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11. 发明申请

US20080061717A1 Led Array 审中-公开
标题翻译： LED阵列
公开(公告)号：US20080061717A1
公开(公告)日：2008-03-13
申请号：US11575899
申请日：2005-09-09
申请人： Georg Bogner , Moritz Engl , Markus Hofmann , Joachim Reill , Thomas Reiners
发明人： Georg Bogner , Moritz Engl , Markus Hofmann , Joachim Reill , Thomas Reiners
IPC分类号： H05B37/02
CPC分类号： H01L25/167 , H01L25/0753 , H01L2924/0002 , H05B33/0854 , Y02B20/341 , H01L2924/00
摘要： An LED array comprising at least two LED chips (2) contains a temperature sensor (3), and means are provided for regulating the operating current of the LED chips (2) as a function of the temperature detected by the temperature sensor (3). This makes it possible for the LED chips (2) to be operated for long periods at high operating current, thereby reducing the risk of thermal overload.
摘要翻译：包括至少两个LED芯片（2）的LED阵列包含温度传感器（3），并且提供用于根据由温度传感器（3）检测到的温度来调节LED芯片（2）的工作电流的装置，。这使得LED芯片（2）可以在高工作电流下长时间运行，从而降低热过载的风险。

12. 发明申请

US20080315227A1 Light-Emitting Diode Arrangement 有权
标题翻译：发光二极管布置
公开(公告)号：US20080315227A1
公开(公告)日：2008-12-25
申请号：US11631058
申请日：2005-05-18
申请人： Georg Bogner , Stefan Grotsch , Gunter Waitl , Mario Wanninger
发明人： Georg Bogner , Stefan Grotsch , Gunter Waitl , Mario Wanninger
IPC分类号： H01L33/00
CPC分类号： H01L33/62 , H01L33/58 , H01L33/60 , H01L33/64 , H01L2924/0002 , H01L2924/00
摘要： A light-emitting diode arrangement is disclosed, comprising at least one light-emitting diode (LED) chip with a radiation decoupling surface through which a large portion of the electromagnetic radiation generated in the LED chip exits in a main direction of emission; a housing laterally surrounding the LED chip; and a reflective optic disposed after the radiation decoupling surface in the main direction of emission. The LED arrangement is particularly well suited for use in devices such as camera-equipped cell phones, digital cameras or video cameras.
摘要翻译：公开了一种发光二极管装置，其包括具有辐射去耦表面的至少一个发光二极管（LED）芯片，通过该发光二极管芯片，在LED芯片中产生的大部分电磁辐射沿主要发射方向排出; 横向围绕LED芯片的壳体; 以及设置在主发射方向上的辐射去耦表面之后的反射光学器件。 LED布置特别适用于诸如配备相机的手机，数码相机或摄像机等设备。

13. 发明申请

US20070008734A1 Headlight and headlight element 有权
标题翻译：头灯和头灯元件
公开(公告)号：US20070008734A1
公开(公告)日：2007-01-11
申请号：US10551412
申请日：2004-03-24
申请人： Georg Bogner , Stefan Grotsch , Joachim Reill
发明人： Georg Bogner , Stefan Grotsch , Joachim Reill
IPC分类号： F21V1/00
CPC分类号： B60Q1/04 , F21S41/143 , F21S41/24 , F21S41/28 , F21S41/663 , F21Y2115/10 , H01L33/58 , H01L33/60 , Y10S362/80
摘要： A headlight having a multitude of headlight elements, which each have at least one semiconductor chip which emits electromagnetic radiation; a primary optics element, which reduces the divergence of the light which is incident through the light input; and at least one headlight element output, which emits a part of the headlight light from the headlight element. At least some of the headlight element outputs are arranged in at least two groups in such a way that the arrangement of at least one of the groups and/or at least overall arrangement of headlight element outputs of multiple groups corresponds essentially to a desired emission characteristic of the headlight, in that, in particular, it has a shape which corresponds essentially to the cross-sectional shape of a desired headlight beam, wherein the semiconductor chips which belong to the headlight element outputs of one group can each be operated independently of other semiconductor chips. A headlight element is disclosed which is suitable for a headlight such as this.
摘要翻译：具有多个头灯元件的头灯，每个头灯元件具有发射电磁辐射的至少一个半导体芯片; 主要光学元件，其减少通过光输入入射的光的发散; 以及至少一个头灯元件输出，其从头灯元件发射一部分前照灯光。至少一些前灯元件输出以至少两组布置成使得多个组中的组中的至少一个组和/或至少总体布置的大灯组件输出的布置基本上对应于期望的发射特性特别地，其具有基本上对应于期望的前灯光束的横截面形状的形状，其中属于一组的前灯元件输出的半导体芯片可以分别独立于其它部件操作半导体芯片。公开了适合于诸如此类的头灯的头灯元件。

