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11. 发明授权

US08071886B2 Wired circuit board having a semiconductive grounding layer and producing method thereof 失效
标题翻译：具有半导体接地层的有线电路板及其制造方法
公开(公告)号：US08071886B2
公开(公告)日：2011-12-06
申请号：US12004400
申请日：2007-12-21
申请人： Jun Ishii , Yasunari Ooyabu , Yasuhito Funada
发明人： Jun Ishii , Yasunari Ooyabu , Yasuhito Funada
IPC分类号： H05K1/00
CPC分类号： H05K1/0259 , G11B5/486 , H05K1/056 , H05K1/167 , Y10T29/49117
摘要： A wired circuit board includes a metal supporting board, an insulating layer formed on the metal supporting board, a conductive pattern formed on the insulating layer and having a plurality of wires, and a semiconductive layer formed on a surface of the insulating layer exposed from the conductive pattern so as to be in contact with the conductive pattern. The insulating layer is formed with a groove exposing the metal supporting board between at least two adjacent wires, and the semiconductive layer is in contact with the metal supporting board in the groove.
摘要翻译：布线电路板包括金属支撑板，形成在金属支撑板上的绝缘层，形成在绝缘层上并具有多根导线的导电图案，以及形成在绝缘层的暴露于该绝缘层的表面上的半导体层导电图案以与导电图案接触。绝缘层形成有将金属支撑板暴露在至少两个相邻导线之间的沟槽，并且半导电层与凹槽中的金属支撑板接触。

12. 发明授权

US07586046B2 Wired circuit board 有权
标题翻译：有线电路板
公开(公告)号：US07586046B2
公开(公告)日：2009-09-08
申请号：US11514963
申请日：2006-09-05
申请人： Jun Ishii , Yasuhito Funada , Yasunari Ooyabu
发明人： Jun Ishii , Yasuhito Funada , Yasunari Ooyabu
IPC分类号： H05K1/03
CPC分类号： H05K3/28 , H05K1/0259 , H05K1/056 , H05K1/167 , H05K3/16 , H05K2201/0769
摘要： The invention provides a wired circuit board that can prevent deterioration of a conductive pattern and short-circuiting of the conductive pattern. The wired circuit board is presented herein in the form of a suspension board with circuit which comprises an insulating base layer formed on a metal supporting board, a conductive pattern formed on the insulating base layer, a metal oxide layer formed on a surface of the conductive pattern and on a surface of the insulating base layer by sputtering, and an insulating cover layer, formed on the metal oxide layer, to cover the conductive pattern. According to this suspension board with circuit, since the metal oxide layer to cover the conductive pattern is formed by the sputtering, the metal oxide layer can be formed with a uniform thickness. Hence, the metal oxide layer can fully function as a barrier layer to the conductive pattern and, accordingly, deterioration of the conductive pattern and the short-circuiting of the conductive pattern can be prevented effectively.
摘要翻译：本发明提供一种布线电路板，其可以防止导电图案的劣化和导电图案的短路。布线电路板在这里以具有电路的悬挂板的形式呈现，该电路包括形成在金属支撑板上的绝缘基底层，形成在绝缘基底层上的导电图案，形成在导电的表面上的金属氧化物层通过溅射形成在绝缘基底层的表面上，以及形成在金属氧化物层上的覆盖导电图案的绝缘覆盖层。根据具有电路的该悬挂板，由于通过溅射形成覆盖导电图案的金属氧化物层，所以可以形成均匀的厚度的金属氧化物层。因此，金属氧化物层可以充分发挥导电图案的阻挡层的作用，因此可以有效地防止导电图案的劣化和导电图案的短路。

13. 发明授权

US07566833B2 Wired circuit board and production method thereof 有权
标题翻译：有线电路板及其制作方法
公开(公告)号：US07566833B2
公开(公告)日：2009-07-28
申请号：US11439307
申请日：2006-05-24
申请人： Jun Ishii , Yasuhito Funada , Yasunari Ooyabu
发明人： Jun Ishii , Yasuhito Funada , Yasunari Ooyabu
IPC分类号： H05K1/00
CPC分类号： H05K1/0259 , H05K1/056 , H05K1/167 , H05K3/28 , H05K2201/0317 , H05K2203/0315 , Y10T428/24917 , Y10T428/24926
摘要： A wired circuit board that can remove static electricity not only from an insulating base layer and an insulating cover layer but also from a terminal portion, to effectively prevent an electronic component mounted from being damaged by static electricity and also prevent stripping of a semi-conductive layer. In a suspension board with circuit including an insulating base layer formed on a metal supporting board, a conductive pattern formed on the insulating base layer, and an insulating cover layer, formed on the insulating cover layer, to cover the conductive pattern and form an opening, semi-conductive layer is formed in succession on an upper surface of the insulating base layer covered with the insulating cover layer, on a lateral side surface and an upper surface of the conductive pattern, and on a lateral side surface of the insulating base layer adjacent to the metal supporting board.
摘要翻译：一种布线电路板，其不仅可以从绝缘基层和绝缘覆盖层，而且从端子部分去除静电，以有效地防止安装的电子部件被静电损坏，并且还防止半导体剥离层。在具有形成在金属支撑基板上的绝缘基底层的电路的悬挂基板上，形成在绝缘基底层上的导电图案和形成在绝缘覆盖层上的绝缘覆盖层，以覆盖导电图案并形成开口在覆盖有绝缘覆盖层的绝缘基底层的上表面上，在导电图案的侧面和上表面上以及绝缘基底层的侧面上依次形成半导体层毗邻金属支撑板。

