00
    • G01K1/16
    • A substrate temperature measuring apparatus includes a temperature signal generating device provided in contact with a substrate for generating a signal indicating its own temperature which follows the temperature of the substrate by thermal conduction, a device connected and responsive to the output of the temperature signal generating device for determining whether contact between the substrate and the temperature signal generating device is appropriate or not, and a device for carrying out a predetermined process according to a determination result of the determining device. It is possible to apply heat treatment to the substrate, to prevent the substrate from being subjected to heat treatment, or to give a necessary alarm according to the determination result. Since the next substrate is at room temperature when it first comes into contact with the temperature signal generating device after heat treatment, the temperature signal generating device lowers its temperature rapidly in such a manner that reflects a state of contact between the substrate and the temperature signal generating device. Based on change of the output of the temperature signal generating device at this time, it is possible to detect an undesired state of contact between the substrate and the temperature signal generating device, and to prevent inaccurate measurement of the temperature of the substrate.
    • 基板温度测量装置包括:温度信号发生装置,与温度信号发生装置接触,用于通过热传导产生表示其本身温度跟随基板温度的信号;连接的装置,并响应温度信号发生装置的输出 用于确定基板和温度信号发生装置之间的接触是否适当;以及根据确定装置的确定结果执行预定处理的装置。 可以对基板进行热处理,以防止基板受到热处理,或者根据确定结果进行必要的报警。 由于下一个基板在热处理后首先与温度信号发生装置接触时处于室温,所以温度信号发生装置以反映基板和温度信号之间的接触状态的方式快速降低其温度 生成装置。 基于此时的温度信号发生装置的输出变化,可以检测基板和温度信号发生装置之间的不期望的接触状态,并且防止基板的温度的不准确的测量。
    • 18. 发明授权
    • Lid lock structure of storing box for vehicle
    • 车载储物箱盖锁结构
    • US08123261B2
    • 2012-02-28
    • US12310497
    • 2007-12-14
    • Masami KikuchiTakatoshi Chiba
    • Masami KikuchiTakatoshi Chiba
    • E05C1/06
    • B60R7/06B60R2011/0005E05B77/06E05B83/30E05C19/022Y10S292/22Y10T292/096Y10T292/1014
    • A lid lock structure of a storing box for a vehicle includes an elongated sliding hole formed in an arm portion for rotatably connecting a lid to a box main body. A slide restraining device, when force (F5) acts in a sliding direction on a slider configured to be slidable along the elongated sliding hole, restrains the slider from sliding if the magnitude of the force (F5) is not larger than a predetermined value, and releases the slider from the restrained state if the magnitude of the force (F5) is larger than the predetermined value. A twist spring causes the slider to quickly slide from an end portion R side to an end portion L side of the elongated sliding hole when the slider is released from the restrained state; and a stopper portion restrains an arm portion from rotating in a direction in which the lid opens, by locking the slider when the slider is located in the end portion L side of the elongated sliding hole.
    • 一种用于车辆的储物箱的盖锁结构包括形成在臂部中的细长滑动孔,用于将盖可旋转地连接到箱主体。 滑动限制装置,当力(F5)沿着滑动方向作用在被配置为沿着细长滑动孔滑动的滑块时,如果力(F5)的大小不大于预定值,则限制滑块滑动, 并且如果力(F5)的大小大于预定值,则将滑块从限制状态释放。 当滑块从限制状态释放时,扭簧使滑块从细长滑动孔的端部R侧到端部L侧快速滑动; 并且止动部通过当滑块位于细长滑动孔的端部L侧时通过锁定滑块来限制臂部沿盖打开的方向旋转。