14. 发明申请

US20080266884A1 Cooling Device for Cooling a Semiconductor Component, in Particular, an Optoelectronic Semiconductor Component 审中-公开
标题翻译：用于冷却半导体部件的冷却装置，特别是光电子半导体部件
公开(公告)号：US20080266884A1
公开(公告)日：2008-10-30
申请号：US11794583
申请日：2005-12-01
申请人： Georg Bogner , Herbert Brunner , Stefan Grotsch , Guy Lefranc
发明人： Georg Bogner , Herbert Brunner , Stefan Grotsch , Guy Lefranc
IPC分类号： F21V29/00
CPC分类号： H01L23/427 , H01L33/648 , H01L2924/0002 , H01L2924/12044 , H01L2924/00
摘要： The invention relates to a cooling device for cooling a semiconductor component (1), in particular an optoelectronic semiconductor component, comprising at least partially first and second layers and a heal dissipation device (4), wherein said first and second layers are flatly placed on top of each other and one layer is provided, at least partially, with a structure for receiving said heat dissipation device (4).
摘要翻译：本发明涉及用于冷却半导体部件（1）的冷却装置，特别是包括至少部分第一和第二层的光电子半导体部件和愈合耗散装置（4），其中所述第一和第二层平坦地放置在至少部分地具有用于接收所述散热装置（4）的结构的一个层。

15. 发明授权

US08772065B2 Housing body and method for production thereof 有权
标题翻译：壳体及其制造方法
公开(公告)号：US08772065B2
公开(公告)日：2014-07-08
申请号：US13611890
申请日：2012-09-12
申请人： Georg Bogner , Karlheinz Arndt
发明人： Georg Bogner , Karlheinz Arndt
IPC分类号： H01L21/00
CPC分类号： H01L33/62 , H01L23/49805 , H01L24/48 , H01L31/0203 , H01L33/486 , H01L2224/48091 , H01L2924/00014 , H01L2924/01068 , H01L2924/01077 , H01L2924/01078 , H01L2924/12044 , H01L2924/181 , H01L2924/3025 , H01L2224/45099 , H01L2224/45015 , H01L2924/207 , H01L2924/00
摘要： A package body (1) with an upper side (2), with an underside (22), opposite from the upper side (2), and with a side surface, which connects the upper side (2) and the underside (22) and is provided as a mounting surface (19), the package body (1) having a plurality of layers (8) which contain a ceramic material, and a main direction of extent of the layers (23, 24, 25) running obliquely in relation to the mounting surface (19). Furthermore, a method for producing a package body (1) is provided.
摘要翻译：具有上侧（2）的包装体（1），具有与上侧（2）相对的下侧（22），以及连接上侧（2）和下侧（22）的侧表面，并且被设置为安装表面（19），所述封装主体（1）具有多个层（8），所述多个层（8）包含陶瓷材料，并且所述层（23,24,25）的倾斜方向与安装表面（19）的关系。此外，提供了一种用于生产包装体（1）的方法。

