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11. 发明授权

US07071032B2 Material to improve image sensor yield during wafer sawing 失效
标题翻译：材料可以提高晶圆锯切时的图像传感器产量
公开(公告)号：US07071032B2
公开(公告)日：2006-07-04
申请号：US10431275
申请日：2003-05-07
申请人： Hung-Jen Hsu , Yu-Kung Hsiao , Chih-Kung Chang , Sheng-Liang Pan , Fu-Tien Weng
发明人： Hung-Jen Hsu , Yu-Kung Hsiao , Chih-Kung Chang , Sheng-Liang Pan , Fu-Tien Weng
IPC分类号： H01L21/44 , H01L21/48 , H01L21/50
CPC分类号： H01L21/6836 , H01L21/78 , H01L27/14683 , H01L2221/68327
摘要： A new method is provided of treating the wafer prior to the process of singulating the wafer into individual die. A first surface of the wafer over which CMOS image sensor devices have been created is coated with a layer of material that is non-soluble in water. The wafer is attached to a tape by bringing a second surface of the wafer in contact with the tape. The wafer is singulated by approaching the first surface of the wafer and by sawing first through the layer of material that has been coated over the first surface of the wafer and by then sawing through the wafer, stopping at the surface of the tape. A thorough water rinse is applied to the surface of the singulated wafer, followed by a wafer clean applying specific chemicals for this purpose. The singulated die is now removed from the tape and further processed by applying steps of die mount, wire bonding, surrounding the die in a mold compound and marking the package.
摘要翻译：提供了一种新的方法，在将晶片分离成单独的芯片的过程之前处理晶片。已经在其上形成CMOS图像传感器装置的晶片的第一表面涂覆有不溶于水的材料层。通过使晶片的第二表面与带接触而将晶片附接到带。通过接近晶片的第一表面并通过首先穿过已经涂覆在晶片的第一表面上的材料层，然后通过晶片锯切，停止在带的表面，将晶片分离。将彻底的水冲洗施加到单片晶片的表面，接着进行晶片清洁以应用特定的化学品用于此目的。单片模具现在从胶带中取出并通过将模具安装，引线接合，将模具包围在模具化合物中并标记包装件的步骤进一步处理。

12. 发明授权

US06964916B2 Image sensor fabrication method and structure 失效
标题翻译：图像传感器制造方法和结构
公开(公告)号：US06964916B2
公开(公告)日：2005-11-15
申请号：US10781217
申请日：2004-02-17
申请人： Chin Chen Kuo , Chih-Kung Chang , Hung-Jen Hsu , Fu-Tien Weng , Te-Fu Tseng
发明人： Chin Chen Kuo , Chih-Kung Chang , Hung-Jen Hsu , Fu-Tien Weng , Te-Fu Tseng
IPC分类号： H01L21/46 , H01L21/78 , H01L27/146 , H01L29/768
CPC分类号： H01L27/14621 , H01L27/14625 , H01L27/14685
摘要： A method for processing a semiconductor substrate includes providing a substrate having at least one filter region with a plurality of bond pads in it. Metal is deposited above the bond pads, to reduce the bond pad step height. A planarization layer is formed such that the deposited metal has a height near to a height of the planarization layer. At least one color resist layer is formed above the planarization layer.
摘要翻译：一种用于处理半导体衬底的方法包括提供具有至少一个过滤器区域的衬底，其中具有多个焊盘。金属沉积在接合焊盘上方，以减少焊盘台阶高度。形成平坦化层，使得沉积的金属具有接近平坦化层的高度的高度。在平坦化层上方形成至少一层耐光层。

