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    • 13. 发明专利
    • Heaping method of molecular ray
    • 分子辐射的复合方法
    • JPS60194065A
    • 1985-10-02
    • JP23491584
    • 1984-11-09
    • Hitachi Ltd
    • SHIMADA JIYUICHIKATAYAMA YOSHIFUMIKANEHISA OSAMUMANABE TOSHIKATSU
    • C23C14/24C23C16/513
    • C23C16/513
    • PURPOSE:To enable free selection of heaping conditions by separating a ray source part and a heaping part to independent atmospheres, feeding the molecular rays of the activated gaseous raw materials to a substrate and heaping the molecular rays on the substrate. CONSTITUTION:A gas such as Si-H4, Si-F4 or the like is introduced into an activating chamber 3 for a main raw material, by which the gas is activated or converted to plasma. A gas such as H2, F2 or the like is introduced into an activating chamber 4 for an auxiliary raw material, by which said gas is activated or converted to plasma. An impurity gas such as B2H5, PH3 or the like is introduced into an activating chamber 5 for an impurity, by which the gas is activated or converted to plasma. The inside of the chambers 3, 4, 5 is evacuated to a vacuum by evacuating parts 7, 7', 7''. Electric fields are impressed to the chambers 3, 4, 5 by electrodes 8, 9, 10. The respective activated raw materials are fed to a material heaping part 2 to heap the molecular rays of the gaseous raw materials on a substrate 6, thereby yielding a material such as amorphous silicon. The part 2 is maintained in a high vacuum by the differential evacuation with respect to the chambers 3, 4, 5 and the substrate temp. therein is independently set. The conditions for forming the thin film are thus changed over a wide range.
    • 目的:为了通过将射线源部分和堆叠部分分离成独立的气氛来实现堆叠条件的自由选择,将激活的气态原料的分子射线输送到基底上并且堆叠在基底上的分子射线。 构成:将诸如Si-H4,Si-F4等的气体引入用于主要原料的活化室3中,由此气体被激活或转化为等离子体。 将诸如H 2,F 2等的气体引入用于辅助原料的活化室4中,所述气体被激活或转化为等离子体。 将诸如B2H5,PH3等的杂质气体引入用于杂质的活化室5中,由此气体被激活或转化成等离子体。 通过抽空部件7,7',7“将腔室3,4,5的内部抽真空。 电场通过电极8,9,10向腔室3,4,5施加电压。各自的活化原料被输送到材料堆叠部分2以将气态原料的分子射线堆积在基底6上,由此产生 诸如非晶硅的材料。 通过相对于腔室3,4,5的不同抽气和衬底温度将部件2保持在高真空中。 其中独立设置。 因此,形成薄膜的条件因此在宽范围内变化。