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    • 12. 发明授权
    • Ferroelectric memory device having an internal supply voltage, which is lower than the external supply voltage, supplied to the memory cells
    • 提供给存储单元的具有低于外部电源电压的内部电源电压的铁电存储器件
    • US06438020B1
    • 2002-08-20
    • US09651104
    • 2000-08-30
    • Junichi Yamada
    • Junichi Yamada
    • G11C1122
    • G11C11/22
    • There is provided a highly reliable non-volatile ferroelectric memory device in which the permitted number of read/write operation cycles is increased. The device comprises a step-down power supply circuit which generates a supply voltage VINT which is lower than a supply voltage VDD fed from the outside but not less than a coercive voltage of the ferroelectrics for the purpose of improving the resistance to fatigue of and imprinting to the ferroelectrics. Since the characteristics of the ferroelectrics deteriorate more due to fatigue and imprinting as the voltage applied to the ferroelectrics increases, a supply voltage for sense amplifiers and voltage supply circuits are selected to be VINT so that VINT is applied to the ferroelectric capacitors, while a supply voltage for other peripheral circuits is selected to be VDD. With this structure, the reliability of the device with respect to its read/write operations can significantly be improved as compared to the conventional ferroelectric memory devices by minimizing the effect that the signal voltage is reduced and by increasing the permitted number of operation cycles.
    • 提供了一种高度可靠的非易失性铁电存储器件,其中允许的读/写操作次数增加。 该装置包括降压电源电路,其生成低于从外部馈送的电源电压VDD但不低于铁电体的矫顽电压的电源电压VINT,以提高耐疲劳性和印记性 到铁电体。 由于随着施加到铁电体上的电压的增加,铁电体的特性由于疲劳和压印而变差,因此将读出放大器和电压供给电路的电源电压选择为VINT,以将VINT施加到铁电电容器,同时供给 其他外围电路的电压选择为VDD。 利用这种结构,与传统的铁电存储器件相比,器件相对于其读/写操作的可靠性可以通过最小化信号电压降低的影响和通过增加允许的操作周期数而显着提高。
    • 13. 发明授权
    • Process for producing alcohols
    • 醇的制备方法
    • US06365783B1
    • 2002-04-02
    • US09577981
    • 2000-05-25
    • Yorozu YokomoriTsukasa HayashiToshiaki OgataJunichi YamadaSeiji Saito
    • Yorozu YokomoriTsukasa HayashiToshiaki OgataJunichi YamadaSeiji Saito
    • C07C4550
    • C07C45/50C07C29/16C07C31/125C07C47/02
    • Provided is a process for producing alcohols or aldehydes by reacting monoolefins with carbon monoxide and hydrogen with less formation of by-products. The process comprises the step of reacting a monoolefin with carbon monoxide and hydrogen in the presence of a cobalt carbonyl catalyst until the conversion of monoolefin reaches 50-90% (the first reaction step), the step of separating unreacted monoolefin from the reaction mixture obtained in the first reaction step (the step of separation of unreacted monoolefin) and the step of reacting the separated unreacted monoolefin with carbon monoxide and hydrogen in the presence of a cobalt carbonyl catalyst (the second reaction step), wherein at least one of the first reaction step and the second reaction step is carried out in the presence of water.
