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11. 发明授权

US5117100A Apparatus for and method of optical position detection 失效
标题翻译：光学位置检测装置及方法
公开(公告)号：US5117100A
公开(公告)日：1992-05-26
申请号：US634566
申请日：1990-12-27
申请人： Shigeo Yoshida , Isamu Fujimoto , Hideyuki Suzuki , Hiroshi Asano , Toru Hosaka , Takashi Onioh , Kojyu Nagasaki , Kenichi Matsuoka , Kazufumi Taura
发明人： Shigeo Yoshida , Isamu Fujimoto , Hideyuki Suzuki , Hiroshi Asano , Toru Hosaka , Takashi Onioh , Kojyu Nagasaki , Kenichi Matsuoka , Kazufumi Taura
IPC分类号： G01B11/00 , G01S5/16 , G01S7/48 , G01V8/20 , G06F3/042
CPC分类号： G01V8/20
摘要： The present optical position detection method and the apparatus therefor is adapted to compute an arithmetic mean of the adjusted light reception values received by adjacent photodetectors as the virtual light reception value at the virtual position, compare not only the adjusted light reception values of the respective photodetectors but also the virtual light reception values with the reference level and utilize the virtual position also as the light interruption position data when light interruption is determined, thus enhancing the accuracy of detecting the position of an object.
摘要翻译：本光学位置检测方法及其装置适用于计算由相邻光电检测器接收的调节光接收值的算术平均值作为虚拟位置处的虚拟光接收值，不仅比较各个光电探测器的调节光接收值而且具有参考电平的虚拟光接收值，并且当确定光中断时也将虚拟位置用作光中断位置数据，从而提高检测对象位置的准确性。

12. 发明授权

US09839132B2 Component-embedded substrate 有权
公开(公告)号：US09839132B2
公开(公告)日：2017-12-05
申请号：US13585920
申请日：2012-08-15
申请人： Masanori Fujidai , Isamu Fujimoto
发明人： Masanori Fujidai , Isamu Fujimoto
IPC分类号： H05K1/18 , H01L23/00 , H05K3/40
CPC分类号： H05K1/185 , H01L24/18 , H01L24/19 , H01L24/20 , H01L2224/04105 , H01L2224/2518 , H01L2224/73267 , H01L2924/01029 , H01L2924/01033 , H01L2924/01082 , H01L2924/014 , H01L2924/07802 , H01L2924/12042 , H01L2924/14 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19105 , H05K1/186 , H05K3/4046 , H05K2201/09509 , H05K2201/10242 , H05K2201/10416 , H05K2201/10636 , H05K2203/1469 , Y02P70/611 , H01L2924/00
摘要： In a component-embedded substrate, a component and wiring block units are embedded in a component-embedded layer; conductive layers are located on all surfaces of the wiring block units; the component and the wiring block units are arranged such that lower surface side conductive layers of the wiring block units and electrodes of the component contact lower surface side wiring layers; via-hole conductors are located in respective upper positions relative to upper surface side conductive layers of the wiring block units and the electrodes of the component; and upper surface side wiring layers of the component-embedded layer are thus electrically connected to upper surface side conductive layers of the wiring block units, and the electrodes of the component by the via-hole conductors.

13. 发明授权

US08027170B2 Substrate and electronic device using the same 有权
标题翻译：基板和电子设备使用相同
公开(公告)号：US08027170B2
公开(公告)日：2011-09-27
申请号：US12340965
申请日：2008-12-22
申请人： Kazuo Hattori , Isamu Fujimoto
发明人： Kazuo Hattori , Isamu Fujimoto
IPC分类号： H05K7/00
CPC分类号： H05K1/0231 , H01G4/35 , H05K1/113 , H05K2201/09627
摘要： An electronic device which includes a feedthrough capacitor mounted on a front surface of a substrate. A feedthrough electrode penetrates a laminate (body of the capacitor). External electrodes are electrically connected to opposite ends of the feedthrough electrode. A capacitor electrode is disposed to form capacity in cooperation with the feedthrough electrode. A wiring conductor is formed on a rear surface of the substrate or inside the substrate, and via-hole conductors are connected to the wiring conductor. The feedthrough electrode and the external electrodes constitute a first current path. The wiring conductor and the via-hole conductors constitute a second current path electrically connected in parallel to the first current path.
摘要翻译：一种电子装置，其包括安装在基板的前表面上的穿通电容器。穿通电极穿透层压体（电容器体）。外部电极电连接到馈通电极的相对端。配置电容器电极以与馈通电极协作形成容量。布线导体形成在基板的背面或基板的内部，通孔导体与布线导体连接。馈通电极和外部电极构成第一电流路径。布线导体和通孔导体构成与第一电流路并联电连接的第二电流路径。

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