14. 发明申请

US20090142478A1 Wired circuit board and producing method thereof 审中-公开
标题翻译：有线电路板及其制造方法
公开(公告)号：US20090142478A1
公开(公告)日：2009-06-04
申请号：US12320257
申请日：2009-01-22
申请人： Yasuhito Funada , Jun Ishii
发明人： Yasuhito Funada , Jun Ishii
IPC分类号： B05D5/12
CPC分类号： H05K1/0269 , H05K1/056 , H05K3/44 , H05K2201/0338 , H05K2201/0347 , H05K2201/09781 , H05K2201/09918 , H05K2203/0723
摘要： A wired circuit board and a producing method thereof are provided which can precisely form an insulating layer and reduce transmission loss with a simple layer structure and also features excellent long-term reliability by preventing the occurrence of an ion migration phenomenon between a ground layer and a positioning mark layer, and the insulating layer to improve the adhesion therebetween and the conductivity of a conductor. A metal supporting board is prepared and a first metal thin film is formed on the metal supporting board. A resist is formed in a pattern and a ground layer and a positioning mark layer are formed on the first metal thin film exposed from the resist at the same time. A second metal thin film is formed over the ground layer and the positioning mark layer, then the resist is removed. An insulating base layer is formed on the first metal thin film including the upper surface of the second metal thin film, thereafter, a conductive pattern is formed on the insulating base layer.
摘要翻译：提供一种布线电路板及其制造方法，其可以精确地形成绝缘层，并且以简单的层结构减小传输损耗，并且还通过防止接地层和接地层之间的离子迁移现象的发生而具有优异的长期可靠性定位标记层和绝缘层，以改善其间的粘附性和导体的导电性。制备金属支撑板，在金属支撑板上形成第一金属薄膜。在图案中形成抗蚀剂，同时在从抗蚀剂暴露的第一金属薄膜上形成接地层和定位标记层。在接地层和定位标记层上形成第二金属薄膜，然后除去抗蚀剂。在包括第二金属薄膜的上表面的第一金属薄膜上形成绝缘基底层，之后在绝缘基底层上形成导电图案。

15. 发明申请

US20070128417A1 Wired circuit board 有权
标题翻译：有线电路板
公开(公告)号：US20070128417A1
公开(公告)日：2007-06-07
申请号：US11606021
申请日：2006-11-30
申请人： Jun Ishii , Yasuhito Funada
发明人： Jun Ishii , Yasuhito Funada
IPC分类号： B32B3/00
CPC分类号： H05K1/056 , H05K3/388 , H05K3/44 , H05K2201/0317 , H05K2201/0338 , H05K2201/09845 , H05K2203/0723 , Y10T428/24917
摘要： A wired circuit board is provided which can reduce transmission loss with a simple layer structure and also features excellent long-term reliability by preventing the occurrence of an ion migration phenomenon between a metal foil and an insulating layer to improve the adhesion between the metal foil and the insulating layer and the conductivity of a conductor. A metal supporting board is prepared and a first metal thin film is formed on the metal supporting board by sputtering or electrolytic plating. A metal foil is formed on the first metal thin film by electrolytic plating. A second metal thin film is formed over the metal foil and the metal supporting board by electroless plating or sputtering. An insulating base layer is formed on the second metal thin film. A conductive pattern is formed as a wired circuit pattern on the insulating base layer. An insulating cover layer is formed on the insulating base layer to cover the conductive pattern.
摘要翻译：提供一种布线电路板，其可以通过简单的层结构降低传输损耗，并且还通过防止金属箔和绝缘层之间的离子迁移现象的发生而具有优异的长期可靠性，以提高金属箔和绝缘层之间的粘附性绝缘层和导体的导电性。制备金属支撑板，并且通过溅射或电解电镀在金属支撑板上形成第一金属薄膜。通过电解电镀在第一金属薄膜上形成金属箔。通过无电镀或溅射在金属箔和金属支撑板上形成第二金属薄膜。在第二金属薄膜上形成绝缘基层。导电图案形成为绝缘基底层上的布线电路图案。绝缘覆盖层形成在绝缘基底层上以覆盖导电图案。

