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    • 11. 发明申请
    • METHOD TO SCALE DOWN IC LAYOUT
    • 降低IC布局的方法
    • US20120110542A1
    • 2012-05-03
    • US13347711
    • 2012-01-11
    • Hsien-Chang Chang
    • Hsien-Chang Chang
    • G06F17/50
    • G06F17/5068
    • A method scales down an integrated circuit layout structure without substantially jeopardizing electronic characteristics of devices. First, a conductive line set includes a first conductive line and a second conductive line respectively passing through a first region and a second region. Second, a sizing-down operation is performed so that the first conductive line and the second conductive line respectively have a first region scaled-down line width, a first region scaled-down space and a first region scaled-down pitch in the first region as well as selectively have a second region original line width, a second region scaled-down space and a second region scaled-down pitch in the second region. The first region scaled-down line width and the second region original line width are substantially different from each other.
    • 一种方法可以缩小集成电路布局结构,而不会基本上危及设备的电子特性。 首先,导线组包括分别通过第一区域和第二区域的第一导线和第二导线。 其次,执行施胶操作,使得第一导电线和第二导线在第一区域中分别具有第一区域缩小线宽度,第一区域缩小空间和第一区域缩小间距 以及在第二区域中选择性地具有第二区域原始线宽度,第二区域缩小空间和第二区域缩小间距。 第一区域缩小线宽度和第二区域原始线宽度彼此大不相同。