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    • 16. 发明公开
    • LASER-BASED MATERIAL PROCESSING METHODS AND SYSTEMS
    • VERFAHREN UND SYSTEME ZUR VERARBEITUNG EINES材料AUF LASERBASIS
    • EP2252426A1
    • 2010-11-24
    • EP09721791.3
    • 2009-03-17
    • Imra America, Inc.
    • SHAH, LawrenceCHO, Gyu, CheonXU, Jingzhou
    • B23K26/06B23K26/38
    • H01L21/268B23K26/0624B23K26/064B23K26/0643B23K26/0648B23K26/082B23K26/083B23K26/364B23K26/38B23K26/40B23K2201/40B23K2203/50
    • Various embodiments may be used for laser-based modification of target material of a workpiece while advantageously achieving improvements in processing throughput and/or quality. Embodiments of a method of processing may include focusing and directing laser pulses to a region of the workpiece at a pulse repetition rate sufficiently high so that material is efficiently removed from the region and a quantity of unwanted material within the region, proximate to the region, or both is reduced relative to a quantity obtainable at a lower repetition rate In at least one embodiment, an ultrashort pulse laser system may include at least one of a fiber amplifier or fiber laser. Various embodiments are suitable for at least one of dicing, cutting, scribing, and forming features on or within a semiconductor substrate. Workpiece materials may also include metals, inorganic or organic dielectrics, or any material to be micromachined with femtosecond and/or picosecond pulses, and in some embodiments with pulse widths up to a few nanoseconds.
    • 各种实施例可以用于对工件的目标材料的基于激光的修改,同时有利地实现处理生产量和/或质量的改善。 处理方法的实施例可以包括将激光脉冲聚焦并以足够高的脉冲重复频率将激光脉冲引导到工件的区域,使得材料从该区域有效地移除,并且在区域内靠近该区域的一些不需要的材料, 或者两者相对于以较低重复率可获得的量减少。 超短脉冲激光系统的实施例可以包括光纤放大器或光纤激光器。 各种实施例适合于在半导体衬底上或半导体衬底内的切割,切割,划线和形成特征中的至少一个。 工件材料可以包括金属,无机或有机电介质,或者用飞秒,皮秒和/或纳秒脉冲微加工的任何材料。