16. 发明授权

US07271425B2 Optoelectronic component 有权
标题翻译：光电元件
公开(公告)号：US07271425B2
公开(公告)日：2007-09-18
申请号：US10535794
申请日：2003-11-27
申请人： Karlheinz Arndt , Georg Bogner , Günter Waitl , Matthias Winter
发明人： Karlheinz Arndt , Georg Bogner , Günter Waitl , Matthias Winter
IPC分类号： H01L29/22
CPC分类号： H01L33/62 , H01L33/486 , H01L2224/48247 , H01L2224/48465 , H01L2924/00
摘要： The invention relates to an optoelectronic component containing an optoelectronic chip (1) and containing a chip carrier (2) that has a central region (3) on which the chip is fixed and that comprises terminals (41, 42, 43, 44) extending outwardly from the central region of the chip carrier (2) to the outside, wherein the chip and portions of the chip carrier are enveloped by a body (5) and wherein the projection of the body and that of each of the longitudinal axes of the terminals onto the contact plane between the chip and the chip carrier are substantially point-symmetrical with respect to the central point of the chip. The invention further relates to an arrangement comprising said component. The advantage of the symmetrical configuration of the component is that the risk of thermomechanically induced failures of the component is reduced.
摘要翻译：本发明涉及一种含有光电子芯片（1）并包含芯片载体（2）的光电子部件，芯片载体（2）具有芯片固定在其上的中心区域（3），并且包括端子（41,42,43,44）向外从芯片载体（2）的中心区域延伸至外部，其中芯片和芯片载体的部分被主体（5）包围，并且其中主体的突起和纵向轴线的突出部分在芯片和芯片载体之间的接触平面上的端子相对于芯片的中心点基本上是点对称的。本发明还涉及包括所述部件的装置。组件的对称构型的优点在于降低了组织的热力学诱导故障的风险。

17. 发明申请

US20060022215A1 Semiconductor component emitting and/or receiving electromagnetic radiation, and housing base for such a component 有权
标题翻译：发射和/或接收电磁辐射的半导体部件和用于这种部件的壳体基座
公开(公告)号：US20060022215A1
公开(公告)日：2006-02-02
申请号：US11179028
申请日：2005-07-18
申请人： Karlheinz Arndt , Georg Bogner , Bert Braune , Gunter Waitl
发明人： Karlheinz Arndt , Georg Bogner , Bert Braune , Gunter Waitl
IPC分类号： H01L33/00
CPC分类号： H01L33/486 , H01L33/52 , H01L33/54 , H01L2224/48091 , H01L2224/48247 , H01L2224/48472 , H01L2924/1815 , H01L2924/19107 , H01L2924/00014 , H01L2924/00
摘要： Disclosed is a radiation emitting and/or receiving semiconductor component comprising at least one radiation emitting and/or receiving semiconductor chip (1), which is disposed in a recess (2) of a housing base body (3) and is there encapsulated with an encapsulant (4) that is readily transparent to electromagnetic radiation emitted and/or received by the semiconductor chip (1). The recess (2) comprises a chip well (21) in which the semiconductor chip (1) is secured, and a trench (22) that runs at least partway around the chip well (21) inside the recess (2), such that between the chip well (21) and the trench (22) the housing base body (3) comprises a wall (23) whose apex, viewed from a bottom face of the chip well (21), lies below the level of the surface of the housing base body (3) from which the recess (2) leads into the housing base body (3), and the encapsulant (4) extends outward from the chip well (21) over the wall into the trench (22). A corresponding housing base body is also disclosed.
摘要翻译：公开了一种辐射发射和/或接收半导体部件，其包括至少一个辐射发射和/或接收半导体芯片（1），其布置在壳体基体（3）的凹部（2）中，并且被封装有对由半导体芯片（1）发射和/或接收的电磁辐射容易透明的密封剂（4）。凹部（2）包括其中固定有半导体芯片（1）的芯片阱（21）和在凹部（2）内部至少沿芯片阱（21）延伸的沟槽（22），使得在芯片井（21）和沟槽（22）之间，壳体基体（3）包括壁（23），其从芯片井（21）的底面观察其顶点位于下表面的水平面所述壳体基体（3）从所述凹部（2）引导到所述壳体基体（3）中，并且所述密封剂（4）从所述芯片孔（21）向外延伸到所述壁上进入所述沟槽（22）。还公开了相应的壳体基体。

