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11. 发明申请

US20100227429A1 Fabrication of image sensor with improved signal to noise ratio 有权
标题翻译：具有提高信噪比的图像传感器制造
公开(公告)号：US20100227429A1
公开(公告)日：2010-09-09
申请号：US12454818
申请日：2009-05-22
申请人： Jin-Ho Kim , Chang-Rok Moon , Seung-Hun Shin
发明人： Jin-Ho Kim , Chang-Rok Moon , Seung-Hun Shin
IPC分类号： H01L21/02
CPC分类号： H01L27/14689 , H01L27/14609 , H01L27/14612 , H01L27/14641
摘要： For fabricating an image sensor, an isolation structure is formed to define a first active region of a semiconductor substrate. A first transistor and a second transistor of a unit pixel are formed in the first active region. In addition, a threshold voltage lowering region is formed in a portion of the semiconductor substrate near a portion of the isolation structure abutting the second transistor in the first active region. The threshold voltage lowering region causes the second transistor to have a respective threshold voltage magnitude that is lower than for the first transistor. The threshold voltage lowering region is formed simultaneously with a passivation region in a second active region having a photodiode formed therein.
摘要翻译：为了制造图像传感器，形成隔离结构以限定半导体衬底的第一有源区。在第一有源区中形成单位像素的第一晶体管和第二晶体管。此外，在靠近第一有源区域中的第二晶体管的隔离结构的一部分附近，在半导体衬底的一部分中形成阈值电压降低区域。阈值电压降低区域使得第二晶体管具有比第一晶体管低的相应阈值电压幅值。阈值电压降低区域与其中形成有光电二极管的第二有源区域中的钝化区域同时形成。

12. 发明申请

US20100214434A1 APPARATUS AND METHOD FOR ADJUSTING WHITE BALANCE OF DIGITAL IMAGE 审中-公开
标题翻译：调整数字图像白平衡的装置和方法
公开(公告)号：US20100214434A1
公开(公告)日：2010-08-26
申请号：US12638477
申请日：2009-12-15
申请人： Ji-Hye Kim , Sung-Dae Cho , Min-Kyu Park , Hee-Chan Park , Jin-Ho Kim , Yun-Je Oh , Kyoung-Tae Kim , Choon-Woo Kim , Seul-Ki Jang
发明人： Ji-Hye Kim , Sung-Dae Cho , Min-Kyu Park , Hee-Chan Park , Jin-Ho Kim , Yun-Je Oh , Kyoung-Tae Kim , Choon-Woo Kim , Seul-Ki Jang
IPC分类号： H04N9/73
CPC分类号： H04N9/735 , H04N9/73
摘要： A method and an apparatus are provided for adjusting white balance of a digital image. An input image is converted into a YCbCr color space. White pixels of the converted input image are detected by determining whether each pixel of the converted input image is included in a preset region of the YCbCr color space. A gain of each channel is calculated from averages of R, G and B values of the detected white pixels. White balance adjustment is performed by applying the calculated gain of each channel to each pixel of the input image.
摘要翻译：提供了一种用于调整数字图像的白平衡的方法和装置。将输入图像转换为YCbCr颜色空间。通过确定转换的输入图像的每个像素是否包括在YCbCr颜色空间的预设区域中来检测经转换的输入图像的白色像素。每个通道的增益由检测到的白色像素的R，G和B值的平均值计算。通过将每个通道的计算增益应用到输入图像的每个像素来执行白平衡调整。