13. 发明申请

US20050242271A1 Effective method to improve sub-micron color filter sensitivity 有权
标题翻译：提高亚微米滤色片灵敏度的有效方法
公开(公告)号：US20050242271A1
公开(公告)日：2005-11-03
申请号：US10833565
申请日：2004-04-28
申请人： Fu-Tien Weng , Yu-Kung Hsiao , Chin-Kung Chang , Hung-Jen Hsu , Yi-Ming Dai , Chin-Chen Kuo
发明人： Fu-Tien Weng , Yu-Kung Hsiao , Chin-Kung Chang , Hung-Jen Hsu , Yi-Ming Dai , Chin-Chen Kuo
IPC分类号： H01L27/00 , H01L27/146 , H01L31/00 , H01L31/0216 , H01L31/0232
CPC分类号： H01L27/14685 , H01L27/14621 , H01L27/14623 , H01L27/14625 , H01L27/14627
摘要： An image sensor device and method for forming said device are described. The image sensor structure comprises a substrate with photodiodes, an interconnect structure formed on the substrate, a color filter layer above the interconnect structure, a first microlens array, an overcoat layer, and a second microlens array. A key feature is that a second microlens has a larger radius of curvature than a first microlens. Additionally, each first microlens and second microlens is a flat convex lens. Thus, a thicker second microlens with a short focal length is aligned above a thinner first microlens having a long focal length. A light column that includes a first microlens, a second microlens and a color filter region is formed above each photodiode. A second embodiment involves replacing a second microlens in each light column with a plurality of smaller second microlenses that focus light onto a first microlens.
摘要翻译：描述了用于形成所述装置的图像传感器装置和方法。图像传感器结构包括具有光电二极管的衬底，形成在衬底上的互连结构，在互连结构上方的滤色器层，第一微透镜阵列，外涂层和第二微透镜阵列。一个关键特征是第二微透镜具有比第一微透镜更大的曲率半径。另外，每个第一微透镜和第二微透镜是平凸透镜。因此，具有短焦距的较厚的第二微透镜在具有长焦距的较薄的第一微透镜上对准。在每个光电二极管上方形成包括第一微透镜，第二微透镜和滤色器区域的光柱。第二实施例涉及用多个将光聚焦到第一微透镜上的多个较小的第二微透镜替换每个光柱中的第二微透镜。

14. 发明授权

US07507598B2 Image sensor fabrication method and structure 有权
标题翻译：图像传感器制造方法和结构
公开(公告)号：US07507598B2
公开(公告)日：2009-03-24
申请号：US11156794
申请日：2005-06-20
申请人： Fu-Tien Weng , Yu-Kung Hsiao , Hung-Jen Hsu , Yi-Ming Dai , Chin Chen Kuo , Te-Fu Tseng , Chih-Kung Chang , Jack Deng , Chung-Sheng Hsiung , Bii-Junq Chang
发明人： Fu-Tien Weng , Yu-Kung Hsiao , Hung-Jen Hsu , Yi-Ming Dai , Chin Chen Kuo , Te-Fu Tseng , Chih-Kung Chang , Jack Deng , Chung-Sheng Hsiung , Bii-Junq Chang
IPC分类号： H01L21/00
CPC分类号： H01L27/14625 , H01L23/544 , H01L27/14621 , H01L27/14627 , H01L27/14685 , H01L2223/54453 , H01L2924/0002 , H01L2924/00
摘要： A method is provided for processing a substrate. The substrate has at least one filter region, a plurality of bond pads, and a plurality of scribe lines arranged around the filter region and bond pads. A first planarization layer is formed above the substrate. The planarization layer has a substantially flat top surface overlying the filter region, the bond pads and the scribe lines. At least one color resist layer is formed over the first planarization layer and within the filter region while the first planarization layer covers the bond pads and the scribe lines.
摘要翻译：提供了一种处理衬底的方法。衬底具有至少一个滤波器区域，多个接合焊盘以及围绕滤波器区域和接合焊盘布置的多个划线。在衬底上形成第一平坦化层。平坦化层具有覆盖过滤器区域，接合焊盘和划线的基本平坦的顶表面。在第一平坦化层和滤波器区域内形成至少一个抗蚀剂层，同时第一平坦化层覆盖接合焊盘和划线。

15. 发明申请

US20070015305A1 Semiconductor device with micro-lens and method of making the same 有权
标题翻译：具有微透镜的半导体器件及其制造方法
公开(公告)号：US20070015305A1
公开(公告)日：2007-01-18
申请号：US11181189
申请日：2005-07-13
申请人： Jeng-Shyan Lin , Chien-Hsien Tseng , Shou-Gwo Wuu , Ho-Ching Chien , Dun-Nian Yaung , Hung-Jen Hsu
发明人： Jeng-Shyan Lin , Chien-Hsien Tseng , Shou-Gwo Wuu , Ho-Ching Chien , Dun-Nian Yaung , Hung-Jen Hsu
IPC分类号： H01L21/00
CPC分类号： H01L27/14685 , H01L27/14623 , H01L27/14627 , H01L27/14632
摘要： A semiconductor device including a semiconductor substrate having a photosensor formed therein; a first layer overlying the substrate, the first layer includes a portion having a generally concave shaped surface being the negative shaped of a micro-lens to be formed there over; a second layer overlying the first layer, the second layer including a generally convex shaped portion vertically aligned with and mating with the generally concave shaped surface, the generally convex shaped portion being constructed and arranged to define a micro-lens positioned to cause parallel light passing through the micro-lens to converge on and strike the photosensor.
摘要翻译：一种半导体器件，包括其中形成有光电传感器的半导体衬底; 覆盖衬底的第一层，第一层包括具有大致凹形形状的表面的部分，其为在其上形成的微透镜的负形状; 覆盖第一层的第二层，第二层包括垂直对准并与大致凹形的表面配合的大致凸形的部分，大体上凸形的部分被构造和布置以限定微透镜，定位成使得平行光通过通过微透镜收敛并撞击光电传感器。