18. 发明授权

US08110437B2 Method for attaching a semiconductor chip in a plastic encapsulant, optoelectronic semiconductor component and method for the production thereof 有权
标题翻译：用于将半导体芯片附着在塑料密封剂中的方法，光电子半导体部件及其制造方法
公开(公告)号：US08110437B2
公开(公告)日：2012-02-07
申请号：US10514461
申请日：2003-05-14
申请人： Gunter Waitl , Georg Bogner , Michael Hiegler , Matthias Winter
发明人： Gunter Waitl , Georg Bogner , Michael Hiegler , Matthias Winter
IPC分类号： H01L21/00
CPC分类号： H01L33/62 , H01L21/52 , H01L24/29 , H01L24/32 , H01L24/73 , H01L24/83 , H01L2224/29 , H01L2224/29007 , H01L2224/2908 , H01L2224/29101 , H01L2224/29111 , H01L2224/29139 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/48463 , H01L2224/48465 , H01L2224/73265 , H01L2224/8319 , H01L2224/83801 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01063 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/014 , H01L2924/07811 , H01L2924/12041 , H01L2924/157 , H01L2924/19043 , H01L2924/00014 , H01L2924/00 , H01L2924/01029 , H01L2924/00012 , H01L2924/01049 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2224/2929
摘要： A radiation-emitting or -receiving semiconductor chip 9 is soft-soldered for mounting on a leadframe 2 over which a prefabricated plastic encapsulant 5, a so-called premolded package, is injection-molded. Through the use of a low-melting solder 3 applied in a layer thickness of less than 10 μm, the soldering process can be carried out largely without thermal damage to the plastic encapsulant 5.
摘要翻译：辐射发射或接收半导体芯片9被软焊接以安装在引线框架2上，预成型的塑料密封剂5（所谓的预成型封装）被注射成型。通过使用以小于10μm的层厚度施加的低熔点焊料3，可以在很大程度上进行焊接工艺，而不会对塑料密封剂5造成热损伤。

19. 发明授权

US07948694B2 Apparatus for an optoelectronic device and componnent having an optoelectronic device and an apparatus 有权
标题翻译：用于光电器件和具有光电器件和器件的器件的设备
公开(公告)号：US07948694B2
公开(公告)日：2011-05-24
申请号：US11574055
申请日：2005-08-02
申请人： Georg Bogner , Michael Hiegler , Monika Rose , Günter Waitl , Manfred Wolf
发明人： Georg Bogner , Michael Hiegler , Monika Rose , Günter Waitl , Manfred Wolf
IPC分类号： G02B7/02
CPC分类号： H01L31/0203 , H01L31/02325 , H01L33/486 , H01L33/58 , H01L2224/48247 , H01L2224/73265 , H01L2924/3025 , H01L2224/48091 , H01L2924/00014 , H01L2924/00
摘要： An apparatus having a least one fixing element is specified, the fixing element being provided for fixing the apparatus to a housing body of an optoelectronic device and the apparatus being designed as a mount for a separate optical element.
摘要翻译：规定了具有至少一个固定元件的装置，所述固定元件用于将所述装置固定到光电装置的壳体上，并且所述装置被设计为用于单独光学元件的安装件。

20. 发明授权

US08288791B2 Housing body and method for production thereof 有权
标题翻译：壳体及其制造方法
公开(公告)号：US08288791B2
公开(公告)日：2012-10-16
申请号：US11921368
申请日：2006-05-05
申请人： Georg Bogner , Karlheinz Arndt
发明人： Georg Bogner , Karlheinz Arndt
IPC分类号： H01L23/047
CPC分类号： H01L33/62 , H01L23/49805 , H01L24/48 , H01L31/0203 , H01L33/486 , H01L2224/48091 , H01L2924/00014 , H01L2924/01068 , H01L2924/01077 , H01L2924/01078 , H01L2924/12044 , H01L2924/181 , H01L2924/3025 , H01L2224/45099 , H01L2224/45015 , H01L2924/207 , H01L2924/00
摘要： A package body (1) with an upper side (2), with an underside (22), opposite from the upper side (2), and with a side surface, which connects the upper side (2) and the underside (22) and is provided as a mounting surface (19), the package body (1) having a plurality of layers (8) which contain a ceramic material, and a main direction of extent of the layers (23, 24, 25) extending transversely in relation to the mounting surface (19). Furthermore, a method for producing a package body (1) is provided.
摘要翻译：具有上侧（2）的包装体（1），具有与上侧（2）相对的下侧（22），以及连接上侧（2）和下侧（22）的侧表面，并且设置为安装表面（19），所述封装主体（1）具有多个层（8），所述多个层（8）包含陶瓷材料，并且所述层（23,24,25）的横截面的主要方向横向延伸与安装表面（19）的关系。此外，提供了一种用于生产包装体（1）的方法。

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