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11. 发明申请

US20110061901A1 HEAT-DISSIPATING SUBSTRATE AND FABRICATING METHOD THEREOF 有权
标题翻译：散热基板及其制造方法
公开(公告)号：US20110061901A1
公开(公告)日：2011-03-17
申请号：US12614407
申请日：2009-11-07
申请人： Chang Hyun LIM , Seog Moon CHOI , Sang Hyun SHIN , Young Ki LEE , Sung Keun PARK
发明人： Chang Hyun LIM , Seog Moon CHOI , Sang Hyun SHIN , Young Ki LEE , Sung Keun PARK
IPC分类号： H05K1/00 , H05K3/00
CPC分类号： H05K3/02 , H05K1/0201 , H05K1/053 , H05K3/0061 , H05K2201/062 , H05K2201/09881 , H05K2201/09972 , H05K2203/0315
摘要： Disclosed herein are a heat-dissipating substrate and a fabricating method thereof. The heat-dissipating substrate includes a plating layer divided by a first insulator formed in a division area. A metal plate is formed on an upper surface of the plating layer and filled with a second insulator at a position corresponding to the division area, with an anodized layer formed on a surface of the metal plate. A circuit layer is formed on the anodized layer which is formed on an upper surface of the metal plate. The heat-dissipating substrate and fabricating method thereof achieves thermal isolation by a first insulator formed in a division area and a second insulator.
摘要翻译：这里公开了散热基板及其制造方法。散热基板包括由形成在分割区域中的第一绝缘体分割的镀层。金属板形成在镀层的上表面上，并且在对应于分割区域的位置处填充有第二绝缘体，阳极氧化层形成在金属板的表面上。在形成在金属板的上表面上的阳极氧化层上形成电路层。散热基板及其制造方法通过形成在分割区域和第二绝缘体中的第一绝缘体进行热隔离。

12. 发明申请

US20120103588A1 HEAT-DISSIPATING SUBSTRATE 审中-公开
标题翻译：散热基板
公开(公告)号：US20120103588A1
公开(公告)日：2012-05-03
申请号：US13030976
申请日：2011-02-18
申请人： Kwang Soo KIM , Chang Hyun LIM , Seog Moon CHOI , Mok Soon KIM , Sung Keun PARK
发明人： Kwang Soo KIM , Chang Hyun LIM , Seog Moon CHOI , Mok Soon KIM , Sung Keun PARK
IPC分类号： F28F7/00
CPC分类号： H05K1/053 , H05K2201/0338 , H05K2203/0315
摘要： Disclosed herein is a heat-dissipating substrate in order to improve heat-dissipating characteristics. The heat-dissipating substrate, comprising: a copper layer having a predetermined thickness; anodized insulating layers formed on upper and lower surfaces of the copper layer; and aluminum (Al) layers formed between the copper layer and the anodized insulating layer. Therefore, a heat-dissipating function of the base made of the aluminum (Al) layer and the copper (Cu) layer is improved, thereby making it possible to provide a high-output metal substrate appropriate for high-integration/high capacity electronic components.
摘要翻译：这里公开了散热基板，以提高散热特性。散热基板，包括：具有预定厚度的铜层; 形成在铜层的上表面和下表面上的阳极氧化绝缘层; 以及形成在铜层和阳极氧化绝缘层之间的铝（Al）层。因此，提高了由铝（Al）层和铜（Cu）层构成的基底的散热功能，从而可以提供适合于高集成度/高容量电子部件的高输出金属基板。

13. 发明申请

US20110025027A1 SIDE AIRBAG UNIT FOR VEHICLES 有权
标题翻译：车辆侧面安全气囊单元
公开(公告)号：US20110025027A1
公开(公告)日：2011-02-03
申请号：US12621797
申请日：2009-11-19
申请人： Chang Hyun LIM , Dae Young Kwak , Tae Ik Kwon , Soon Bok Lee , Anders Palo
发明人： Chang Hyun LIM , Dae Young Kwak , Tae Ik Kwon , Soon Bok Lee , Anders Palo
IPC分类号： B60R21/16
CPC分类号： B60R21/207 , B60R21/2338 , B60R2021/23386
摘要： A side airbag unit for a vehicle, constructed to protect a side of a passenger in the event of a side collision or when the vehicle overturns, the side airbag unit may include an airbag module having a stud which is inserted into a predetermined portion of a seat frame, and an airbag cushion which remains folded in the airbag module and expands when the airbag unit is deployed, and a strap allowing the airbag cushion to be deployed to a predetermined length at a predetermined position when the airbag cushion expands, wherein a first end of the strap is coupled to a predetermined portion of the airbag cushion and a second end thereof is coupled to the stud such that the second end of the strap is being locked to the stud when the stud is assembled with the seat frame.
摘要翻译：一种用于车辆的侧面安全气囊单元，其被构造成在侧面碰撞的情况下或者当车辆翻倒时保护乘客的侧面，所述侧面安全气囊单元可以包括具有螺栓的气囊模块，所述螺栓插入到座椅框架和安全气囊垫，其在气囊组件展开时保持折叠在气囊组件中并膨胀，并且当气囊垫膨胀时，使气囊垫能够在预定位置展开预定长度的带，其中第一带的端部联接到气囊垫的预定部分，并且其第二端联接到螺柱，使得当螺柱与座椅框架组装时，带的第二端被锁定到螺柱。

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