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11. 发明申请

US20050098865A1 Image sensor package 审中-公开
标题翻译：图像传感器封装
公开(公告)号：US20050098865A1
公开(公告)日：2005-05-12
申请号：US10705377
申请日：2003-11-10
申请人： Jackson Hsieh , Jichen Wu , Worrell Tsai , Abnet Chen
发明人： Jackson Hsieh , Jichen Wu , Worrell Tsai , Abnet Chen
IPC分类号： H01L23/02 , H01L23/48 , H01L31/0203
CPC分类号： H01L31/0203 , H01L2224/48091 , H01L2924/00014
摘要： An image sensor package includes plural lower metal sheets, plural upper metal sheets stacked on the lower metal sheets, and an encapsulant for encapsulating the lower and upper metal sheets. The lower metal formed with a first hole, the upper metal sheets formed a second hole penetrated from the upper surface to the lower surface. Wherein the encapsulant filled into the second hole and first hole to tighten the upper metal sheets and the lower metal sheets. A photosensitive chip arranged within the chamber, plural wires for electrically connecting the chip to the upper surfaces of the lower metal sheets, and a transparent layer arranged on the frame layer to cover the chip.
摘要翻译：图像传感器封装包括多个下金属片，堆叠在下金属片上的多个上金属片，以及用于封装下金属片和上金属片的密封剂。形成有第一孔的下部金属，上部金属板形成从上表面向下表面贯穿的第二孔。其中密封剂填充到第二孔和第一孔中以收紧上金属片和下金属片。布置在室内的感光芯片，用于将芯片电连接到下金属片的上表面的多根电线以及布置在框架层上以覆盖芯片的透明层。

12. 发明申请

US20050078457A1 Small memory card 审中-公开
标题翻译：小存储卡
公开(公告)号：US20050078457A1
公开(公告)日：2005-04-14
申请号：US10683839
申请日：2003-10-09
申请人： Jackson Hsieh , Jichen Wu , Abnet Chen
发明人： Jackson Hsieh , Jichen Wu , Abnet Chen
IPC分类号： H05K7/20
CPC分类号： H05K7/20463
摘要： A small memory card includes a first substrate, a heat sink, a second substrate, at least one upper memory chip, at least one bottom memory chip and a glue layer. The heat sink is arranged between the first substrate and second substrate, and contacted with the metal, which are filled within the plurality of through holes, which formed between the first substrate and second substrate. And each of the upper memory chips and bottom memory chips are mounted on the first substrate and the second substrate, so that the heat of the upper and bottom memory chips may be traveled to the heat sink via the metal, which is filled within the through hole, then the heat will be dispersed. Thus, the small memory card of present invention having high function of disperses heat to promote its durability and lifetime effectively, the manufacturing processes must be simplified and the manufacturing cost must decrease also.
摘要翻译：小型存储卡包括第一基板，散热器，第二基板，至少一个上部存储器芯片，至少一个底部存储器芯片和胶合层。散热器布置在第一基板和第二基板之间，并且与形成在第一基板和第二基板之间的多个通孔中填充的金属接触。并且上部存储器芯片和底部存储器芯片中的每一个安装在第一基板和第二基板上，使得上部和下部存储器芯片的热量可以经由金属行进到散热器，该金属填充在通孔孔，那么热会分散。因此，本发明的小型存储卡具有高散热功能以有效提高其耐用性和寿命，因此制造工艺必须简化，制造成本也必须降低。

13. 发明申请

US20050012027A1 Image sensor and method for packaging the same 审中-公开
标题翻译：图像传感器和包装方法
公开(公告)号：US20050012027A1
公开(公告)日：2005-01-20
申请号：US10621991
申请日：2003-07-16
申请人： Jackson Hsieh , Jichen Wu
发明人： Jackson Hsieh , Jichen Wu
IPC分类号： H01L27/00 , H01L27/146 , H01L31/00 , H01L31/0203
CPC分类号： H01L27/14618 , H01L31/0203 , H01L2224/32245 , H01L2224/48247 , H01L2224/73265 , H01L2924/16195 , H01L2924/00
摘要： An image sensor includes plural lower metal sheets, plural upper metal sheets stacked on the lower metal sheets, and an encapsulant for encapsulating the lower and upper metal sheets, wherein the upper surfaces of the upper metal sheets are exposed from the encapsulant, the lower surfaces of the lower metal sheets are exposed from the encapsulant, and the encapsulant is formed with a frame layer around the upper surfaces of the upper metal sheets to define a chamber together with the upper metal sheets. The image sensor further includes a photosensitive chip arranged within the chamber, plural wires for electrically connecting the chip to the upper surfaces of the upper metal sheets, and a transparent layer arranged on the frame layer to cover the chip.
摘要翻译：图像传感器包括多个下金属片，堆叠在下金属片上的多个上金属片和用于封装下金属片和上金属片的密封剂，其中上金属片的上表面从密封剂露出，下表面的下部金属片从密封剂露出，并且密封剂在上金属片的上表面周围形成有框架层，以与上金属片一起限定室。图像传感器还包括布置在腔室内的感光芯片，用于将芯片电连接到上金属片的上表面的多根电线以及布置在框架层上以覆盖芯片的透明层。

