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11. 发明申请

US20110086466A1 CONTACT FABRICATION OF EMITTER WRAP-THROUGH BACK CONTACT SILICON SOLAR CELLS 审中-公开
标题翻译：联系制造发射器缠绕 - 反向接触硅太阳能电池
公开(公告)号：US20110086466A1
公开(公告)日：2011-04-14
申请号：US12965592
申请日：2010-12-10
申请人： Peter HACKE , James M. Gee
发明人： Peter HACKE , James M. Gee
IPC分类号： H01L31/0224
CPC分类号： H01L31/0682 , H01L31/022458 , H01L31/1804 , Y02E10/547 , Y02P70/521
摘要： Back contact solar cells including rear surface structures and methods for making same. The rear surface has small contact areas through at least one dielectric layer, including but not limited to a passivation layer, a nitride layer, a diffusion barrier, and/or a metallization barrier. The dielectric layer is preferably screen printed. Large grid areas overlay the dielectric layer. The methods provide for increasing efficiency by minimizing p-type contact areas and maximizing n-type doped regions on the rear surface of a p-type substrate.
摘要翻译：背面接触太阳能电池，包括后表面结构及其制造方法。后表面通过至少一个电介质层具有小的接触面积，包括但不限于钝化层，氮化物层，扩散阻挡层和/或金属化屏障。电介质层优选丝网印刷。大电网区覆盖电介质层。这些方法通过最小化p型接触面积和使p型衬底的后表面上的n型掺杂区域最大化来提高效率。

12. 发明申请

US20100012172A1 Photovoltaic Modules Manufactured Using Monolithic Module Assembly Techniques 审中-公开
标题翻译：使用整体模块装配技术制造的光伏组件
公开(公告)号：US20100012172A1
公开(公告)日：2010-01-21
申请号：US12432706
申请日：2009-04-29
申请人： David H. Meakin , James M. Gee , Sysavanh Southimath , Brian Murphy , John Telle , Andrew Mark Mitchell
发明人： David H. Meakin , James M. Gee , Sysavanh Southimath , Brian Murphy , John Telle , Andrew Mark Mitchell
IPC分类号： H01L31/048 , H01L31/042
CPC分类号： H01L31/0201 , H01L31/02013 , H01L31/048 , H01L31/049 , H01L31/0516 , H02S40/34 , Y02E10/50
摘要： Photovoltaic modules comprising back-contact solar cells manufactured using monolithic module assembly techniques comprising a flexible circuit comprising a back sheet and a patterned metallization. The module may comprise busses in electrical contact with the patterned metallization to extract the current. The module may alternatively comprise multilevel metallizations. Interlayer dielectric comprising islands or dots relieves stresses due to thermal mismatch. The use of multiple cord plates enables flexible circuit layouts, thus optimizing the module. The modules preferably comprise a thermoplastic encapsulant and/or hybrid adhesive/solder materials. An ultrathin moisture barrier enables roll-to-roll processing.
摘要翻译：包括使用整体模块组装技术制造的背接触式太阳能电池的光伏模块，该技术包括包含背板和图案化金属化的柔性电路。模块可以包括与图案化的金属化物电接触以提取电流的母线。该模块可以替代地包括多层金属化。包含岛或点的层间电介质减轻了由于热失配引起的应力。使用多个电缆板可实现灵活的电路布局，从而优化模块。模块优选地包括热塑性密封剂和/或混合粘合剂/焊料材料。超薄防潮屏障可实现卷对卷加工。