13. 发明申请

US20100079629A1 APPARATUS AND METHOD FOR CORRECTING DEFECTIVE PIXEL 审中-公开
标题翻译：修正缺陷像素的装置和方法
公开(公告)号：US20100079629A1
公开(公告)日：2010-04-01
申请号：US12570839
申请日：2009-09-30
申请人： Min-Kyu PARK , Jin-Min Bang , Hee-Chan Park , Jin-Ho Kim , Ji-Hye Kim , Yun-Je Oh , Sung-Dae Cho
发明人： Min-Kyu PARK , Jin-Min Bang , Hee-Chan Park , Jin-Ho Kim , Ji-Hye Kim , Yun-Je Oh , Sung-Dae Cho
IPC分类号： H04N5/222
CPC分类号： H04N5/3675 , H04N9/045
摘要： Disclosed is an apparatus for correcting a value of a defective pixel based on values of neighboring pixels of the defective pixel, the apparatus includes a plurality of first-stage median filters for receiving a value of a target pixel and values of neighboring pixels of the target pixel, and outputting median values of the received values; and at least one second-stage median filter for receiving the value of the target pixel and the median values from the first-stage median filters, and outputting a median value of the values received by the second-stage median filter.
摘要翻译：公开了一种基于缺陷像素的相邻像素的值来校正缺陷像素的值的装置，该装置包括用于接收目标像素的值和目标像素的相邻像素的值的多个第一级中值滤波器像素，并输出接收值的中值; 以及至少一个第二级中值滤波器，用于从第一级中值滤波器接收目标像素的值和中值，并输出由第二级中值滤波器接收的值的中值。

14. 发明授权

US07667797B2 Liquid crystal display device and method of fabricating the same 有权
标题翻译：液晶显示装置及其制造方法
公开(公告)号：US07667797B2
公开(公告)日：2010-02-23
申请号：US11643499
申请日：2006-12-20
申请人： Sung-Soo Chang , Woo-Hyun Kim , Jin-Ho Kim
发明人： Sung-Soo Chang , Woo-Hyun Kim , Jin-Ho Kim
IPC分类号： G02F1/1335
CPC分类号： G02F1/133555 , G02F1/133504 , G02F1/133514
摘要： A liquid crystal display device includes an array substrate having reflective and transmissive regions in a pixel region, wherein the array substrate includes a reflective electrode corresponding to the reflective region and a pixel electrode on a first substrate. A color filter substrate defines the reflective region and the transmissive region in the pixel region. The color filter substrate includes a color filter with first and second portions that correspond to the respective transmissive and reflective regions on a second substrate. The thickness of the second portion is less than a thickness of the first portion. The combined thickness of the scatter and the thickness of the second portion is greater than the thickness of the first portion; and a liquid crystal layer between the array and color filter substrates.
摘要翻译：一种液晶显示装置，具备在像素区域具有反射和透射区域的阵列基板，其中阵列基板包括对应于反射区域的反射电极和在第一基板上的像素电极。滤色器基板限定像素区域中的反射区域和透射区域。滤色器基板包括滤色器，滤色器具有对应于第二基板上的相应透射和反射区域的第一和第二部分。第二部分的厚度小于第一部分的厚度。第二部分的散射和厚度的组合厚度大于第一部分的厚度; 以及阵列和滤色器基板之间的液晶层。

15. 发明申请

US20090226776A1 HYDROGEN CHARGING APPARATUS 审中-公开
标题翻译：氢气充电器
公开(公告)号：US20090226776A1
公开(公告)日：2009-09-10
申请号：US12144957
申请日：2008-06-24
申请人： Jin-Ho Kim , Kyoung-hwan Choi , Jae-yong Lee
发明人： Jin-Ho Kim , Kyoung-hwan Choi , Jae-yong Lee
IPC分类号： H01M8/04 , H01M8/18
CPC分类号： C01B3/0057 , C01B3/065 , C01B3/08 , C01B2203/066 , C25B1/003 , C25B1/04 , F17C11/005 , H01M8/04201 , Y02E60/321 , Y02E60/327 , Y02E60/362 , Y02E60/366
摘要： A hydrogen charging apparatus having a cooling unit in which the hydrogen charging apparatus includes a hydrogen generation unit that generates hydrogen, a hydrogen charging unit that charges hydrogen to a hydrogen storage medium, and a cooling unit that reduces the pressure of hydrogen to a suitable level for charging by cooling the hydrogen storage medium during charging the hydrogen.
摘要翻译：一种具有冷却单元的氢气充电装置，其中氢气充电装置包括产生氢气的氢产生单元，将氢气充入氢存储介质的氢气充电单元，以及将氢气压力降低至适当水平的冷却单元用于在对氢充电期间冷却储氢介质进行充电。

