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11. 发明申请

US20060000719A1 Method and apparatus for feeding chips to a deposition location in a coating system 审中-公开
标题翻译：用于将芯片供给到涂覆系统中的沉积位置的方法和装置
公开(公告)号：US20060000719A1
公开(公告)日：2006-01-05
申请号：US11115089
申请日：2005-04-26
申请人： William Branagan , Frank DeWitt , Brian Feltz
发明人： William Branagan , Frank DeWitt , Brian Feltz
IPC分类号： C25D5/00 , C25D17/00
CPC分类号： C25D17/06 , C25D17/005
摘要： A device for storing and feeding chips to a deposition location in a coating system comprises a holder stack comprising a plurality of holders including first and last holders, a biasing element which applies a force to the last holder, and a pushing element which, when actuated, will push the first holder from a loading position to a deposition location adjacent to a deposition opening. There is also provided a method comprising loading a plurality of holders, each containing a chip, into a holding space, so that the holders are in the form of a holder stack, a force being applied by a biasing element to the last holder in the stack; and actuating a pushing element to push a first holder from the loading position to the deposition location. The method preferably further comprises passing a deposition material through the opening and then into contact with the chip.
摘要翻译：一种用于将芯片存储和馈送到涂覆系统中的沉积位置的装置包括保持器堆叠，其包括多个保持器，所述保持器堆叠包括第一和最后保持器，向最后保持器施加力的偏置元件以及当被致动时的推动元件将第一保持器从装载位置推动到与沉积开口相邻的沉积位置。还提供了一种方法，其包括将多个保持器（每个包含芯片）装载到保持空间中，使得保持器为保持器叠层的形式，力由施力元件施加到最终保持器堆并且致动推动元件以将第一保持器从装载位置推动到沉积位置。该方法优选还包括使沉积材料通过开口，然后与芯片接触。

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