13. 发明授权

US06969874B1 Flip-chip light emitting diode with resonant optical microcavity 有权
标题翻译：具有谐振光学微腔的倒装芯片发光二极管
公开(公告)号：US06969874B1
公开(公告)日：2005-11-29
申请号：US10459965
申请日：2003-06-12
申请人： James M. Gee , Katherine H. A. Bogart , Arthur J. Fischer
发明人： James M. Gee , Katherine H. A. Bogart , Arthur J. Fischer
IPC分类号： H01L33/10 , H01L33/40 , H01L33/46 , H01L33/00
CPC分类号： H01L33/405 , H01L33/105 , H01L33/465 , H01L2224/05124 , H01L2224/05166 , H01L2224/05568 , H01L2224/05573 , H01L2224/05624 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/05664 , H01L2224/05666 , H01L2224/05669 , H01L2224/13 , H01L2924/00014
摘要： A flip-chip light emitting diode with enhanced efficiency. The device structure employs a microcavity structure in a flip-chip configuration. The microcavity enhances the light emission in vertical modes, which are readily extracted from the device. Most of the rest of the light is emitted into waveguided lateral modes. Flip-chip configuration is advantageous for light emitting diodes (LEDs) grown on dielectric substrates (e.g., gallium nitride LEDs grown on sapphire substrates) in general due to better thermal dissipation and lower series resistance. Flip-chip configuration is advantageous for microcavity LEDs in particular because (a) one of the reflectors is a high-reflectivity metal ohmic contact that is already part of the flip-chip configuration, and (b) current conduction is only required through a single distributed Bragg reflector. Some of the waveguided lateral modes can also be extracted with angled sidewalls used for the interdigitated contacts in the flip-chip configuration.
摘要翻译：一种具有提高效率的倒装芯片发光二极管。器件结构采用倒装芯片配置的微腔结构。微腔增强垂直模式的光发射，这些模式很容易从设备中提取出来。其余的大部分光发射到波导横向模式。倒装芯片配置对于通常由于更好的热耗散和较低的串联电阻而在电介质基板（例如，蓝宝石衬底上生长的氮化镓LED）上生长的发光二极管（LED）是有利的。倒装芯片配置对于微腔LED尤为有利，特别是因为（a）反射器中的一个是已经是倒装芯片配置的一部分的高反射率金属欧姆接触，（b）电流传导仅需要通过单个分布布拉格反射器。一些波导横向模式也可以以倒装芯片配置中用于叉指触点的成角度的侧壁来提取。

14. 发明授权

US06611085B1 Photonically engineered incandescent emitter 有权
公开(公告)号：US06611085B1
公开(公告)日：2003-08-26
申请号：US09940962
申请日：2001-08-27
申请人： James M. Gee , Shawn-Yu Lin , James G. Fleming , James B. Moreno
发明人： James M. Gee , Shawn-Yu Lin , James G. Fleming , James B. Moreno
IPC分类号： H01K102
CPC分类号： H01K1/50 , H01K1/04 , H01K3/02 , H01L33/02
摘要： A photonically engineered incandescence is disclosed. The emitter materials and photonic crystal structure can be chosen to modify or suppress thermal radiation above a cutoff wavelength, causing the emitter to selectively emit in the visible and near-infrared portions of the spectrum. An efficient incandescent lamp is enabled thereby. A method for fabricating a three-dimensional photonic crystal of a structural material, suitable for the incandescent emitter, is also disclosed.

15. 发明授权

US5951786A Laminated photovoltaic modules using back-contact solar cells 失效
标题翻译：使用背接触太阳能电池的层压光伏组件
公开(公告)号：US5951786A
公开(公告)日：1999-09-14
申请号：US994071
申请日：1997-12-19
申请人： James M. Gee , Stephen E. Garrett , William P. Morgan , Walter Worobey
发明人： James M. Gee , Stephen E. Garrett , William P. Morgan , Walter Worobey
IPC分类号： H01L31/048 , H01L31/05
CPC分类号： B32B17/10018 , B32B17/10788 , H01L31/048 , H01L31/0512 , H01L31/0516 , Y02E10/50
摘要： Photovoltaic modules which comprise back-contact solar cells, such as back-contact crystalline silicon solar cells, positioned atop electrically conductive circuit elements affixed to a planar support so that a circuit capable of generating electric power is created. The modules are encapsulated using encapsulant materials such as EVA which are commonly used in photovoltaic module manufacture. The module designs allow multiple cells to be electrically connected in a single encapsulation step rather than by sequential soldering which characterizes the currently used commercial practices.
摘要翻译：包括背接触太阳能电池（例如背接触晶体硅太阳能电池）的光伏模块被定位在固定到平面支撑件上的导电电路元件顶上，从而产生能够产生电力的电路。这些模块使用通常用于光伏组件制造的密封剂材料如EVA来封装。模块设计允许多个单元在单个封装步骤中电连接，而不是通过顺序焊接来表征当前使用的商业实践。