16. 发明授权

US07182606B2 Wired circuit board 有权
标题翻译：有线电路板
公开(公告)号：US07182606B2
公开(公告)日：2007-02-27
申请号：US11365845
申请日：2006-03-02
申请人： Jun Ishii , Hitoki Kanagawa , Yasuhito Funada
发明人： Jun Ishii , Hitoki Kanagawa , Yasuhito Funada
IPC分类号： H01R12/00
CPC分类号： H05K1/056 , H05K2201/0317 , H05K2201/0338 , H05K2203/0723
摘要： A wired circuit board that can provide a reduced transmission loss and an improved adhesion strength between a metal suspension board and a metal foil with a simple laminar structure, thereby ensuring improved long-term reliability. The wired circuit board 1 comprises a metal suspension board 2, a thin metal film 3 formed on the metal suspension board 2 by sputtering or by electrolytic plating, a metal foil 4 formed on the thin metal film 3 by electrolytic plating, an insulating base layer 5 formed on the metal foil 4 and the metal suspension board 2, and a conductive pattern 6 formed on the insulating base layer 5 as a wired circuit pattern. The wired circuit board 1 may include an insulating cover layer 7 formed on the insulating base layer 5 to cover the conductive pattern 6.
摘要翻译：一种布线电路板，其能够以简单的层状结构提供降低的传输损耗和改善金属悬挂板和金属箔之间的粘附强度，从而确保改善的长期可靠性。布线电路板1包括金属悬挂板2，通过溅射或电解电镀形成在金属悬挂板2上的薄金属膜3，通过电解电镀形成在金属薄膜3上的金属箔4，绝缘基底层形成在金属箔4和金属悬挂板2上的导电图案6和形成在绝缘基底层5上的布线电路图案的导电图案6。布线电路板1可以包括形成在绝缘基底层5上以覆盖导电图案6的绝缘覆盖层7。

17. 发明申请

US20060023435A1 Wired circuit board 有权
标题翻译：有线电路板
公开(公告)号：US20060023435A1
公开(公告)日：2006-02-02
申请号：US11187865
申请日：2005-07-25
申请人： Yasunari Ooyabu , Yasuhito Funada , Hitoki Kanagawa , Tetsuya Ohsawa
发明人： Yasunari Ooyabu , Yasuhito Funada , Hitoki Kanagawa , Tetsuya Ohsawa
IPC分类号： H05K7/06 , G11B5/49
CPC分类号： H05K1/181 , H05K1/056 , H05K3/28 , H05K2201/09972 , Y02P70/611
摘要： A wired circuit board that can prevent inconsistency in characteristic impedance to allow effective transmission of electrical signals from a magnetic head to a control board portion. A wired circuit board 1 is constructed so that a suspension board portion 2 for supporting the magnetic head 15 and a control board portion 3 for controlling the magnetic head 15 are formed to be continuous and integral with each other. To be more specific, a first conductor layer 10 connected to the magnetic head 15 in the suspension board portion 2 and a second conductor layer 11 connected to a preamplifier IC 12 in the control board portion 3 are formed from the same material and formed on a common insulating base layer 9 simultaneously. Further, a common insulating cover layer 13 to cover the first conductor layer 10 and the second conductor layer 11 is formed on the common insulating base layer 9. This arrangement of the wired circuit board 1 can eliminate the need of providing the connection point for connecting the first conductor layer 10 of the suspension board portion 2 and the second conductor layer 11 of the control board portion 3 at the boundary therebetween.
摘要翻译：一种可以防止特性阻抗不一致的有线电路板，以允许有效地将电信号从磁头传输到控制板部分。布线电路板1被构造成使得用于支撑磁头15的悬挂板部分2和用于控制磁头15的控制板部分3彼此连续并且一体地形成。更具体地说，连接到悬挂板部分2中的磁头15的第一导体层10和连接到控制板部分3中的前置放大器IC 12的第二导体层11由相同的材料形成并形成在公共绝缘基层9同时。此外，在公共绝缘基底层9上形成覆盖第一导体层10和第二导体层11的公共绝缘覆盖层13。布线电路板1的这种布置可以消除在其间的边界处提供用于连接悬挂板部分2的第一导体层10和控制板部分3的第二导体层11的连接点的需要。