16. 发明授权

US07372497B2 Effective method to improve sub-micron color filter sensitivity 有权
标题翻译：提高亚微米滤色片灵敏度的有效方法
公开(公告)号：US07372497B2
公开(公告)日：2008-05-13
申请号：US10833565
申请日：2004-04-28
申请人： Fu-Tien Weng , Yu-Kung Hsiao , Chin-Kung Chang , Hung-Jen Hsu , Yi-Ming Dai , Chin-Chen Kuo
发明人： Fu-Tien Weng , Yu-Kung Hsiao , Chin-Kung Chang , Hung-Jen Hsu , Yi-Ming Dai , Chin-Chen Kuo
IPC分类号： H04N5/225
CPC分类号： H01L27/14685 , H01L27/14621 , H01L27/14623 , H01L27/14625 , H01L27/14627
摘要： An image sensor device and method for forming said device are described. The image sensor structure comprises a substrate with photodiodes, an interconnect structure formed on the substrate, a color filter layer above the interconnect structure, a first microlens array, an overcoat layer, and a second microlens array. A key feature is that a second microlens has a larger radius of curvature than a first microlens. Additionally, each first microlens and second microlens is a flat convex lens. Thus, a thicker second microlens with a short focal length is aligned above a thinner first microlens having a long focal length. A light column that includes a first microlens, a second microlens and a color filter region is formed above each photodiode. A second embodiment involves replacing a second microlens in each light column with a plurality of smaller second microlenses that focus light onto a first microlens.
摘要翻译：描述了用于形成所述装置的图像传感器装置和方法。图像传感器结构包括具有光电二极管的衬底，形成在衬底上的互连结构，在互连结构上方的滤色器层，第一微透镜阵列，外涂层和第二微透镜阵列。一个关键特征是第二微透镜具有比第一微透镜更大的曲率半径。另外，每个第一微透镜和第二微透镜是平凸透镜。因此，具有短焦距的较厚的第二微透镜在具有长焦距的较薄的第一微透镜上对准。在每个光电二极管上方形成包括第一微透镜，第二微透镜和滤色器区域的光柱。第二实施例涉及用多个将光聚焦到第一微透镜上的多个较小的第二微透镜替换每个光柱中的第二微透镜。

17. 发明授权

US06956253B2 Color filter with resist material in scribe lines 失效
标题翻译：带有刻痕线的抗蚀剂材料的滤色片
公开(公告)号：US06956253B2
公开(公告)日：2005-10-18
申请号：US10456759
申请日：2003-06-06
申请人： Fu-Tien Weng , Yu-Kung Hsiao , Hung-Jen Hsu , Yi-Ming Dai , Chin-Chen Kuo , Te-Fu Tseng
发明人： Fu-Tien Weng , Yu-Kung Hsiao , Hung-Jen Hsu , Yi-Ming Dai , Chin-Chen Kuo , Te-Fu Tseng
IPC分类号： H01L21/46 , H01L21/78 , H01L27/146 , H01L29/768
CPC分类号： H01L27/14625 , H01L27/14621 , H01L27/14685
摘要： A color filter includes a substrate having a plurality of scribe lines arranged to form at least one filter region surrounded by the scribe lines. The scribe lines are at least partially filled with a resist material. At least one color resist layer is formed above the substrate within the at least one filter region.
摘要翻译：滤色器包括具有布置成形成由划线包围的至少一个滤光片区域的多个划线的基板。划痕线至少部分地被抗蚀剂材料填充。在至少一个过滤器区域内的衬底上方形成至少一个着色抗蚀剂层。