16. 发明申请

US20130052768A1 HIGH SPEED LASER SCANNING SYSTEM FOR SILICON SOLAR CELL FABRICATION 审中-公开
标题翻译：用于硅太阳能电池制造的高速激光扫描系统
公开(公告)号：US20130052768A1
公开(公告)日：2013-02-28
申请号：US13589922
申请日：2012-08-20
申请人： James M. Gee , Jeffrey L. Franklin
发明人： James M. Gee , Jeffrey L. Franklin
IPC分类号： H01L31/18
CPC分类号： B23K26/0838 , B23K26/0622 , H01L31/0463 , Y02E10/52
摘要： A laser scanning apparatus that uses a polygonal mirror and a beam shaper for laser drilling of holes in one or more layers during solar cell fabrication is provided. The apparatus may be used to laser drill holes in a back side passivation layer of a solar cell during back electrical contact formation. The apparatus includes the use of a polygonal mirror to improve the speed of the back electrical formation of a solar cell. The apparatus may also include the use of a beam shaper to tune the profile of the beam to prevent damage to the underlying solar cell substrate during laser drilling operations. A laser scanning module is provided which controls the speed and timing of linear movement of substrates and the operation of the laser scanning apparatus in a closed loop manner for laser drilling of material layers disposed on the substrates.
摘要翻译：提供一种激光扫描装置，其在太阳能电池制造期间使用多面镜和光束整形器在一个或多个层中激光钻孔。该装置可用于在后电接触形成期间在太阳能电池的背侧钝化层中激光钻孔。该装置包括使用多面镜来提高太阳能电池的背面电气形成的速度。该装置还可以包括使用光束整形器来调整光束的轮廓，以防止在激光钻孔操作期间损坏下面的太阳能电池基板。提供激光扫描模块，其控制基板的线性移动的速度和时间以及激光扫描装置的操作，以闭环方式激光钻孔设置在基板上的材料层。

17. 发明申请

US20120244723A1 LASER DRILLING OF VIAS IN BACK CONTACT SOLAR CELLS 审中-公开
标题翻译：在接触太阳能电池的激光钻探VIAS
公开(公告)号：US20120244723A1
公开(公告)日：2012-09-27
申请号：US13496762
申请日：2010-09-17
申请人： Jeff M. Franklin , James M. Gee
发明人： Jeff M. Franklin , James M. Gee
IPC分类号： H01L21/268 , B23K26/00
CPC分类号： B23K26/082 , B23K26/0665 , B23K26/382 , B23K26/40 , B23K2103/50 , H01L31/022458 , Y02E10/50
摘要： Embodiments of the invention relate to methods and apparatus for laser drilling holes in a silicon substrate during the fabrication of back contact solar cells, such as emitter-wrap-through (EWT) solar cells. In one embodiment, the method and apparatus use a short focal length flat field lens and a dynamic scanning technique to accomplish single pulse drilling in the silicon substrate. The method and apparatus result in increased speed and quality of holes in an EWT solar cell substrate as compared to conventional apparatus and processes.
摘要翻译：本发明的实施例涉及在制造背接触太阳能电池（例如发射器包裹（EWT）太阳能电池）期间在硅衬底中激光钻孔的方法和装置。在一个实施例中，该方法和装置使用短焦距平场透镜和动态扫描技术来在硅衬底中实现单脉冲钻孔。与常规设备和方法相比，该方法和装置导致EWT太阳能电池基板中的孔的速度和质量提高。

18. 发明申请

US20120227794A1 THRESHOLD ADJUSTMENT IMPLANTS FOR REDUCING SURFACE RECOMBINATION IN SOLAR CELLS 审中-公开
标题翻译：用于减少太阳能电池表面再生的阈值调整植入
公开(公告)号：US20120227794A1
公开(公告)日：2012-09-13
申请号：US13496740
申请日：2010-09-20
申请人： James M. Gee , Prabhat Kumar
发明人： James M. Gee , Prabhat Kumar
IPC分类号： H01L31/02 , H01L31/18
CPC分类号： H01L31/022458 , H01L31/0288 , Y02E10/50
摘要： Embodiments of the invention relate to methods of forming solar cell devices to reduce recombination losses and solar cell devices made by such methods, for example back contact solar cells, such as emitter-wrap-through (EWT) solar cells. The methods may include disposing an amount of impurities into a charge compensating region formed on a rear surface of a substrate and forming a rear surface passivation layer over at least a portion of the charge compensating region, wherein the amount of the impurities disposed in the charge compensating region is selected to compensate for an amount of charge formed in the rear surface passivation layer.
摘要翻译：本发明的实施例涉及形成太阳能电池器件以减少复合损耗的方法，以及通过这种方法制造的太阳能电池器件，例如背接触太阳能电池，例如发射极穿透（EWT）太阳能电池。所述方法可以包括将一定量的杂质设置在形成在基板的后表面上的电荷补偿区域中，并且在电荷补偿区域的至少一部分上形成后表面钝化层，其中设置在电荷中的杂质的量选择补偿区域以补偿在后表面钝化层中形成的电荷量。

