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    • 14. 发明授权
    • Method of making IC card
    • IC卡制作方法
    • US5520863A
    • 1996-05-28
    • US348487
    • 1994-12-02
    • Katsunori OchiSyojiro KodaiTuguo KurisuOsamu MurakamiMakoto Kobayashi
    • Katsunori OchiSyojiro KodaiTuguo KurisuOsamu MurakamiMakoto Kobayashi
    • B42D15/10G06K19/07G06K19/077H05K3/28B29C44/06B29C44/12
    • H05K3/284G06K19/077G06K19/07745H01L2924/0002Y10S425/812
    • A method for producing an IC card including filling a confined space with a mixture including a foaming resin, the mixture having not been foamed yet, the space being confined by a frame having cut-out portions on inner edges and at least one through-hole passing through the frame in the lateral direction between the inside and the outside of the frame, a circuit board on which functional components are mounted and having edges fitted to one of the cut-out portions of the frame so that the surface of the circuit board on which functional components are mounted faces inward, the frame and the circuit board forming a substantially flat outer surface, and a thin plate having edges fitted to another of the cut-out portions of the frame with the thin plate opposing the circuit board, the frame and the thin plate forming a substantially flat outer surface; foaming the mixture at a predetermined temperature for a predetermined time, thus filling the confined space with foamed resin, and thus making the foamed resin a structural member having mechanical strength, molding the frame, the circuit board, and the thin plate into one body; and removing excess foamed resin from the through-hole in the frame.
    • 一种用于制造IC卡的方法,包括用包含发泡树脂的混合物填充密闭空间,所述混合物尚未发泡,所述空间被具有内边缘上的切口部分的框架和至少一个通孔 在框架的内部和外部之间沿横向方向穿过框架,电路板,功能部件安装在该电路板上,并且边缘装配到框架的一个切口部分,使得电路板的表面 其中功能部件被安装在其上,框架和电路板形成基本上平坦的外表面,以及薄板,其边缘装配到框架的另一个切口部分,薄板与电路板相对, 框架和薄板形成基本平坦的外表面; 在预定温度下将混合物发泡预定时间,由此用泡沫树脂填充密闭空间,从而使发泡树脂具有机械强度的结构件,将框架,电路板和薄板模制成一体; 并从框架中的通孔中除去多余的发泡树脂。