18. 发明授权

US06878642B1 Method to improve passivation openings by reflow of photoresist to eliminate tape residue 失效
标题翻译：通过光刻胶回流来改善钝化开口以消除胶带残留的方法
公开(公告)号：US06878642B1
公开(公告)日：2005-04-12
申请号：US09679514
申请日：2000-10-06
申请人： Hung-Jen Hsu , Yu-Kung Hsiao , Chih-Kung Chang , Sheng-Liang Pan , Kuo-Liang Lu
发明人： Hung-Jen Hsu , Yu-Kung Hsiao , Chih-Kung Chang , Sheng-Liang Pan , Kuo-Liang Lu
IPC分类号： H01L21/311 , H01L21/31
CPC分类号： H01L21/31116 , H01L23/3171 , H01L2224/11472
摘要： A new method to form passivation openings in the manufacture of an integrated circuit device is achieved. The passivation openings have gradually sloping sidewalls that allow a protective tape to be completely removed without leaving adhesive residue. A semiconductor substrate is provided. A passivation layer is deposited. An organic photoresist layer is deposited overlying the passivation layer. The organic photoresist layer is patterned to expose the passivation layer in areas where passivation openings are planned. The organic photoresist layer is reflowed to create gradually sloping sidewalls on the organic photoresist layer. The passivation layer is etched through to from the passivation openings. The passivation openings are thereby formed with gradually sloping sidewalls. The organic photoresist layer is stripped away. A protective tape is applied overlying the passivation layer and the passivation openings. The protective tape is removed. The gradually sloping sidewalls on the passivation openings allow the protective tape to be completely removed without leaving adhesive residue in the manufacture of the integrated circuit device.
摘要翻译：实现了在制造集成电路器件中形成钝化开口的新方法。钝化开口具有逐渐倾斜的侧壁，其允许完全去除保护带而不留下粘合剂残留物。提供半导体衬底。沉积钝化层。沉积在钝化层上的有机光致抗蚀剂层。有机光致抗蚀剂层被图案化以在钝化开口被计划的区域中露出钝化层。有机光致抗蚀剂层被回流以在有机光致抗蚀剂层上产生逐渐倾斜的侧壁。从钝化开口蚀刻钝化层。因此钝化开口由逐渐倾斜的侧壁形成。剥离有机光致抗蚀剂层。施加保护带覆盖钝化层和钝化开口。取下保护胶带。钝化开口上逐渐倾斜的侧壁允许保护带被完全去除，而不会在集成电路器件的制造中留下残留粘合剂。

19. 发明授权

US06861207B2 Method for fabricating microlens with lithographic process 失效
标题翻译：用光刻工艺制造微透镜的方法
公开(公告)号：US06861207B2
公开(公告)日：2005-03-01
申请号：US10611645
申请日：2003-06-30
申请人： Hung-Jen Hsu , Chih-Kung Chang , Fu-Tien Weng , Te-Fu Tseng , Chin-Chen Kuo , Chiung-Yuan Chang
发明人： Hung-Jen Hsu , Chih-Kung Chang , Fu-Tien Weng , Te-Fu Tseng , Chin-Chen Kuo , Chiung-Yuan Chang
IPC分类号： G02B3/00 , H01L27/14
CPC分类号： G02B5/201 , G02B3/0018 , G02B3/0056 , H01L27/14685
摘要： A method of fabricating microlens devices. The method includes filling the bond pad areas and scribe lines, or other areas, to improve the topography of the semiconductor wafer surface. A microlens material is applied to the surface after the bond pad areas and scribe lines have been filled. Because of the improved topography, the thickness of the microlens material is more uniform, thereby facilitating the formation of uniformly shaped microlenses.
摘要翻译：一种制造微透镜器件的方法。该方法包括填充接合焊盘区域和划线或其它区域，以改善半导体晶片表面的形貌。在填充接合焊盘区域和划线之后，将微透镜材料施加到表面。由于形貌改善，微透镜材料的厚度更均匀，从而有助于形成均匀成形的微透镜。

20. 发明授权

US06759276B1 Material to improve CMOS image sensor yield during wafer sawing 有权
标题翻译：在晶圆锯切期间提高CMOS图像传感器产量的材料
公开(公告)号：US06759276B1
公开(公告)日：2004-07-06
申请号：US10209149
申请日：2002-07-30
申请人： Hung-Jen Hsu , Yu-Kung Hsiao , Chih-Kung Chang , Sheng-Liang Pan
发明人： Hung-Jen Hsu , Yu-Kung Hsiao , Chih-Kung Chang , Sheng-Liang Pan
IPC分类号： H01L2144
CPC分类号： H01L27/14632 , H01L27/14627 , H01L27/14687
摘要： A new method is provided of treating the wafer prior to the process of singulating the wafer into individual die. A surface of the wafer over which CMOS image sensor devices have been created is coated with a layer of material that is non-soluble in water. The wafer is singulated by sawing through the layer of material that has been coated over the surface of the wafer and by then sawing through the wafer. The singulated die is then further processed by applying steps of die mount, wire bonding, surrounding the die in a mold compound and marking the package.
摘要翻译：提供了一种新的方法，在将晶片分离成单独的芯片的过程之前处理晶片。已经在其上形成CMOS图像传感器装置的晶片的表面涂覆有不溶于水的材料层。通过锯切已经涂覆在晶片表面上的材料层，然后通过晶片锯切将晶片分割。然后通过将模具安装，引线接合，将模具包围在模具化合物中并标记包装件的步骤进一步处理单模模具。

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