19. 发明申请

US20120222736A1 FRONT CONTACT SOLAR CELL MANUFACTURE USING METAL PASTE METALLIZATION 审中-公开
标题翻译：前端接触太阳能电池制造使用金属气化金属化
公开(公告)号：US20120222736A1
公开(公告)日：2012-09-06
申请号：US13040946
申请日：2011-03-04
申请人： James M. Gee , Charles F. Gay
发明人： James M. Gee , Charles F. Gay
IPC分类号： H01L31/0224
CPC分类号： H01L31/022433 , Y02E10/50
摘要： Embodiments of the invention contemplate the formation of a high efficiency solar cell using novel methods to form metal contact structures of the solar cell device. In one embodiment, a solar cell device includes a substrate comprising a doped semiconductor material, a surface formed on the substrate having a second doped semiconductor layer having a conductivity type opposite to the first doped semiconductor material, a dielectric layer disposed on the surface of the substrate, a metal contact structure formed in the dielectric layer with a first predetermined cross sectional area, and a metal line formed on the metal contact structure with a second predetermined cross sectional area, wherein the second predetermined cross sectional area is larger than the first predetermined cross sectional area.
摘要翻译：本发明的实施例考虑使用新型方法形成太阳能电池器件的金属接触结构来形成高效太阳能电池。在一个实施例中，太阳能电池器件包括包括掺杂半导体材料的衬底，在衬底上形成的表面具有与第一掺杂半导体材料相反的导电类型的第二掺杂半导体层的表面，基板，形成在具有第一预定横截面积的电介质层中的金属接触结构，以及形成在具有第二预定横截面积的金属接触结构上的金属线，其中第二预定横截面积大于第一预定横截面积横截面面积。

20. 发明申请

US20120204938A1 INTERCONNECT TECHNOLOGIES FOR BACK CONTACT SOLAR CELLS AND MODULES 审中-公开
标题翻译：用于背面接触太阳能电池和模块的互连技术
公开(公告)号：US20120204938A1
公开(公告)日：2012-08-16
申请号：US13419264
申请日：2012-03-13
申请人： Peter HACKE , David H. Meakin , James M. Gee , Sysavanh Southimath , Brian Murphy
发明人： Peter HACKE , David H. Meakin , James M. Gee , Sysavanh Southimath , Brian Murphy
IPC分类号： H01L31/052 , H01L31/048 , H01L31/0203 , H01L31/0224 , H01L31/05
CPC分类号： H01L31/022441 , H01L31/0516 , Y02E10/50 , Y10T29/49171
摘要： Methods and systems for interconnecting back contact solar cells. The solar cells preferably have reduced area busbars, or are entirely busbarless, and current is extracted from a variety of points on the interior of the cell surface. The interconnects preferably relieve stresses due to solder reflow and other thermal effects. The interconnects may be stamped and include external or internal structures which are bonded to the solder pads on the solar cell. These structures are designed to minimize thermal stresses between the interconnect and the solar cell. The interconnect may alternatively comprise porous metals such as wire mesh, wire cloth, or expanded metal, or corrugated or fingered strips. The interconnects are preferably electrically isolated from the solar cell by an insulator which is deposited on the cell, placed on the cell as a discrete layer, or laminated directly to desired areas of the interconnect.
摘要翻译：用于互连背接触太阳能电池的方法和系统。太阳能电池优选地具有减小的面积母线，或者完全是无母线的，并且电流从电池表面内部的各种点提取。互连优选地减轻由于焊料回流和其它热效应引起的应力。互连可以被冲压并且包括结合到太阳能电池上的焊盘的外部或内部结构。这些结构被设计成使互连和太阳能电池之间的热应力最小化。互连可以可选地包括多孔金属，例如金属丝网，金属丝布或多孔金属，或波纹状或指形条。互连优选地通过绝缘体与太阳能电池电隔离，所述绝缘体沉积在电池上，作为离散层放置在电池上，或者直接层压到互连的期望区域。

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