16. 发明授权

US07364784B2 Thin semiconductor package having stackable lead frame and method of manufacturing the same 失效
公开(公告)号：US07364784B2
公开(公告)日：2008-04-29
申请号：US10834187
申请日：2004-04-29
申请人： Jin-Ho Kim , Sung-Hwan Yoon
发明人： Jin-Ho Kim , Sung-Hwan Yoon
IPC分类号： H01L23/495 , H01L21/784
CPC分类号： H01L23/4951 , H01L23/3107 , H01L23/49551 , H01L24/48 , H01L25/105 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/4826 , H01L2224/73215 , H01L2225/1029 , H01L2225/1058 , H01L2924/00014 , H01L2924/01079 , H01L2924/07802 , Y10T428/24207 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： Provided is a thin semiconductor package comprising a semiconductor chip and a lead frame, the lead frame including a paddle portion configured for mounting the semiconductor chip in a manner that exposes bonding pads within an aperture formed in a center portion of the lead frame and a peripheral terminal pad portion for establishing external contacts. A plurality of bonding wires are used to establish electrical connection between a lower surface of the paddle part and corresponding bonding pads with intermediate leads providing connection to the terminal pad portions. The semiconductor chip, lead frame and bonding wires may then be encapsulated to form a thin semiconductor package having a thickness substantially equal to that of the terminal pad portions. The thin semiconductor packages may, in turn, be used to form multi-chip stack packages using known good semiconductor chips to form a high-density compound semiconductor packages.

17. 发明授权

US07364659B2 Preparation of asymmetric polyethylene hollow fiber membrane 有权
标题翻译：不对称聚乙烯中空纤维膜的制备
公开(公告)号：US07364659B2
公开(公告)日：2008-04-29
申请号：US11211889
申请日：2005-08-24
申请人： Moon-Seog Jang , Sung-Soo Kim , Myung-Nam Han , Jin-Ho Kim , Min-Soo Park
发明人： Moon-Seog Jang , Sung-Soo Kim , Myung-Nam Han , Jin-Ho Kim , Min-Soo Park
IPC分类号： B01D39/00 , B01D39/26 , B29C47/00 , B29C47/12 , B29C71/00 , D01D5/14 , B01D63/00
CPC分类号： B01D71/26 , B01D67/0088 , B01D69/08 , B01D69/087 , B01D2323/08 , B01D2323/14 , B01D2323/26 , B01D2323/42 , B01D2325/02
摘要： A porous polyethylene hollow fiber membrane having a pore-size gradient across the inner and outer surfaces thereof is prepared by introducing, during the cooling step of a melt-spun polyethylene hollow fiber, a nitrogen flow and a solvent having a boiling point in the range of 30 to 80° C. to the inner and outer surfaces of the melt-spun hollow fiber, respectively.
摘要翻译：在熔融纺丝的聚乙烯中空纤维的冷却步骤中，通过将沸点在该范围内的氮气流和溶剂引入，制备其内表面和外表面上具有孔径梯度的多孔聚乙烯中空纤维膜分别为熔融中空纤维的内表面和外表面30至80℃。

18. 发明申请

US20060174027A1 Method and apparatus for transmission queue in communication system 审中-公开
标题翻译：通信系统中传输队列的方法和装置
公开(公告)号：US20060174027A1
公开(公告)日：2006-08-03
申请号：US11341265
申请日：2006-01-26
申请人： Jin-Ho Kim , Kab-Joo Lee
发明人： Jin-Ho Kim , Kab-Joo Lee
IPC分类号： G06F15/16
CPC分类号： H04W72/1242 , H04L47/10 , H04L47/14 , H04L47/2408 , H04L47/2441 , H04L49/90 , H04L69/12
摘要： Disclosed is a wireless LAN system comprising: a memory; a central processing unit segmenting data, which is to be transferred, into frames, generating descriptors containing frame addresses and lengths in the memory, and storing the segmented frames and the descriptors into the memory in accordance with transmission priorities; a media accessing controller calling the frames of data, which is to be transferred, from the memory with reference to the transmission priorities and the descriptors, and temporarily storing the frames; and a transmitter transferring the frames stored in the media accessing controller. It is possible to improve data transmission speed and control facility, satisfying the quality of service for a standard of communication protocol.
摘要翻译：公开了一种无线LAN系统，包括：存储器; 中央处理单元将要传送的数据分成帧，生成包含存储器中的帧地址和长度的描述符，并根据传输优先级将分段帧和描述符存储到存储器中; 媒体访问控制器，参照发送优先级和描述符从存储器调用要传送的数据帧，并临时存储帧; 以及传送存储在媒体访问控制器中的帧的发射机。可以提高数据传输速度和控制设施，满足通信协议标准的服务质量。