    • 提供了通过使单烯烃与一氧化碳和氢气反应而形成副产物而生产醇或醛的方法。 该方法包括在羰基钴催化剂存在下使单烯烃与一氧化碳和氢气反应的步骤,直到单烯烃的转化率达到50-90%(第一反应步骤),从获得的反应混合物中分离未反应的单烯烃的步骤 在第一反应步骤(分离未反应的单烯烃的步骤)和在羰基钴催化剂(第二反应步骤)的存在下使分离的未反应的单烯烃与一氧化碳和氢气反应的步骤,其中第一 反应步骤和第二反应步骤在水的存在下进行。
    • 14. 发明授权
    • Process for etching a semiconductor lead frame
    • 用于蚀刻半导体引线框架的工艺
    • US06008068A
    • 1999-12-28
    • US877549
    • 1997-06-17
    • Junichi Yamada
    • Junichi Yamada
    • H01L21/48H01L23/495
    • H01L21/4828H01L23/49548H01L2224/45144H01L2224/48091H01L2224/48247H01L24/45H01L24/48H01L2924/01004H01L2924/01019H01L2924/01078H01L2924/01079H01L2924/181
    • A method for producing a lead frame having outer leads and inner leads, for use in constructing a resin-sealed semiconductor package comprises etching processes for etching a blank. A first resist pattern having a first opening and a second resist pattern having second openings are formed on the first and the second major surfaces of a blank. The first and the second major surfaces of the blank are etched through the first and the second resist pattern by a first etching process using a first etchant to form a first recess corresponding to the first opening and second recesses corresponding to the second recesses in the first and the second major surfaces, respectively. The first recess is filled up with an etch-resistant layer. The second major surface is etched through the second resist pattern by a second etching process using a second etchant so that portions of the blank corresponding to the second openings of the second resist pattern are etched through to form the tips of the inner leads.
    • 一种用于制造树脂密封半导体封装的外引线和内引线的引线框架的制造方法,其特征在于包括用于蚀刻坯料的蚀刻工艺。 具有第一开口的第一抗蚀剂图案和具有第二开口的第二抗蚀剂图案形成在坯料的第一和第二主表面上。 通过使用第一蚀刻剂的第一蚀刻工艺,通过第一蚀刻工艺蚀刻坯料的第一和第二主表面,以形成对应于第一开口的第一凹部和对应于第一凹部中的第一凹部的第一凹部 和第二主表面。 第一个凹槽填充有耐蚀刻层。 通过使用第二蚀刻剂的第二蚀刻工艺,通过第二抗蚀剂图案蚀刻第二主表面,使得对应于第二抗蚀剂图案的第二开口的坯件的部分被蚀刻通过以形成内引线的尖端。
    • 15. 发明授权
    • Semiconductor lead frame
    • 半导体引线框架
    • US5939774A
    • 1999-08-17
    • US877348
    • 1997-06-17
    • Junichi Yamada
    • Junichi Yamada
    • C23F1/00C23F1/16H01L21/48H01L21/56H01L23/28H01L23/495H01L23/50
    • H01L23/49548H01L21/4828H01L2224/45144H01L2224/48091H01L2224/48247H01L24/45H01L24/48H01L2924/00014H01L2924/01004H01L2924/01019H01L2924/01078H01L2924/01079H01L2924/181Y10T29/49121
    • A method for producing a lead frame having outer leads and inner leads, for use in constructing a resin-sealed semiconductor package comprises etching processes for etching a blank. A first resist pattern having a first opening and a second resist pattern having second openings are formed on the first and the second major surfaces of a blank. The first and the second major surfaces of the blank are etched through the first and the second resist pattern by a first etching process using a first etchant to form a first recess corresponding to the first opening and second recesses corresponding to the second recesses in the first and the second major surfaces, respectively. The first recess is filled up with an etch-resistant layer. The second major surface is etched through the second resist pattern by a second etching process using a second etchant so that portions of the blank corresponding to the second openings of the second resist pattern are etched through to form the tips of the inner leads.