14. 发明申请

US20050012026A1 Image sensor and method for packaging the same 审中-公开
标题翻译：图像传感器和包装方法
公开(公告)号：US20050012026A1
公开(公告)日：2005-01-20
申请号：US10621990
申请日：2003-07-16
申请人： Jackson Hsieh , Jichen Wu , Shuen Yang , Worrell Tsai
发明人： Jackson Hsieh , Jichen Wu , Shuen Yang , Worrell Tsai
IPC分类号： H01L27/00 , H01L27/146 , H01L31/00 , H01L31/0203
CPC分类号： H01L27/14618 , H01L31/0203 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/16195 , H01L2924/00014 , H01L2924/00
摘要： An image sensor includes a lower metal sheet set, an upper metal sheet set, an encapsulant, a photosensitive chip, plural wires, and a transparent layer. The lower metal sheet set includes plural lower metal sheets and a lower middle board arranged among and flush with the lower metal sheets. The upper metal sheet set includes plural upper metal sheets and an upper middle board arranged among and flush with the upper metal sheets. The encapsulant encapsulates the lower metal sheets, lower middle board, upper metal sheets and upper middle board with the upper metal sheets, lower metal sheets, lower middle board, and upper middle board exposed from the encapsulant, and with a frame layer formed around the upper metal sheets to define a chamber. The photosensitive chip is arranged on the upper surface of the upper middle board and located within the chamber.
摘要翻译：图像传感器包括下金属片组，上金属片组，密封剂，感光芯片，多根线和透明层。下部金属板组包括多个下部金属片和布置在下部金属片中并与之相齐平的下部中间板。上金属片组包括多个上金属片和布置在上金属片中并与之齐平的上中间板。密封剂用从密封剂露出的上金属片，下金属片，下中间板和上中间板封装下金属片，下中间板，上金属片和上中间板，并且围绕上部金属板来限定一个室。感光芯片布置在上中间板的上表面上并位于室内。

15. 发明申请

US20050098710A1 Image sensor package 审中-公开
标题翻译：图像传感器封装
公开(公告)号：US20050098710A1
公开(公告)日：2005-05-12
申请号：US10705378
申请日：2003-11-10
申请人： Jackson Hsieh , Jichen Wu , Channing Wel , Bird Lin
发明人： Jackson Hsieh , Jichen Wu , Channing Wel , Bird Lin
IPC分类号： H01L27/00 , H01L31/0203
CPC分类号： H01L31/0203 , H01L27/14618 , H01L2224/32245 , H01L2224/48247 , H01L2224/73265 , H01L2924/00
摘要： The invention provides an image sensor package including a substrate, a frame layer, a photosensitive chip, a plurality of wires, and a transparent layer. The substrate includes plural metal sheets, which are spaced apart and arranged in an alternating manner, each of the metal sheets have a first board and a second board positioned at different heights, the thicken of outside ends of the first board are smaller than the inside ends of the first board, a encapsulate layer encapsulated the plural metal sheets to form a upper surface and a lower surface, so that the outside ends of the first board and the second board are exposed from the encapsulate layer. The frame layer is formed around and under the substrate to form a cavity with the substrate. The photosensitive chip is positioned on upper surface of the substrate and within the cavity. The wires are electrically connecting the outside ends of the first boards to the photosensitive chip. The transparent layer placed on the frame layer to cover the photosensitive chip.
摘要翻译：本发明提供一种图像传感器封装，其包括基板，框架层，感光芯片，多根导线和透明层。该基板包括间隔开并交替排列的多个金属片，每个金属片具有位于不同高度的第一板和第二板，第一板的外侧端部的加厚度小于内侧第一板的端部，封装层封装多个金属板以形成上表面和下表面，使得第一板和第二板的外端从封装层露出。框架层形成在基底周围和下方，以与衬底形成空腔。光敏芯片位于基板的上表面和腔内。导线将第一板的外端电连接到感光芯片。透明层放置在框架层上以覆盖感光芯片。