18. 发明申请

US20050208421A1 Photosensitive resin composition and use of the same 有权
标题翻译：感光树脂组合物及其用途
公开(公告)号：US20050208421A1
公开(公告)日：2005-09-22
申请号：US11081516
申请日：2005-03-17
申请人： Hirofumi Fujii , Yasuhito Funada , Satoshi Tanigawa
发明人： Hirofumi Fujii , Yasuhito Funada , Satoshi Tanigawa
IPC分类号： G03F7/031 , C08F2/44 , C08F283/04 , C08G73/10 , G03C1/492 , G03F7/004 , G03F7/027 , G03F7/037 , G03F7/20 , H01L21/027
CPC分类号： G03F7/031 , C08K5/3432 , C08L79/08 , G03F7/037 , C08L79/04
摘要： A photosensitive resin composition which, when exposed to light through a photomask and then developed, can form a pattern comprising a polyimide film having a thickness of 20 μm or larger with high resolution; and a use of the composition, in particular, a method of forming a pattern comprising the polyimide film. The photosensitive resin composition comprises (a) a poly(amic acid), (b) a specific 1,4-dihydropyridine derivative, and (c) a specific imide acrylate compound.
摘要翻译：一种光敏树脂组合物，当通过光掩模曝光然后显影时，可以以高分辨率形成包含厚度为20μm或更大的聚酰亚胺膜的图案; 以及组合物的使用，特别是形成包含聚酰亚胺膜的图案的方法。感光性树脂组合物包含（a）聚（酰胺酸），（b）特定的1,4-二氢吡啶衍生物和（c）特定的酰亚胺丙烯酸酯化合物。

19. 发明授权

US06333139B1 Circuit-forming substrate and circuit substrate 有权
标题翻译：电路形成基板和电路基板
公开(公告)号：US06333139B1
公开(公告)日：2001-12-25
申请号：US09365786
申请日：1999-08-03
申请人： Toshihiko Omote , Yasuhito Funada , Hideyuki Usui , Masanori Ueno , Kazumasa Igarashi
发明人： Toshihiko Omote , Yasuhito Funada , Hideyuki Usui , Masanori Ueno , Kazumasa Igarashi
IPC分类号： G03C500
CPC分类号： B32B15/08 , G03F7/037 , H05K1/056 , Y10T428/12229 , Y10T428/1241 , Y10T428/12431 , Y10T428/12806 , Y10T428/12903 , Y10T428/24917 , Y10T428/31681
摘要： There are provided a circuit-forming substrate comprising a long stainless steel foil having formed on one surface or both surfaces thereof a polyimide resin layer wholly or partially, and a circuit substrate formed by using the circuit-forming substrate, wherein a conductor layer is finely patterned on the circuit-forming substrate. The circuit-forming substrate sufficiently satisfies low cost, high density and high reliability, scarcely causes warping of the substrate itself, and has excellent workability.
摘要翻译：提供了一种电路形成基板，其包括长整个或不表面的聚酰亚胺树脂层的一个表面或两个表面上形成的长的不锈钢箔，以及通过使用电路形成基板形成的电路基板，其中导体层是细的在电路形成衬底上图案化。电路形成基板充分满足低成本，高密度和高可靠性，几乎不引起基板本身翘曲，并且具有优异的可加工性。

20. 发明授权

US6096482A Circuit substrate, circuit-formed suspension substrate, and production method thereof 失效
公开(公告)号：US6096482A
公开(公告)日：2000-08-01
申请号：US36024
申请日：1998-03-06
申请人： Toshihiko Omote , Yasuhito Funada
发明人： Toshihiko Omote , Yasuhito Funada
IPC分类号： C08G69/26 , C08G73/10 , G03F7/004 , G03F7/038 , G11B3/00 , G11B5/48 , G11B5/60 , G11B21/00 , G11B21/02 , G11B21/16 , G11B21/18 , G11B25/04 , H05K1/03 , H05K1/05 , H05K3/46 , G03F7/00
CPC分类号： C08G73/1025 , C08G73/1039 , C08G73/1042 , G03F7/0387 , G11B21/00 , G11B5/486 , H05K1/056 , G03F7/0045 , Y10T428/24917
摘要： A circuit substrate having an insulating layer comprising a polyimide resin on a metal foil substrate, wherein the polyimide resin is a polyimide resin obtained by the reaction of(A) aromatic diamines comprising(a) p-phenylene diamine and(b) 2,2'-bis(trifluoromethyl)-4,4'-diaminobiphenyl.(B) 3,4,3',4'-biphenyltetracarboxylic acid dianhydride.The circuit-formed substrate has a desired circuit comprising a conductive layer on the circuit substrate.The polyimide resin has a coefficient of thermal linear expansion close to that of the metal foil, and hence breakage does not occur on the resin layer, the resin layer does not separate, and warping does not occur.

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