19. 发明授权

US07061087B2 Multi-package stack module 失效
标题翻译：多包堆栈模块
公开(公告)号：US07061087B2
公开(公告)日：2006-06-13
申请号：US10678412
申请日：2003-10-02
申请人： Jin-Ho Kim
发明人： Jin-Ho Kim
IPC分类号： H01L23/538
CPC分类号： H01L25/105 , H01L24/73 , H01L2224/16225 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48145 , H01L2224/48227 , H01L2224/73265 , H01L2225/1023 , H01L2225/1058 , H01L2924/15311 , H01L2924/19041 , H01L2924/19105 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A multi-package module comprises a plurality of stacked packages including an upper package and a lower package. Each package comprises a board having located on a first side thereof a chip installation area and a bump pad area; at least one chip disposed in the chip installation area; a plurality of redistribution patterns formed on the board and electrically connected to the chip; and a plurality of first bump pads formed in the bump pad area which are electrically connected to the redistribution patterns. The respective packages are electrically connected by connecting bump pads of the upper package to bump pads of the lower package. Further, the chip installation area of the upper and lower packages not being in vertical alignment with each other.
摘要翻译：多封装模块包括多个堆叠封装，包括上封装和下封装。每个包装包括在其第一侧上具有芯片安装区域和凸块焊盘区域的板; 设置在芯片安装区域中的至少一个芯片; 形成在所述板上并电连接到所述芯片的多个再分布图案; 以及形成在所述凸块焊盘区域中的电连接到所述再分布图案的多个第一凸点焊盘。相应的封装通过将上封装的凸块焊盘连接到下封装的凸块焊盘而电连接。此外，上下包装件的芯片安装区域彼此不垂直对准。

20. 发明申请

US20060027901A1 Stacked chip package with exposed lead-frame bottom surface 审中-公开
标题翻译：堆叠芯片封装带有裸露的引线框底面
公开(公告)号：US20060027901A1
公开(公告)日：2006-02-09
申请号：US10913319
申请日：2004-08-09
申请人： Ming-Sung Tsai , Jin-Ho Kim , Eul-Chul Jang
发明人： Ming-Sung Tsai , Jin-Ho Kim , Eul-Chul Jang
IPC分类号： H01L23/48
CPC分类号： H01L24/33 , H01L23/49551 , H01L23/49575 , H01L24/48 , H01L2224/32014 , H01L2224/32145 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/00014 , H01L2924/01027 , H01L2924/01033 , H01L2924/01082 , H01L2924/14 , H01L2924/181 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A stacked chip package with exposed lead-frame bottom surface is disclosed. The stacked chip package includes a first die encapsulated in an encapsulated molding compound, which is mounted on an active surface of a second die. A bottom surface of the second die is mounted to a top surface of a die supporting section of the lead-frame. The bottom surface of the die supporting section is exposed outside the encapsulated molding compound. A plurality of bonding wires electrically interconnect the die pads of the first die and the second die to the corresponding lead fingers. Moreover, each lead finger of the lead-frame is preferably formed with a deflected structure with a bent section, which enables the dimension size of the stacked chip package to get more compact.
摘要翻译：公开了具有暴露的引线框底面的堆叠式芯片封装。堆叠的芯片封装包括封装在封装的模塑料中的第一模具，其被安装在第二模具的有效表面上。第二模具的底面安装在引线框架的模具支撑部分的顶表面上。模具支撑部分的底表面暴露在封装的模塑料的外部。多个接合线将第一管芯和第二管芯的管芯焊盘电连接到相应的引线指。此外，引线框架的每个引线指状件优选地形成有具有弯曲部分的偏转结构，这使得堆叠的芯片封装的尺寸尺寸变得更加紧凑。

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