    • 一种用于制造树脂密封半导体封装的外引线和内引线的引线框架的制造方法,其特征在于包括用于蚀刻坯料的蚀刻工艺。 具有第一开口的第一抗蚀剂图案和具有第二开口的第二抗蚀剂图案形成在坯料的第一和第二主表面上。 通过使用第一蚀刻剂的第一蚀刻工艺,通过第一蚀刻工艺蚀刻坯料的第一和第二主表面,以形成对应于第一开口的第一凹部和对应于第一凹部中的第一凹部的第一凹部 和第二主表面。 第一个凹槽填充有耐蚀刻层。 通过使用第二蚀刻剂的第二蚀刻工艺,通过第二抗蚀剂图案蚀刻第二主表面,使得对应于第二抗蚀剂图案的第二开口的坯件的部分被蚀刻通过以形成内引线的尖端。
    • 16. 发明授权
    • Process for etching a semiconductor lead frame
    • 用于蚀刻半导体引线框架的工艺
    • US5683943A
    • 1997-11-04
    • US489319
    • 1995-06-12
    • Junichi Yamada
    • Junichi Yamada
    • C23F1/00C23F1/16H01L21/48H01L21/56H01L23/28H01L23/495H01L23/50
    • H01L23/49548H01L21/4828H01L2224/45144H01L2224/48091H01L2224/48247H01L24/45H01L24/48H01L2924/00014H01L2924/01004H01L2924/01019H01L2924/01078H01L2924/01079H01L2924/181Y10T29/49121
    • A method for producing a lead frame having outer leads and inner leads, for use in constructing a resin-sealed semiconductor package comprises etching processes for etching a blank. A first resist pattern having a first opening and a second resist pattern having second openings are formed on the first and the second major surfaces of a blank. The first and the second major surfaces of the blank are etched through the first and the second resist pattern by a first etching process using a first etchant to form a first recess corresponding to the first opening and second recesses corresponding to the second recesses in the first and the second major surfaces, respectively. The first recess is filled up with an etch-resistant layer. The second major surface is etched through the second resist pattern by a second etching process using a second etchant so that portions of the blank corresponding to the second openings of the second resist pattern are etched through to form the tips of the inner leads.
    • 一种用于制造树脂密封半导体封装的外引线和内引线的引线框架的制造方法,其特征在于包括用于蚀刻坯料的蚀刻工艺。 具有第一开口的第一抗蚀剂图案和具有第二开口的第二抗蚀剂图案形成在坯料的第一和第二主表面上。 通过使用第一蚀刻剂的第一蚀刻工艺,通过第一蚀刻工艺蚀刻坯料的第一和第二主表面,以形成对应于第一开口的第一凹部和对应于第一凹部中的第一凹部的第一凹部 和第二主表面。 第一个凹槽填充有耐蚀刻层。 通过使用第二蚀刻剂的第二蚀刻工艺,通过第二抗蚀剂图案蚀刻第二主表面,使得对应于第二抗蚀剂图案的第二开口的坯件的部分被蚀刻通过以形成内引线的尖端。
    • 19. 发明授权
    • Image scanning apparatus
    • 图像扫描装置
    • US4706129A
    • 1987-11-10
    • US671778
    • 1984-11-15
    • Junichi Yamada
    • Junichi Yamada
    • G03B42/08H04N1/029H04N1/14H04N3/02H04N1/04H04N1/10
    • H04N1/14H04N1/029
    • An image scanning apparatus comprises a recording material supporting member for supporting a recording material in a straightly moveable manner, and an endlessly moveable member positioned close to the recording material supported on the supporting member for movement along straight lines parallel to the recording material at an angle with respect to the movement direction of the recording material. The recording material supporting member is moved at a velocity approximately equal to the velocity component of the endlessly moveable member in the movement direction of the recording material so that the recording material is two-dimensionally scanned by light. The endlessly moveable member is provided with a photodetector and/or a light source. When the apparatus is used for image read-out, the endlessly moveable member is provided with a single light source and a plurality of light receiving elements positioned around the light source.
    • 图像扫描装置包括用于以可直线移动的方式支撑记录材料的记录材料支撑构件和靠近支撑在支撑构件上的记录材料定位的可循环移动的构件,以平行于记录材料的直线以一定角度移动 相对于记录材料的移动方向。 记录材料支撑构件以与记录材料的移动方向上的环形可移动构件的速度分量近似相等的速度移动,使得记录材料被二维扫描。 无限可移动构件设置有光电检测器和/或光源。 当该装置用于图像读出时,无限可移动构件设置有单个光源和围绕光源定位的多个光接收元件。