16. 发明申请

US20050012170A1 Image sensor having an improved transparent layer 有权
公开(公告)号：US20050012170A1
公开(公告)日：2005-01-20
申请号：US10621992
申请日：2003-07-16
申请人： Jackson Hsieh , Jichen Wu , Channing Wel , Bird Lin
发明人： Jackson Hsieh , Jichen Wu , Channing Wel , Bird Lin
IPC分类号： H01L31/0203 , H01L31/0232
CPC分类号： H01L31/0203 , H01L2224/48091 , H01L2224/48227 , H01L2924/00014
摘要： An image sensor having an improved transparent layer includes a substrate, a frame layer, a photosensitive chip, a plurality of wires, and a transparent layer. The substrate has an upper surface formed with a plurality of first connected points. The frame layer is arranged on the upper surface of the substrate so as to form a cavity together with the substrate. The photosensitive chip is mounted on the upper surface of the substrate and within the cavity. The plurality of wires are electrically connected the photosensitive chip to the first connected point of the substrate. The transparent layer is covered on the frame layer for covering the photosensitive chip so that the photosensitive chip may receive optical signals passing through the transparent layer, respectively, at the peripheries of the transparent layer are formed with cut-corners. Therefore, the transparent layer may be decreased collision and may be increased the cleanness of the transparent layer, therefore, simplifying the manufacturing processes and decreasing the manufacturing cost.

17. 发明授权

US06910637B2 Stacked small memory card 失效
标题翻译：堆叠小存储卡
公开(公告)号：US06910637B2
公开(公告)日：2005-06-28
申请号：US10683838
申请日：2003-10-09
申请人： Jackson Hsieh , Jichen Wu , Abnet Chen
发明人： Jackson Hsieh , Jichen Wu , Abnet Chen
IPC分类号： G06K19/02 , G06K19/077 , H05K1/02 , H05K1/14 , H05K3/28 , G06K19/06
CPC分类号： G06K19/0773 , G06K19/02 , G06K19/077 , H01L2224/48091 , H01L2224/48227 , H05K1/0206 , H05K1/144 , H05K3/0061 , H05K3/284 , H05K2201/043 , H01L2924/00014
摘要： A stacked small memory card includes an upper memory card and a lower memory card, the upper memory card and the lower memory card respectively formed a first heat sink and a second heat sink, the first heat sink and the second heat sink are stacked together, so that, the heat of the upper memory card and the lower memory card may be dispersed via the first heat sink and the second heat sink. Thus, the stacked small memory card of present invention having high function of disperses heat to promote its durability and lifetime effectively.
摘要翻译：堆叠式小存储卡包括上存储卡和下存储卡，上存储卡和下存储卡分别形成第一散热器和第二散热器，第一散热器和第二散热器堆叠在一起，使得上存储卡和下存储卡的热量可以经由第一散热器和第二散热器分散。因此，本发明的堆叠式小型存储卡具有高散热功能，有效地提高了其耐久性和寿命。

18. 发明申请

US20050098709A1 Image sensor package 审中-公开
标题翻译：图像传感器封装
公开(公告)号：US20050098709A1
公开(公告)日：2005-05-12
申请号：US10705376
申请日：2003-11-10
申请人： Jackson Hsieh , Jichen Wu , Eric Chang , Kenny Chen
发明人： Jackson Hsieh , Jichen Wu , Eric Chang , Kenny Chen
IPC分类号： H01L27/00 , H01L31/0203
CPC分类号： H01L31/0203 , H01L27/14618 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2924/00014
摘要： An image sensor package includes plural lower metal sheets, plural upper metal sheets stacked on the lower metal sheets, and an encapsulant for encapsulating the lower and upper metal sheets. Wherein the upper metal sheets are shorter than that of the lower metal sheets, so the upper surface of the lower metal sheets are exposed from the encapsulant. A photosensitive chip arranged within the chamber, plural wires are for electrically connecting the chip to the upper surfaces of the lower metal sheets, and a transparent layer arranged on the frame layer to cover the chip.
摘要翻译：图像传感器封装包括多个下金属片，堆叠在下金属片上的多个上金属片，以及用于封装下金属片和上金属片的密封剂。其中上金属片比下金属片短，因此下金属片的上表面从密封剂露出。布置在腔室内的感光芯片用于将芯片电连接到下金属片的上表面，以及设置在框架层上以覆盖芯片的透明层。

19. 发明申请

US20050012207A1 Substrate structure for an integrated circuit package and method for manufacturing the same 审中-公开
标题翻译：集成电路封装的基板结构及其制造方法
公开(公告)号：US20050012207A1
公开(公告)日：2005-01-20
申请号：US10621987
申请日：2003-07-16
申请人： Jackson Hsieh , Jichen Wu
发明人： Jackson Hsieh , Jichen Wu
IPC分类号： H01L23/498 , H01L23/06
CPC分类号： H01L23/49805 , H01L23/49861 , H01L2924/0002 , H01L2924/00
摘要： A substrate structure for an integrated circuit package to be electrically connected to a printed circuit board. The substrate structure includes a plurality of lower metal sheets arranged in an array, a plurality of upper metal sheets arranged in an array, and an encapsulant for encapsulating the lower metal sheets and the upper metal sheets. Each of the lower metal sheets has an upper surface and a lower surface. Each of the upper metal sheets has an upper surface and a lower surface, and the lower surfaces of the upper metal sheets are stacked on the upper surfaces of the lower metal sheets. The upper surfaces of the upper metal sheets are exposed from the encapsulant, and the lower surfaces of the lower metal sheets are exposed from the encapsulant and electrically connected to the printed circuit board.
摘要翻译：一种用于集成电路封装的基板结构，其电连接到印刷电路板。基板结构包括排列成阵列的多个下金属片，排列成阵列的多个上金属片，以及用于封装下金属片和上金属片的密封剂。每个下部金属片具有上表面和下表面。每个上金属片具有上表面和下表面，并且上金属片的下表面堆叠在下金属片的上表面上。上部金属板的上表面从密封剂露出，下部金属板的下表面从密封剂露出并电连接到印刷电路板。

20. 发明申请

US20050012024A1 Image sensor module and method for manufacturing the same 审中-公开
标题翻译：图像传感器模块及其制造方法
公开(公告)号：US20050012024A1
公开(公告)日：2005-01-20
申请号：US10621985
申请日：2003-07-16
申请人： Jackson Hsieh , Jichen Wu , Abnet Chen
发明人： Jackson Hsieh , Jichen Wu , Abnet Chen
IPC分类号： H01L27/00 , H01L27/146 , H01L31/00 , H01L31/0203 , H01L31/0232
CPC分类号： H01L27/14618 , H01L27/14625 , H01L31/0203 , H01L31/02325 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/16195 , H04N5/2257 , H01L2924/00014 , H01L2924/00
摘要： An image sensor module includes an image sensor, and a lens holder and a lens barrel on the image sensor. The image sensor includes plural lower metal sheets, plural upper metal sheets stacked on the lower metal sheets, and an encapsulant for encapsulating the lower and upper metal sheets, wherein the upper surfaces of the upper metal sheets are exposed from the encapsulant, the lower surfaces of the lower metal sheets are exposed from the encapsulant, and the encapsulant is formed with a frame layer around the upper surfaces of the upper metal sheets to define a chamber together with the upper metal sheets. The image sensor further includes a photosensitive chip arranged within the chamber, plural wires for electrically connecting the chip to the upper surfaces of the upper metal sheets, and a transparent layer arranged on the frame layer to cover the chip.
摘要翻译：图像传感器模块包括图像传感器，以及在图像传感器上的透镜保持器和镜筒。图像传感器包括多个下金属片，堆叠在下金属片上的多个上金属片，以及用于封装下金属片和上金属片的密封剂，其中上金属片的上表面从密封剂露出，下表面的下部金属片从密封剂露出，并且密封剂在上金属片的上表面周围形成有框架层，以与上金属片一起限定室。图像传感器还包括布置在腔室内的感光芯片，用于将芯片电连接到上金属片的上表面的多根电线以及布置在框架层上以覆盖芯片的透明层。

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